A mask arrangement for masking a substrate in a processing chamber is provided. The mask arrangement includes a mask frame having one or more frame elements and is configured to support a mask device, wherein the mask device is connectable to the mask frame; and at least one actuator connectable to at least one frame element of the one or more frame elements, wherein the at least one actuator is configured to apply a force to the at least one frame element.

Disclosed in this invention is a wafer processing apparatus and method for pre-alignment and edge exposure of a wafer. The wafer processing apparatus includes a pre-alignment module, an edge exposure module, a motion module, a control module and a rotary table. The motion module includes a rotation module, a lifting module and a translation module, which are disposed and interconnected above one another. The rotation module is connected at the top to the rotary table and is configured to drive the rotary table to rotate together with the wafer. The lifting module is configured to drive the rotation module and the rotary table to move vertically. The translation module is configured to drive the lifting module and the rotation module to move horizontally. The pre-alignment module and the edge exposure module are positioned in correspondence to opposing sides of the wafer. The invention reduces the number of objects to be controlled as well as the complexity in control and system structure. Additionally, it simplifies the pre-alignment operation and reduces equipment cost.

One object of this application is to provide an advanced substrate holder including a clamper. A substrate holder holds a substrate by interposing the substrate between frames. The substrate holder includes a front frame, a rear frame, and one or a plurality of clampers. Each of the clampers includes a hook portion including a hook base and a hook main body, and a plate including at least one claw. At least one of the clampers includes the plate including a first claw for a lock and a second claw for a semi-lock.

A tray carrier includes a base plate having a first and second pairs of opposed sides as well as opposed first and second surfaces. Channel-shaped corner members provide containment formations for trays stacked at the first surface of the base plate. Tray carrier gripping cavities provided in the first pair of opposed sides can be engaged by gripping formations of an automated gripper to facilitate gripping the tray carrier. Raised portions at the first surface of the base plate provide a tray-gripping space engaged by gripping formations of the automated gripper to facilitate gripping trays stacked at the first surface of the base plate. Handle members at the second sides of the base plate facilitate manual handling of the tray carrier, and a pair of opposed recesses in the first sides of the base plate provide a narrowed intermediate portion of the base plate for manual handling of trays.

A tower lift includes a main frame, a first carriage module and a second carriage module connected with each other inside the main frame at left and right sides of the main frame, respectively, having the same weight as each other, and configured to be moved in a vertical direction, and a driving module installed on the main frame and configured to move the first carriage module and the second carriage module in the vertical direction.

The present invention provides various aspects of support for a fabrication facility capable of routine placement and replacement of processing tools in at least a vertical dimension relative to each other.

A fab can be constructed as a round or rectangular annular tube with a primary cleanspace located in-between its inner and outer tubes. The fab can be encircled with levels upon which tools can be densely packed while preserving unidirectional air flow. If only tool ports are inside, and robotics are used, primary cleanspace size can be minimized. Highly simplified robotics can be used. Tools can be removed and repaired centrally. A secondary cleanspace can be added for tool bodies. Multilevel construction enhances use of prefabricated units for fab build or maintenance. Curves or folds, applied to a conventional planar cleanroom, can construct a wide range of fab geometries, including a tubular non-annular fab. A fab can also be constructed according to a curved or non-curved sectional cut of an annular tube. A novel fab, of a non-curved section, can include a non-segmented cleanspace or have its tools vertically stacked.

A hand unit of a robot arm includes a U-shaped placement portion on which a semiconductor wafer is placed. The hand unit includes, on one end side of the placement portion, a first support portion configured to support the semiconductor wafer at a first support height and a second support portion configured to support the semiconductor wafer at a second support height, and includes, on the other end side of the placement portion, a third support portion configured to support the semiconductor wafer at the first support height and a fourth support portion configured to support the semiconductor wafer at the second support height. The hand unit further includes a first driving unit configured to move the third support portion and/or the fourth support portion forward and backward with respect to the first support portion and the second support portion.

A wafer transfer system can include a wafer gripper for picking and placing semiconductor devices. In an embodiment, the wafer gripper can include a first portion, a second portion and a laminate between the first and second portion. In one embodiment, the first portion can comprise glass or tempered glass, where the first portion having at least one vacuum hole and is configured to receive the semiconductor device. In an embodiment, the second portion can include glass or tempered glass, the second portion having configured to use low air pressure from a closed vacuum to vacuum a wafer. In an embodiment, the laminate can bond the first portion to the second portion.

A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.