A transfer device includes a holder that holds an article, and a self-propelled cart that supports the holder and travels. The self-propelled cart includes a wheel and a wheel drive source that drives the wheel, and the self-propelled cart travels along a traveling path provided on an elevation unit and a delivery device. The delivery device includes a positioning portion that positions the elevation unit while the elevation unit is at a transfer height, and a delivery-side guide that guides travel of the self-propelled cart along the traveling path. The elevation unit includes an elevation-side guide that guides travel of the self-propelled cart along the traveling path, and the elevation-side guide is arranged so as to be continuous with the delivery-side guide while the elevation unit is positioned by the positioning portion.

According to various embodiments, a frame cassette includes a housing and a mounting structure within the housing. The mounting structure includes a plurality of tape-frame slots, each tape-frame slot configured to receive a tape-frame. The housing includes an opening configured to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots, or to remove the tape frame from the tape-frame slot of the plurality of tape-frame slots. The housing also includes an electrostatic discharge protection. A corresponding automatic transportation system and method of automatic transportation of semiconductor wafers is also provided.

Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

The present application discloses a collision prevention system of automated overhead hoist, including: a traveling track; overhead hoists movably mounted on the traveling track; photoelectric sensing apparatuses, arranged below the traveling track, and configured to form protection areas below the traveling track and output a feedback signal when detecting that an unexpected object enters the protection areas; and a control system, connected to the overhead hoists and the photoelectric sensing apparatuses, and configured to control at least one of the overhead hoists to stop moving upon receiving the feedback signal.

An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.

A processing apparatus includes a chuck table that holds a workpiece, a cutting unit that processes the workpiece held by the chuck table, a cassette placing region where a cassette is placed, a carrying unit that carries the workpiece between the cassette placed in the cassette placing region and the chuck table, and a surrounding wall that partitions a route for lifting the cassette upward and downward from an external space, in a space directly above the cassette placing region. A height of the surrounding wall is equal to or more than a height of a ceiling wall of the processing apparatus and is so as not to interfere with the cassette held by a carrier that travels.

A container storage includes a purger that supplies a purge gas into a stored container and an evacuator that is disposed near a lid of the container and evacuates an atmosphere around the lid.

A transport vehicle includes: a traveler; a transferer that is mounted on the traveler and receives or delivers an article from or to a transfer destination; and an antenna that is provided so that at least the position or the posture thereof can be changed to follow the action of the transferer, and that performs wireless communication with another device.

A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.

A method for arranging a substrate processing tool on a pedestal within a semiconductor fabrication room includes supporting a plurality of pedestal plates on a pedestal frame including a plurality of stanchions. The method further includes determining dimensions of the pedestal plates, determining locations of installation features of the pedestal plates in accordance with components of the substrate processing tool, machining the installation features in the pedestal plates based on the determined locations, marking at least one of the pedestal plates with at least one alignment feature, and installing the pedestal frame on a subfloor of the semiconductor fabrication room. The stanchions of the pedestal frame are positioned such that a weight distribution of the pedestal frame on the subfloor is different from a weight distribution of the substrate processing tool.