A method and apparatus for loading substrates in an inspection station is disclosed herein. In one embodiment a loading module is disclosed that includes a loading station for two or more substrate cassettes, a first lane comprising a first conveyor that is substantially aligned with one of the two or more substrate cassettes and a conveyor system, a second lane comprising a second conveyor that is substantially aligned with another of the two or more substrate cassettes and positioned in a spaced-apart relation relative to the first lane, and a lateral transfer module positioned between the first lane and the second lane that is adapted to move substrates from the second lane to the first lane.

A wafer manufacturing apparatus includes an ingot grinding unit for grinding an upper surface of an ingot to planarize the upper surface of the ingot, a laser applying unit for forming peel-off layers in the ingot at a depth therein, which corresponds to the thickness of a wafer to be produced from the ingot, from the upper surface of the ingot, a wafer peeling unit for holding the upper surface of the ingot and peeling off a wafer from the ingot at the peel-off layers, a tray having an ingot support portion and a wafer support portion, and a belt conveyor unit for delivering the ingot supported on the tray between the ingot grinding unit, the laser applying unit, and the wafer peeling unit.

A component mounting system includes a component mounting device (15) configured to mount a component (E) on a board (S), a component storage (20) configured to store a component containing member (200) configured to contain a plurality of the components to be mounted on the board by the component mounting device, and a controller (22) configured to control an order in which the component containing member is unloaded from the component storage. The controller is configured to control the order in which the component containing member is unloaded based on an unloading priority when a plurality of the component containing members are scheduled to be unloaded.

The present disclose relates to a substrate delivery method that uses a substrate delivery device including an elevating body for moving upward and downward a plurality of mounting parts, on which a transport container for a substrate is placed. The substrate delivery method of the present disclosure comprises loading and unloading the substrate in the transport container; temporarily suspending the loading and unloading for the transport container when the external transport mechanism tries to deliver a transport container to and from another mounting part; and positioning said other mounting part at the delivery height position and delivering the transport container to and from the external transport mechanism.

A wafer transport device is moved on a transport rail, and stopped above a load port having a top surface. A light beam is projected onto the top surface of the load port, and image of the top surface is and the light beam is captured. A position of the hoist unit of the wafer transport device is aligned with respect to a position of the load port according to the image. The hoist unit is lowered toward the load port.

There is provided a transfer abnormality detection system capable of receiving information from a container transfer device configured to transfer a transfer container and a mounting device configured to load the transfer container that is transferred by the container transfer device, the system including: a determination part configured to: record which container transfer device is transferring the transfer container based on a container identification ID assigned to each transfer container and a transfer device identification ID assigned to each transfer device; and determine an abnormality in either or both of the container transfer device and the transfer container by combining vibration detection information of the container transfer device obtained by a vibration detection part provided in the container transfer device and state detection information of the transfer container obtained by a container state detection part provided in the mounting device.

A first storage section includes a first support portion that supports an article and a movable support portion that movably supports the first support portion in the path width direction. A second storage section includes a second support portion whose position in a path width direction relative to a movement path is fixed, and supports the article. A space occupied by the article in a state of being supported by the second support portion is a target space, a position at which the first support portion overlaps the target space in an up-down view along an up-down direction is an overlapping position, and a position that is adjacent to a first side relative to the overlapping position and at which the first support portion does not overlap the target space in the up-down view is a non-overlapping position.

Provided is a transport vehicle system SYS1 in which: an overhead transport vehicle includes a main body, a holder, a lift driver, and a lateral extender; a port pitch P is less than the overall length VL of the overhead transport vehicle in an extending direction D; and a first portion, which is raised or lowered by the lift driver moved in a lateral direction by a lateral extender, of an overhead transport vehicle stopped at a first position P1 on a first track for transferring an article W to a first transfer location S1 is offset in the extending direction D from a second portion, which is moved in a lateral direction by means of the drive of a lateral extender, of an overhead transport vehicle stopped at a second position P2 on the second track for transferring an article W to a second transfer location S2.

A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.

A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.