A micro-LED transfer method, manufacturing method and display device are provided. The micro-LED transfer method comprises: bonding the micro-LED array on a first substrate onto a receiving substrate through micro-bumps, wherein the first substrate is laser transparent; applying underfill into a gap between the first substrate and the receiving substrate; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate; and removing the underfill.

A micro-LED transfer method, manufacturing method and display device are provided. The micro-LED transfer method comprises: bonding the micro-LED array on a first substrate onto a receiving substrate through micro-bumps, wherein the first substrate is laser transparent; applying underfill into a gap between the first substrate and the receiving substrate; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate; and removing the underfill.

Sheets of a thin film material are attached to a carrier wafer. The carrier wafer and the attached sheets of thin film material are separated to form chiplet carriers. Each chiplet carrier includes a portion of the sheets of thin film material attached to a portion of the carrier wafer. The chiplet carriers are placed on an assembly surface in a random pattern. The chiplet carriers are arranged from the random pattern to a predetermined pattern, and the portions of the thin film material are transferred from the chiplet carriers to a target substrate.

A semiconductor package sawing device is provided that includes a semiconductor package sawing unit, an automatic tool providing portion disposed adjacent to the semiconductor package sawing unit, and a semiconductor package alignment portion. The automatic tool providing portion includes a transfer unit for transferring a chuck unit to the semiconductor package sawing unit.

A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance crane, a rectangular zone overlapping with the load port of the manufacturing tool, a plurality of first sensors at corners of the rectangular zone, an OHT vehicle, a second sensor on the OHT vehicle, a third sensor on the load port, and a control unit. The first sensors are configured to detect a location of the maintenance crane and to generate a first location data. The second sensor is configured to generate a second location data. The control unit is configured to receive the first location data of the maintenance crane and the second location data of the OHT vehicle. The control unit further sends signals to the second sensor and the third sensor or to cut off the signal to the second sensor.

A micro-structure transfer system may include a printhead and a pressure control device to control a pressure of fluid coupled with the printhead. The pressure control device forms a meniscus of fluid at a number of nozzles defined within the printhead to pick up a number of micro-structures. A printhead for transferring micro-structures includes a number of fluid chambers, a number of nozzles defined in an orifice plate through which fluid may exit the chambers, and a pressure control device to control a pressure of fluid within each of the chambers. The pressure control device forms a meniscus of the fluid at a number of nozzles defined within the printhead to pick up a number of micro-structures.

A micro device transfer head includes a base arm, a first side arm, a second side arm, and an isolation layer. The first side arm, including one or multiple first electrodes, is disposed on a first surface of the base arm and located on a first end of the base arm. The second side arm, including one or multiple second electrodes, is disposed on the first surface of the base arm and located on a second end of the base arm. The isolation later is disposed on the first surface of the base arm and covers the surface of the first side arm and the second side arm.

A transportation container is provided with a container body constructed of a top wall, a bottom wall, a rear wall, and two sidewalls forming a front opening for loading or unloading a reticle pod into or out of the container body; a lid for opening and closing the front opening; and a lift plate above the container body configured to connect to a carrier of an overhead hoist transfer (OHT) system.

An electronic component handler includes an electronic component transporter transporting an electronic component in an arrangement state where a shuttle plate is arranged, the shuttle plate having a recess receiving the electronic component, a light source casting light, a light receiver receiving the light, a detector detecting presence/absence of the electronic component in the recess, and a negative pressure generator putting the recess under a negative pressure. The shuttle plate has a first flow path. The electronic component transporter has: a shuttle plate fastener having a second flow path communicated with the first flow path in the arrangement state and having the shuttle plate fixed thereto in the arrangement state, a transmission member sealing the second flow path and transmitting the light, and a driver driving the shuttle plate fastener. The negative pressure generator is coupled to the second flow path and sucks the electronic component in the recess.

The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.