A device for manipulating at least a first row of wafers and a second row of wafers, includes: a first holder configured to hold the first row of wafers, the first holder having a first rod and a second rod, the first rod and the second rod of the first holder defining a space therebetween for accommodating the first row of wafers, wherein a distance between the first rod and the second rod of the first holder is variable; and a second holder configured to hold the second row of wafers, the second holder having a first rod and a second rod, the first rod and the second rod of the second holder defining a space therebetween for accommodating the second row of wafers, wherein a distance between the first rod and the second rod of the second holder is variable.

The present invention provides a technology capable of inhibiting, in a vacuum processing apparatus that conveys a plurality of substrate holders along a conveying path formed to have a projected shape on a vertical surface, the projected shape being a continuous ring shape, dust from being generated during conveyance of a substrate holder. The present invention includes, in a vacuum chamber 2, an anti-sag member 35 assembled to a first drive unit 36 provided on an outer side with respect to a conveying direction of the conveying path, the vacuum chamber 2 including a conveying path formed to have a projected shape on the vertical surface, the projected shape being a continuous ring shape, a single vacuum atmosphere being formed in the vacuum chamber 2. A travel roller 54 of the anti-sag member 35 travels while being guided and supported by a guide unit 17 that is provided below a return-path-side conveying portion 33c positioned on a lower side of a substrate holder conveying mechanism 3 and extends in a second conveying direction P2, and the first drive part 36 is configured to come into contact with a first driven unit 12 of a substrate holder 11 and drive the substrate holder 11 along the conveying path in the second conveying direction P2.

A conveyance system includes a traveling area and a suspension traveling vehicle. The traveling area includes a grid area and a linear area. In the grid area, since first tracks are disposed side by side and second tracks are disposed side by side so that the first tracks and the second tracks intersect, the grid area includes unit blocks of the same shape or substantially the same shape surrounded by the first tracks and the second tracks. Both the first tracks and the second tracks surrounding the unit blocks are provided with an interstice that allows a supporting body to pass, and the interstice is perpendicular or substantially perpendicular to a longitudinal direction of each track. A traveling direction is the same or substantially the same as the first direction or the second direction in the linear area, and the interstice perpendicular or substantially perpendicular to the traveling direction is not provided in the linear area.

A method includes loading a wafer tape into a first frame, the wafer tape having a first side and a second side, a first semiconductor device die being disposed on the first side of the wafer tape. A substrate is loaded into a second frame, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred. A needle is oriented to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape, and a needle actuator connected to the needle is activated to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

A semiconductor device die transfer apparatus includes a first frame to hold a wafer tape having a plurality of semiconductor device die disposed on a side of the wafer tape and a second frame to secure a product substrate having a circuit trace thereon. The second frame is configured to secure the product substrate such that the circuit trace is disposed facing the plurality of semiconductor device die on the wafer tape. Additionally, a rotary transfer collet is disposed between the wafer tape and the product substrate. The rotary transfer collet has a rotational axis allowing rotation from a first position facing the wafer tape to pick a die of the plurality of semiconductor device die to a second position facing the circuit trace on the product substrate to release the die, thereby applying the die directly on the product substrate during a transfer operation.

A method of operating a vacuum processing system with a main transportation path along which substrates can be transported in a main transportation direction is described. The method includes routing a substrate out of the main transportation path into a first deposition module for depositing a first material on the substrate; routing the substrate out of the main transportation path into a second deposition module for depositing a second material on the substrate; and routing the substrate out of the main transportation path into one or more further deposition modules for depositing one or more further materials on the substrate. Further, various methods of operating one or more rotation modules of vacuum processing system configured for depositing two or more materials on a plurality of substrates are described.

An overhead transport vehicle system stores a large number of articles and includes an inclined rail and overhead transport vehicles each including a traveler to travel on the inclined rail, a holder to hold an article, an elevator to raise and lower the holder, a horizontality guide to keep the elevator horizontal or substantially horizontal at the inclined rail, and a controller. Supports are horizontally provided at a same or substantially same height, and the overhead transport vehicles located on the inclined rail are able to transfer the article between them. The overhead transport vehicles transfer the article between the supports and the controller controls the elevator to raise and lower the holder by a raising and lowering amount according to a height distance between the inclined rail and an individual support.

A lighting component including a plurality of die transferred to the glass substrate. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.

With a touch panel, an operator sets a moving direction of a moving mechanism by using an arrow key. The set moving direction is displayed in a display portion on the touch panel as an arrow. This enables the operator to set the moving direction in association with a correction while visually recognizing the contents of the setting, so that the operator can set the moving direction with less hesitation. Therefore, it is possible to suppress erroneous setting of the moving direction and to shorten the time required for the setting of the correction.

A processing system is provided, including a vacuum enclosure having a plurality of process windows and a continuous track positioned therein; a plurality of processing chambers attached sidewalls of the vacuum enclosures, each processing chamber about one of the process windows; a loadlock attached at one end of the vacuum enclosure and having a loading track positioned therein; at least one gate valve separating the loadlock from the vacuum enclosure; a plurality of substrate carriers configured to travel on the continuous track and the loading track; at least one track exchanger positioned within the vacuum enclosure, the track exchangers movable between a first position, wherein substrate carriers are made to continuously move on the continuous track, and a second position wherein the substrate carriers are made to transfer between the continuous track and the loading track.