A glass sheet semiconductor deposition system (20) for coating semiconductor material on glass sheets is performed by conveying the glass sheets vertically suspended at upper extremities thereof by a pair of conveyors (38) through a housing (22) including a vacuum chamber (24). The glass sheets are conveyed on shuttles (42) through an entry load station (26) into the housing vacuum chamber (24), through a heating station (30) and at least one semiconductor deposition station (32, 34) in the housing (22), and to a cooling station (36) prior to exiting of the system through an exit load lock station (28). The semiconductor deposition station construction includes a deposition module (102) and a radiant heater (104) between which the vertical glass sheets are conveyed for the semiconductor deposition.

A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion chips from the first load-bearing structure; dividing the first portion chips into a plurality of blocks according to the photoelectric characteristic values, and each of the plurality of blocks comprising multiple chips of the first portion chips; and transferring the multiple chips of one of the plurality of blocks to a second load-bearing structure.

Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (μm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (μm) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

The present disclosure relates to an apparatus for transferring a light emitting diode (LED). The apparatus for transferring an LED includes: a pick-up unit configured to pick up at least some of multiple light emitting diodes (LEDs) arranged on one substrate, and, according to a received control signal, put down LEDs selected from among the picked-up LEDs on another substrate; and a controller configured to transmit the control signal to the pick-up unit so as to enable the pick-up unit to individually pick up or put down each of the multiple LEDs.

The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.

A mask arrangement for masking a substrate in a processing chamber is provided. The mask arrangement includes a mask frame having one or more frame elements and is configured to support a mask device, wherein the mask device is connectable to the mask frame; and at least one actuator connectable to at least one frame element of the one or more frame elements, wherein the at least one actuator is configured to apply a force to the at least one frame element.

Disclosed is a chip packaging apparatus. The chip packaging apparatus comprises: at least one chip supplying device; at least one chip processing device configured to process a chip supplied by a corresponding chip supplying device; and at least one chip transferring device, wherein each chip transferring device has a plurality of bonding heads, and each of the bonding heads is used to transfer one chip processed by a corresponding chip processing device. Each chip processing device comprises at least two pick-up platforms, each of the pick-up platforms is configured such that multiple chips can be simultaneously provided thereon, and the plurality of bonding heads on a corresponding chip transferring device is configured to simultaneously pick up multiple chips from each pick-up platform in one operation. A method for packaging chips is also disclosed.

The present disclosure provides a method for producing a boron nitride nanotube by heating a boron precursor, and an apparatus therefor. According to an embodiment, a method of producing a boron nitride nanotube includes: inserting several reaction modules each accommodating a holding rod disposed through at least one precursor block into a supply chamber disposed at a front end of a reaction chamber; conveying N reaction modules of the several reaction modules inserted in the supply chamber to a reaction zone of the reaction chamber; growing a boron nitride nanotube in the precursor block by operating the reaction zone for a predetermined time, in the reaction chamber; and conveying the N reaction modules from the reaction chamber to a discharge chamber disposed at a rear end of the reaction chamber after the predetermined time passes. Accordingly, it is possible to maximize the yield and productivity of BNNTs.

A pick-up device has a caves. A first magnetic force is capable of attracting micro-devices to move toward the caves of the pick-up device. The pick-up device is disposed on a pick-up roller, and the pick-up roller drives the caves of the pick-up device to move relative to the micro-devices. Given that the first magnetic force is provided, the pick-up device compresses the micro-devices, so that the micro-devices are fitted in place the micro-devices into the caves of the pick-up device, wherein a shape of the caves is the same as a shape of the micro-devices. The micro-devices are transferred from the caves of the pick-up device to a receiving device.

A tray engine includes a vertical drive column, a rotation mechanism for rotating the vertical drive column, and an end effector attached to the vertical drive column. The end effector includes an end effector base attached to the vertical drive column. The end effector further includes a slide attached to the end effector base to support a tray, when present. The slide enables the tray to slide along a length of the end effector base. The tray engine includes a drive mechanism attached to the end effector base for moving along the length of the end effector base to enable the tray, when present, to slide linearly along the length and load or unload the tray to or from the slide.