A unit cell alignment apparatus that includes a base member, on the upper surface of which unit cells constituting an electrode assembly are stacked parallel thereto, a first guide member located at one side of the base member, the first guide member being disposed so as to be perpendicular to the upper surface of the base member, a second guide member located at the base member, the second guide member being disposed so as to be perpendicular to the upper surface of the base member while being at right angles to the first guide member, and an inclination adjustment member configured to adjust the inclination of the base member.

A resin molding apparatus including a release film feeder configured to feed a release film is provided. The release film feeder including a feeding roller around which the release film is wound, a gripper configured to grip an end portion of the release film fed from the feeding roller, a support table configured to support the release film fed by a horizontal movement of the gripper in an X direction, the support table configured to horizontally move at least one of in the X direction or in a Y direction perpendicular to the X direction, the X and Y directions defining a surface parallel to a surface of the support table, and a position detecting sensor on the support table and configured to detect position information of the release film may be provided.

A semiconductor wafer is as wide as the industry standard width A (presently 156 mm+/−1 mm) and is longer than the industry standard A by at least 1 mm and as much as the standard equipment can reasonably accommodate, presently approximately 3-20 mm and potentially longer, thus, gaining significant additional surface area for sunlight absorption. Modules may be composed of a plurality of such larger wafers. Such wafers can be processed in conventional processing equipment that has a wafer retaining portion of industry standard size A and a configuration that also accommodates a wafer with a perpendicular second edge longer than A by at least 1 and typically 3-20 mm. Wet bench carriers and transport and inspection stations can be so used.

A semiconductor fabrication facility including raceways on a ceiling of a structural construction and extending in one direction, a vehicle rail assembly coupled to the raceways, outer jig rails on outer sidewalls of the raceways and adjacent to the vehicle rail assembly, and an outer jig on the outer jig rails and configured to allow the vehicle rail assembly to move along the outer jig rails may be provided.

In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.

Provided is a transport robot and a substrate treating apparatus including the transport robot. The substrate treating apparatus includes a transport chamber having a long shape on one side, and for providing a moving space of a substrate, a load lock chamber connected to the transport chamber to provide an exchange space between the transport chamber and a substrate before a process or a substrate after a process, a process unit connected to the transport chamber to perform a process for a substrate transferred from the transport chamber, a track provided in the transport chamber to provide a moving path of a substrate, and a transport robot capable of moving along the track in a non-contact manner, and entering or exiting the load lock chamber to perform a substrate exchange between the load lock chamber and the transport chamber.

A dynamic routing method and apparatus for an Overhead Hoist Transport (OHT) system are disclosed. The present disclosure in some embodiments provides a dynamic routing method for an OHT system, including generating a Q table of records of at least one Q value which is a time for a vehicle to move through an edge between two adjacent nodes to a node other than the two adjacent nodes, measuring a transit time of the vehicle when assigned a destination node and passing a transit edge between a current node and next node, extracting target edges to be updated according to the transit time from a plurality of edges, and differentially updating Q values for the target edges according to distances to the transit edge partially based on the transit time, the Q values for the target edges being time values for the vehicle to move through the target edges to the destination node.

The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an IC chip placement unit configured to place an IC chip on a photo-curable adhesive that is located on a reference position of each antenna in the antenna continuous body; and a light irradiator configured to irradiate, with light, the adhesive of each antenna of the antenna continuous body that is conveyed by the conveyor, wherein the light irradiator is configured to irradiate the adhesive of each antenna with the light, while the IC chip on the adhesive is pressed to the antenna.

A cassette with embedded temperature sensors that is disposed within a load lock is disclosed. The temperature sensors may be disposed in a plurality of shelves of the load lock cassette to monitor the temperature of each of a plurality of workpieces disposed in the load lock. The output of these temperature sensors may be provided to a controller, which controls when the load lock is opened. The load lock cassette may also include cooling channels to accelerate the cooling of the workpieces to improve throughput. The cooling may be controlled using closed loop control, where a controller monitors the temperature of the workpieces during the cooling operation.

A rotational indexer rotatable to move semiconductor wafers or other items between various stations arranged in a circular array. The items being moved may be supported by arms of the indexer during such movement. The rotational indexer may be further configured to also cause the items being moved to rotate about other rotational axes to cause rotation of the items relative to the arms supporting them.