An overhead transport vehicle travels along a rail on a ceiling of a building to transport a FOUP. The overhead transport vehicle includes a holding base and an upper shelf transfer device. The holding base holds at least one of a side surface and a bottom surface of the FOUP. The upper shelf transfer device moves the holding base at least upwardly while holding the FOUP. The upper shelf transfer device moves the holding base from the holding position in which the holding base holds and transfers the FOUP to the upper transfer position to transfer the FOUP, which is a different position from the holding position in a plan view and higher than the holding position.

In one embodiment, a system includes a wafer-handling system of a semiconductor-manufacturing system. The wafer-handling system is configured to hold one or more wafers for processing. The system also includes one or more processing components configured to physically treat the one or more wafers; a controller configured to operate the processing components; and a text bot in communication with the semiconductor-manufacturing system and configured to respond to a user inquiry.

A method for operating a conveying system is provided. An overhead hoist transport (OHT) vehicle is provided, wherein the OHT vehicle includes a gripping member configured to grip and hold a carrier, and a receiver configured to receive a signal. The signal is transmitted to the receiver of the OHT vehicle. The OHT vehicle is moved toward the carrier, and the carrier is gripped by the gripping member of the OHT vehicle. A lifting force is determined based on a weight of a carrier, a number of workpieces in the carrier, or a vertical distance between the OHT vehicle and the carrier, and the lifting force is applied to the carrier.

Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

An article transport vehicle includes a travel body; a holding device that holds an article; and a lift device that is on the travel body, and that raises and lowers the holding device with respect to the travel body. The holding device includes: a connection portion connected to the lift device and an article support portion that supports the article; an elastic support mechanism that is between the article support portion and the connection portion, and that supports the article support portion against the connection portion while being elastic in a vertical direction, and a guide mechanism that guides the article support portion in the vertical direction with respect to the connection portion. The guide mechanism allows the article support portion to move parallel with the vertical direction with respect to the connection portion and restricts swinging of the article support portion with respect to the connection portion.

A transfer system includes a carrier and a storage shelf. The carrier transfers an object along a transfer path on or suspended from a ceiling. The storage shelf is disposed along the transfer path and stores the object transferred by the carrier. The storage shelf includes a placement portion having the object placed thereon. The placement portion moves up and down with respect to a transfer position Tat which the object is transferred between the placement portion and the carrier.

An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.

A storage system includes an overhead stocker having a first overhead track, a rack including a plurality of storages arranged vertically, and a crane that travels along the first overhead track and delivers and receives an article to and from the storages; and an overhead transport vehicle system having a second overhead track provided below a lower end of the overhead stocker, and an overhead transport vehicle that travels along the second overhead track and delivers and receives an article to and from a predetermined transfer destination, wherein the first overhead track has an elevating track capable of supporting and lowering the crane that is stopped traveling at a portion deviated from the second overhead track in planar view.

There is provided a technique including a plurality of process chambers to process a substrate; a plurality of standby chambers to accommodate the substrate; a transfer chamber disposed adjacent to the plurality of standby chambers and the plurality of process chambers; a transfer robot in the transfer chamber to transfer the substrate between one of the plurality of process chambers and one of the plurality of standby chambers or between the plurality of standby chambers adjacent to each other across the transfer chamber; a temperature adjustment mechanism to adjust temperature of at least one of the plurality of standby chambers; and a controller capable of controlling the temperature adjustment mechanism to change a mode of temperature adjustment of the at least one of the plurality of standby chambers depending on a transfer path through which the substrate accommodated in the at least one of the plurality of standby chambers passes.