A system for performing a direct transfer of a plurality of semiconductor die from a first substrate to a second substrate based on map data of the location of the semiconductor die. A first conveyance mechanism conveys the first substrate. A second conveyance mechanism conveys the second substrate. A transfer mechanism is disposed adjacent to the first conveyance mechanism to effectuate the direct transfer. A controller causes one or more processors to perform operations including: determining positions of the plurality of semiconductor die based at least in part on map data, conveying at least one of the first substrate or the second substrate such that the first substrate, the second substrate, and the transfer mechanism are in a direct transfer position, and activating the transfer mechanism to perform the direct transfer of the plurality of semiconductor die.

The present invention provides a technique to enable sufficient space saving in a transit-type vacuum processing device. The vacuum processing device 1 of the present invention has: a vacuum chamber 2 where a single vacuum ambience is formed; first and second processing regions 4 and 5 that are provided in the vacuum chamber 2 and have a processing source that performs processing on a planar process surface of a substrate 10; and a conveyance drive member 33 that forms a conveyance path for conveying the substrate 10 so as to pass through the first and second processing regions 4 and 5. The conveyance path is formed as a single annular path when the conveyance path is projected onto a plane (vertical plane) containing: a normal line of an arbitrary point on a process surface of the substrate 10 conveyed through the conveyance path, and a trajectory line drawn by the arbitrary point on the process surface of the substrate 10 when the substrate 10 passes straight through the first and second processing regions 4 and 5.

A transport system includes a track, overhead transport vehicles, and a controller. The controller provides a traveling command to travel to a destination point, to a first overhead transport vehicle that is able to receive a transport command to acquire a FOUP from a station and that is less than a first distance from the station When a second of the overhead transport vehicles that is able to receive the transport command and is less than the first distance from the station, is detected before providing the transport command to the overhead first transport vehicle, the controller provides the traveling command to the second overhead transport vehicle. Then, the controller provides the transport command to the one of the first and second overhead transport vehicles that first passes through the destination point.

A dipole alignment device includes an electric field forming part including a stage, and a probe part which form an electric field on the stage; an inkjet printing apparatus including at least one inkjet head which sprays ink including dipoles and a solvent with the dipoles dispersed therein onto the stage; a transportation part comprising a first moving part which moves the electric field forming part in at least one direction; and a light irradiation apparatus including a light irradiation part which applies light to the ink sprayed onto the stage.

A substrate processing system for performing processing on a plurality of substrates. The substrate processing system comprises: a processing unit comprising a plurality of processing modules each configured to perform a predetermined process; a transfer unit having a transfer device configured to transfer a substrate to each of the plurality of processing modules; a loading/unloading unit configured to hold a plurality of substrates and load/unload a substrate to/from the processing unit; and a controller configured to control the processing unit, the loading/unloading unit, and the transfer unit. The controller controls the transfer unit to transfer to the plurality of processing modules in a serial manner a plurality of substrates that are sequentially loaded from the loading/unloading unit to the processing unit, the controller further comprises a standby mode setting unit configured to set a standby period of the substrate at an appropriate timing depending on a content of the process.

An LED display fabrication tool includes a plurality of process chambers and a plurality of transfer chambers. The plurality of process chambers include first and second dispensing chambers to deliver first and second color conversion precursors onto a workpiece for fabrication of a light emitting diode (LED) displays, and first and second washing/drying chambers to remove uncured portions of the first and second color conversion precursors from the workpiece and then dries the workpiece. The plurality of transfer chambers are coupled to two process chambers by two respective sealable ports. First and second curing stations cure the precursors to form the first and second color conversion layers over a first set of LEDs on the workpiece.

A display apparatus includes a substrate and a plurality of LEDs. Each LED is attached to the substrate via conductive pads on a side of the LED. A diffuser having light diffusing characteristics is aligned with the plurality LEDs against a surface of the substrate. The diffuser is aligned so as to nest around at least one LED of the plurality of LEDs.

The present invention relates to a device for holding, positioning and/or moving an object, with a base and with a carrier movable relative to the base, at least one magnetic bearing for generating a bearing or holding force between the base and the carrier, wherein the carrier is contactlessly supported on the base via the magnetic bearing, at least one drive acting contactlessly between base and carrier for the displacement of the carrier along the base in at least one transport direction, wherein the drive comprises a linear motor with at least one slider and one stator, which are arranged on the base and on the carrier and which, aside from a displacement force acting along the transport direction, are configured to create a counter-force between base and carrier which counteracts the bearing or holding force.

A circuit component for a display includes a substrate and a circuit trace having a predetermined pattern disposed on a surface of the substrate. A plurality of semiconductor die are connected to the substrate via the circuit trace. The plurality of semiconductor die are distributed across the surface of the substrate. One or more substrate orientation datum points are disposed on the substrate. The substrate orientation datum points are readable via a sensor of an apparatus that performs a transfer of the plurality of semiconductor die from a supply of die. The substrate orientation datum points provide information regarding positions on the circuit trace. The positions correspond to transfer locations for the plurality of semiconductor die, respectively.

An apparatus for performing a direct transfer of a die. The apparatus includes a first frame to hold the first substrate and a second frame to hold the second substrate. The apparatus further includes a transfer mechanism disposed adjacent to the first frame. The transfer mechanism includes a needle configured to press against the first substrate at a location collinear with the die. A controller, including one or more processors communicatively coupled with the first frame, the second frame, and the transfer mechanism, has executable instructions, which when executed, cause the one or more processors to perform operations including: determining a transfer position of the die on the first substrate via one or more sensors, and aligning the transfer position of the die with the needle of the transfer mechanism via movement of at least two of the first frame, the second frame, and the transfer mechanism.