An overhead transport vehicle includes: an article holding unit configured to hold an article; a linear drive unit configured to drive the article holding unit to move linearly; a pivoting drive unit configured to drive the article holding unit to pivot horizontally; and a control unit configured to control the pivoting drive unit in accordance with orientation of the article held by the article holding unit and orientation of a load port on which the article is placed.

A storage shelf includes second shelf modules each including a second shelf board, a supply nozzle, an MFC configured to adjust a flow rate of the fluid supplied from the supply nozzle, and a third pipe connecting between the MFC and a main pipe connected to a supply source of the fluid, and suspension frames each including additional shelf supporting portions supporting the second shelf modules from below and a pair of suspending portions and a pair of additional suspending portions suspending and supporting the additional shelf supporting portions. The suspension frames are disposed at regular intervals along one direction. Each second shelf module is laid over between additional shelf supporting portions of suspension frames adjacent to each other in the one direction, and a pipe connector being connectable to the main pipe is provided with an end of the third pipe.

A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

A gripper arrangement adapted for gripping a cleanroom container, such as a FOUP, FOSB or reticle container and a method therefore, includes: a gripper adapted to grip the cleanroom container; a lifting unit comprising a first motor for lifting the gripper; at least one cord connecting the gripper with the lifting unit, wherein the at least one cord is driven by the first motor; a second motor for rotating at least a portion of the gripper with respect to the lifting unit around the vertical axis; wherein the gripper comprises engagement elements and the lifting unit comprises complementary engagement elements adapted to engage with the engagement elements for preventing a rotation around the vertical axis of the gripper with respect to the lifting unit; wherein the gripper comprises an upper gripper element and a lower gripper element; wherein the lower gripper element is adapted for supporting the top flange of the cleanroom container; and the lower gripper element comprises an opening that can be passed over the upper flange of the cleanroom container and at least one recess formed at least partially around the opening for accommodating the upper flange of the cleanroom container.

A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.

A transportation system of a cassette according to an embodiment of the present invention comprises a port and a system controller. The port accommodates a cassette carrying a glass substrate. The port includes a plurality of displacement sensors for sensing a position of a cassette. The system controller calculates a distortion amount of the cassette using a plurality of sensed values of the cassette and a misplaced amount of the displacement sensors to determine whether the cassette is in a normal settlement status. Therefore, the position of the cassette can be automatically taught without clamping operation of a clamping device clamping the cassette disposed in the port, so that it is possible to prevent defects of the glass substrate by removing various defect-causing factors such as particles and static electricity that may occur during a conventional clamping operation.

A wafer storage system includes a main rail, an overhead hoist transport (OHT) on the main rail, the OHT being configured to transfer at least one storage case with wafers, an interface port on at least one side of the main rail, an auxiliary rail on one side of the interface port, the auxiliary rail being parallel to the main rail, and the interface port being between the main rail and the auxiliary rail, an auxiliary transport on the auxiliary rail, the auxiliary transport being configured to move along the auxiliary rail and to move the at least one storage case, a storage shelf on at least one side of the auxiliary transport, the storage shelf being configured to store the at least one storage case, and a worktable on one side of the storage shelf, the storage shelf being between the worktable and the auxiliary transport.

The present invention provides a cleaning method and equipment thereof for object FOUP, comprising the following steps: firstly separating the object FOUP into a container lid and a container body, then conducting individual processes of wet washing, liquid removing and vacuum drying for the container lid and container body, and in the end combining the container lid and container body to complete the cleaning procedure of the object FOUP; specifically, during the liquid removing process, multiple wind knives are used to carry out liquid removing for the container body, and during the vacuum drying process after liquid removing, multiple thermal components are used to carry out vacuum drying for the container body under a vacuum environment; moreover, the present invention also includes the cleaning equipment to execute the above method, for the purpose of overcoming the problem that the wet cleaning process in the conventional automatic chip FOUP cleaning technique cannot effectively clean object FOUPs with relatively complicated internal structures.

A substrate processing apparatus includes: a carrier block including carrier placement parts and configured to load/unload a substrate into/from a carrier; a processing block provided on one side of the carrier block to process the substrate; first and second carrier placement parts of the carrier placement parts and provided side by side in a front-rear direction in a plan view; substrate placement parts provided to be arranged step by step vertically on one side of a substrate transfer region formed between the first and second carrier placement parts; a first substrate transfer mechanism provided in the substrate transfer region to deliver the substrate between the carrier of the first carrier placement part and a first substrate placement part of the substrate placement parts; and a second substrate transfer mechanism for moving upward and downward so as to deliver the substrate between first and second substrate placement parts.

A semiconductor manufacturing apparatus includes one or more process modules, a scheduler, and a transfer controller. A product wafer of a lot that is transferred from a load port to one of the one or more process modules is replenished such that a total number of wafers that are simultaneously processed in the one or more process modules becomes N. When an advance lot being processed and a post lot to be processed subsequent to the advance lot have a same processing condition, the scheduler creates the transfer plan to replenish with the product wafer of the post lot instead of a dummy wafer such that the transfer controller transfers the product wafer and the dummy wafer to the one or more process modules according to the created transfer plan.