Patent classifications
H01L21/67736
Systems and methods for die transfer
In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.
SYSTEM FOR A SEMICONDUCTOR FABRICATION FACILITY AND METHOD FOR OPERATING THE SAME
A system for a semiconductor fabrication facility includes a maintenance tool, a control unit, a first track, a second track, a maintenance crane movably mounted on the first track, a plurality of first sensors disposed on the first track, an OHT vehicle movably mounted on the second track, and a second sensor on the OHT vehicle. The first sensors detect a location of the maintenance crane and generate a first location data to the control unit. The second sensor generates a second location data to the control unit.
APPARATUS AND METHODS FOR HANDLING DIE CARRIERS
Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.
METHOD FOR TRANSPORTING WAFERS
A method includes moving a wafer transport device to a position above a load port; lowering a hoist unit of the wafer transport device above the load port, wherein the wafer transport device has a plurality of belts, each of the belts is connected to the hoist unit and wound around a respective belt winding drum; detecting sound waves from the belts by using at least one acoustic sensor to measure tensions of the belts; and comparing the tensions from the belts to determine an inclination of the hoist unit.
Workpiece storage system, method of storing workpiece, and method of transferring workpiece using the same
A method for storage a workpiece used in fabrication of a semiconductor device includes disposing the workpiece on a workpiece carrier, disposing the workpiece carrier with the workpiece in a workpiece container via a workpiece storage system, identifying a content of the workpiece container, and adjusting a storage condition inside the workpiece container in response to the content of the workpiece container via the workpiece storage system.
Systems and methods for die transfer
In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.
Substrate treating apparatus and substrate transporting method
A substrate treating apparatus and a substrate transporting method. A platform is placed on a first ID block, and a platform is placed on a second ID block. A currently-used carrier platform is provided only on the first ID block. A substrate is transported in both a forward path and a return path between the first ID block and an IF block. The substrate is sent in the return path from the IF block to the second ID block disposed between a coating block and a developing block without being transported from the IF block to the first ID block. Consequently, transportation process in the return path by the coating block disposed between the first ID block and the second ID block is reduced. As a result, an entire throughput of a substrate treating apparatus can be enhanced.
Article storage facility
An article storage facility is disclosed which has a relatively high article storage efficiency and which can reduce the possibility of degradation, etc., of articles that may occur within a storage structure. The article storage facility includes: a storage structure; a first support station provided inside the storage structure and configured to support a storage container; a second support station configured to support a transporting container; and an article transfer device. A transporting container is a container that is used to transport articles outside the storage structure whereas a storage container is a container that is used to transport and store articles inside the storage structure, and is configured to hold a plurality of articles with greater holding efficiency than a transporting container. The article transfer device is configured to transfer articles, one or more articles at a time, between a storage container placed on the first support station and a transporting container placed on the second support station.
System for a semiconductor fabrication facility and method for operating the same
A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance crane, a rectangular zone overlapping with the load port of the manufacturing tool, a plurality of first sensors at corners of the rectangular zone, an OHT vehicle, a second sensor on the OHT vehicle, a third sensor on the load port, and a control unit. The first sensors are configured to detect a location of the maintenance crane and to generate a first location data. The second sensor is configured to generate a second location data. The control unit is configured to receive the first location data of the maintenance crane and the second location data of the OHT vehicle. The control unit further sends signals to the second sensor and the third sensor or to cut off the signal to the second sensor.
System for transporting objects under controlled atmosphere
System for transporting objects under controlled atmosphere comprising tubular sections connected together in a leak tight manner by their first ends, each tubular section, each section comprising a guide track for a trolley, each guide track comprising a first and a second end, the first ends of the guide tracks being opposite and separated from each other by a given distance. The transport system also comprises a spanning element rotationally hinged on a first end of the guide tracks around an axis orthogonal to a direction of displacement of said guide track. The spanning element is moveable between a raised position and a spanning position in which the guide tracks are connected enabling the passage of the trolley.