A method of transporting a plurality of sheet-like members containing a magnetic material includes a first step of placing one of the members on an endless belt, and a second step of releasing the member from a portion of the endless belt which is moved and folded back along a roller. The endless belt includes a first magnetic force generating portion that generates first magnetic force, and a second magnetic force generating portion that generates second magnetic force that is stronger than the first magnetic force. In the first step, the member is placed on the belt, such that a first portion of the member containing the magnetic material is located in the first magnetic force generating portion, and a second portion of the member containing the magnetic material and located rearward of the first portion in a conveying direction is located in the second magnetic force generating portion.

A conveyor system is configured to transport the electronic substrates through the cleaning modules of a cleaning apparatus. The conveyor system includes a first outer frame member, a second outer frame member spaced from the first outer frame member, a bottom belt disposed between the first outer frame member and the second outer frame member, and a top belt spaced from the bottom belt. The bottom belt and the top belt are configured to receive a product carrier therebetween to transport electronic substrates along the conveyor system and through the cleaning modules. The conveyor system further includes a plurality of roller assemblies, with at least one roller assembly being coupled to the first outer frame member and at least one roller assembly being coupled to the second outer frame member. Each roller assembly is configured to apply a force on the top belt or the bottom belt.

A wafer dividing apparatus for dividing a wafer stuck to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line is provided. The wafer dividing apparatus includes a cassette table movable upwardly and downwardly in a Z axis direction, a first carry-out/in unit that carries out the frame from the cassette placed on the cassette table or carry in the frame to the cassette, a first temporary receiving unit including a pair of first guide rails extending in the X axis direction and a guide rail opening/closing portion that increases the distance between the pair of first guide rails, a reversing unit including a holding portion that holds the frame and rotates by 180 degrees to reverse the front and back of the frame, and a transport unit that moves the reversed frame.

A method for treating the underside of a planar substrate with a treatment medium includes hydrophobizing the underside of the substrate, subsequently forming a protective liquid film on a top side of the substrate and then bringing the treatment medium into contact with the underside of the substrate. In the process, the protective liquid film protects the upper side of the substrate from any action or effect of the treatment medium and/or outgassing. A device for carrying out the method is also provided.

A board conveyance device and conveyance belt inspection method that enable easy detection of a problem with conveyance belts. The board conveyance device includes: endless conveyance belts on which is set a conveyance path for conveying a board; a board sensor configured to detect the presence of the board at a specified detection position on the conveyance path; and a control section configured to, in a case in which the board is not being conveyed on the conveyance path, move the conveyance belts and determine a problem with the conveyance belts based on a detection result of the board sensor.

A hand unit of a robot arm includes a U-shaped placement portion on which a semiconductor wafer is placed. The hand unit includes, on one end side of the placement portion, a first support portion configured to support the semiconductor wafer at a first support height and a second support portion configured to support the semiconductor wafer at a second support height, and includes, on the other end side of the placement portion, a third support portion configured to support the semiconductor wafer at the first support height and a fourth support portion configured to support the semiconductor wafer at the second support height. The hand unit further includes a first driving unit configured to move the third support portion and/or the fourth support portion forward and backward with respect to the first support portion and the second support portion.

A system for conveying a substrate includes a noncontact support platform for supporting the substrate. A vacuum wheel is located adjacent to the support platform. A rim of the vacuum wheel includes perforations that open between an exterior of the rim and an interior of the vacuum wheel. A fixed suction surface is interior to the vacuum wheel and includes an opening of a conduit that is connectable to a suction source. A chamber is formed by the suction surface, walls of the vacuum wheel, and a section of the peripheral rim that is adjacent to the suction surface and that extends outward from the support platform. When suction is applied to the conduit, the suction is applied via the chamber to the perforations in the rim section so as to exert a pull on the substrate toward the rim such that rotation of the vacuum wheel conveys the substrate.

The present disclosure discloses a film-forming device belongs to the field of film forming technology comprising: a film-forming chamber configured to form a film on a substrate disposed inside the film-forming chamber; a transfer assembly configured to transport a shielding plate into the film-forming chamber along a conveying path, move the shielding plate to a first position, and remove the shielding plate from the film-forming chamber along the conveying path; and a cleaning assembly disposed at the conveying path outside the film-forming chamber for cleaning the shielding plate removed from the film-forming chamber.

A traveling vehicle system includes a track and a ceiling traveling vehicle. The track includes a first track, a second track, and a connection track. The ceiling traveling vehicle includes a direction changer that turns a coupler, which couples a traveling wheel and a main body to each other and passes through a gap D-between the first track or the second track and the connection track. A guider is provided in the coupler, moves along a first guide surface in a first state in which the traveling wheel rolls on the first track, and moves along a second guide surface in a second state in which the traveling wheel rolls on the second track.

A controller performs a stop control if a first detector detects that an article transport vehicle traveling in a first path entered a managed area, and a second detector or a third detector detects that another article transport vehicle exists in a selected path. And the controller performs a travel control if the first detector detects that an article transport vehicle traveling in a first path entered the managed area, and presence of another article transport vehicle is not detected in the selected path by the second detector or the third detector.