A LED display fabrication tool includes first and second dispensing chambers to deliver first and second color conversion precursors onto a workpiece for fabrication of a light emitting diode (LED) displays, first and second curing stations to cure the workpiece to form first and second color conversion layers over a first and second set of LEDs on the workpiece, and first and second washing/drying chambers to remove uncured portions of the first and second color conversion precursors from the workpiece and then dry the workpiece. Each of the chambers is independently sealable. A controller controls a workpiece transport system to move the workpiece sequentially between the chambers.

A LED display fabrication tool includes a plurality of chambers including an initial chamber, a final chamber, and a plurality of intermediate chambers, and the plurality of chambers are arranged to form a transfer line from the initial chamber to the final chamber with each intermediate chamber coupled by a first sealable port to a prior chamber in the transfer line and by a second sealable port to a subsequent chamber in the transfer line. The plurality of chambers include first and second dispensing chambers to deliver first and second color conversion precursors onto a workpiece for fabrication of a light emitting diode (LED) displays, and first and second washing/drying chambers to remove uncured portions of the first and second color conversion precursors. First and second curing stations cure the precursors.

An LED display fabrication tool includes a plurality of process chambers and a plurality of transfer chambers. The plurality of process chambers include first and second dispensing chambers to deliver first and second color conversion precursors onto a workpiece for fabrication of a light emitting diode (LED) displays, and first and second washing/drying chambers to remove uncured portions of the first and second color conversion precursors from the workpiece and then dries the workpiece. The plurality of transfer chambers are coupled to two process chambers by two respective sealable ports. First and second curing stations cure the precursors to form the first and second color conversion layers over a first set of LEDs on the workpiece.

A vacuum processing apparatus including: a plurality of transport chambers arranged in order along a first direction; a plurality of process chambers connected to the transport chambers along a second direction that is perpendicular to the first direction; and a position conversion chamber connected to a first transport chamber among the transport chambers. The transport chambers include a rotational movement stage that rotates about a rotation axis that is perpendicular to the first direction and the second direction, and moves along a plane formed by the first direction and the second direction.

A conveyance system includes a traveling area and a suspension traveling vehicle. The traveling area includes a grid area and a linear area. In the grid area, since first tracks are disposed side by side and second tracks are disposed side by side so that the first tracks and the second tracks intersect, the grid area includes unit blocks of the same shape or substantially the same shape surrounded by the first tracks and the second tracks. Both the first tracks and the second tracks surrounding the unit blocks are provided with an interstice that allows a supporting body to pass, and the interstice is perpendicular or substantially perpendicular to a longitudinal direction of each track. A traveling direction is the same or substantially the same as the first direction or the second direction in the linear area, and the interstice perpendicular or substantially perpendicular to the traveling direction is not provided in the linear area.

An apparatus for transferring a semiconductor die (“die”) from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A first bridge holds a transfer mechanism assembly. A second bridge holds a die substrate holder configured to hold the first substrate. A controller is configured to cause the first bridge and the second bridge to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.

A control unit causes a lifting unit to perform a lifting operation for raising/lowering a holding unit by executing feedback control for controlling the lifting unit to move a position of the holding unit in a lifting direction closer to a target position while changing the target position, and the control unit executes feedback control with the target position fixed while causing the travel unit to perform a travel operation for traveling along a travel path in a state where the holding unit is holding an article. The control unit reduces a travel operation gain which is a gain of the feedback control during the travel operation to lower than a lifting operation gain which is a gain of the feedback control during the lifting operation.

An apparatus and an operating method for automated wafer carrier handling are provided. The apparatus includes a base frame and an engaging mechanism disposed on the base frame. The engaging mechanism includes a controller and an active expansion component moveably coupled to the base frame and controlled by the controller to perform a reciprocating movement relative to the base frame. The active expansion component is driven by the controller to pass through the base frame to be engaged with a top flange mounted on the wafer carrier.

Described herein is a technique capable of uniformly processing a substrate. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a microwave generator configured to supply a microwave to the process chamber to perform a heat treatment on the substrate; a substrate retainer configured to accommodate the substrate and a heat retainer provided above the substrate and retaining a temperature of the substrate heated by the microwave; and a first ring plate provided on an outer circumference of the heat retainer and whose outer diameter is greater than that of the substrate.

A control device that performs control to manage the passage of article transport vehicles in a management zone can execute: basic processing for permitting a first article transport vehicle to enter the management zone if no article transport vehicle is present in the management zone, and prohibiting a second article transport vehicle from entering the management zone if the first article transport vehicle is present in the management zone; and first exception processing for permitting the second article transport vehicle to enter the management zone in a case where, even if the first article transport vehicle is present in the management zone, the first article transport vehicle is an article transport vehicle that stops at a station provided in the first path, and the second article transport vehicle passes through a second path and a third path but does not pass through the first path.