The substrate processing system is provided with a first substrate holding unit which includes a first base that faces from below a substrate having a protected target surface and a cleaning target surface on the opposite side of the protected target surface and holds the substrate in a first posture in which the protected target surface is facing upward, a protective film coating nozzle which coats a protective film at least at a peripheral edge portion of the protected target surface of the substrate that is held by the first substrate holding unit, a first turning unit which turns around the substrate while in contact with a peripheral edge portion of the substrate so that the posture of the substrate can be changed from the first posture to a second posture in which the protected target surface is facing downward, a second substrate holding unit which includes a second base that faces the substrate from below and holds the substrate in the second posture, and a cleaning unit which cleans the cleaning target surface of the substrate that is held by the second substrate holding unit.

Substrate processing systems or platforms and methods configured to process substrates including of extreme ultraviolet (EUV) mask blanks are disclosed. Systems or platforms provide a small footprint, high throughput of substrates and minimize defect generation. The substrate processing system platform comprises a single central transfer chamber, a single transfer robot, a substrate flipping fixture, and processing chambers are positioned around the single central transfer chamber.

The inventive concept provides an apparatus for supporting a substrate. An apparatus for treating a substrate includes a process chamber that performs a predetermined process on the substrate and a reversing unit that reverses the substrate. The reverse unit includes a grip unit that grips the substrate and a drive unit that rotates the grip unit to reverse the substrate gripped by the grip unit. The grip unit includes a first body that supports one of an upper surface and a lower surface of the substrate and a second body that supports the other surface of the substrate. Each of the first body and the second body includes a support protrusion that is brought into contact with the substrate when the grip unit grips the substrate.

An evaporation system and an evaporation method are provided. The present disclosure can accelerate production cycle, reduce production cost, and improve product quality by disposing an evaporation source vertically in a vacuum chamber and arranging a plurality of substrates on both sides of the evaporation source to perform evaporation on the substrates on the both sides.

The present disclosure related to a stacker of an electric device test hander comprising an upper stacker and a lower stacker. Stacker modules provided in the upper stacker can be opened and closed by being moved horizontally from the frame, and each of stacker modules can give and receive a plurality of user trays to and from the lower stacker in closed position.

According to present disclosure when goods are being transferred to and from the outside, the user trays can move freely between the loading parts disposed on the upper and lower sides. Thus, the dependence on the visitation cycle of an external robot and the replacement amounts of the user trays can be lowered to improve ease of operation.

A processing apparatus includes a tape pressure bonding unit that executes pressure bonding of a tape of a tape-attached frame to a back surface of a wafer. The tape pressure bonding unit includes an upper chamber, a lower chamber, a raising-lowering mechanism that raises and lowers the upper chamber, a vacuum part that sets the upper chamber and the lower chamber to a vacuum state, and an opening-to-atmosphere part that opens the upper chamber and the lower chamber to the atmosphere.

A wafer flipping device for use in semiconductor processing, comprises a supported rotating assembly that receives a semiconductor work product on one side when in a first unrotated position, grips and aligns the work product, rotates with the semiconductor work product thereon into a rotated position, and releases the semiconductor work product from the rotated, position. The semiconductor work product may be any one of a range of different shapes and sizes and retractable pins are selected for the corresponding shape or size.

The present disclosure provides an electrochemical deposition apparatus set. The electrochemical deposition apparatus set includes: an electrochemical deposition device configured to form an electrochemical deposition film layer on an area to be coated of a substrate; an antioxidation treatment device located on a side of the electrochemical deposition device and configured to performing antioxidation treatment on the substrate formed with the electrochemical deposition film layer; a transmission device configured to carry the substrate and drive the substrate to move at least from the electrochemical deposition device to the antioxidation treatment device.

A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.

Discussed is a device for self-assembling semiconductor light-emitting diodes, the device including an assembly chamber having a space for accommodating a fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part.