A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.

A device for moving an object including a substrate through an open side of a processing station of a processing apparatus including a support, placeable at the processing station. The device includes a carrier, guided for movement relative to the support along a path predominantly directed in parallel to a reference axis in a reference co-ordinate system. The device includes a device for controlling movement of the carrier and driving the movement in an opposite direction along the path. The device includes a component for holding the object and a suspension mechanism with which the holding component is connected to the carrier. The suspension mechanism is arranged to guide movement of the holding component relative to the carrier along a holding component path. The device is arranged to drive the movement of the holding component along the holding component path. The holding component path is predominantly directed parallel to the reference axis.

A substrate transfer device includes a transfer unit configured to transfer, in a first direction, a carrier in which substrates are stored, an upper interface unit configured to move the transfer unit, a lower interface unit configured to receive the carrier from the transfer unit, and a controller configured to control the upper interface unit and the lower interface unit integrally such that the transfer unit and the carrier move in the first direction at the same time.

Provided is a tower lift, including: a body; a first carriage module and a second carriage module configured to be movable in a vertical direction along the body and each support objects to be transferred; a driving unit comprising a driving belt which vertically moves the first carriage module and the second carriage module and on which the first carriage module or the second carriage module is mounted; and a gap adjusting unit adjusting a gap between the first carriage module and the second carriage module.

A wafer processing apparatus of an embodiment of the present disclosure may include an equipment front end module (EFEM), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. In addition, the EFEM may include an atmosphere control chamber configured to store a wafer carrier accommodating wafers, an upper air supplier configured to supply air into the atmosphere control chamber, an EFEM chamber under the atmosphere control chamber, a load lock arranged to be vertically overlapped by at least a portion of the EFEM chamber, and an EFEM arm configured to transfer the wafer carrier.

An automated material handling system includes: at least one state detecting sensor disposed inside or outside the carrier to detect an internal state of the carrier including a degree of pollution in the carrier; a carrier interface to transmit a carrier state value; a carrier controller including a controller interface disposed on the plate to obtain a carrier state value by communicating with the carrier interface, and a carrier control unit configured to generate carrier management information including the carrier state value obtained through the controller interface and current location information of the carrier and output the carrier management information to a server; and a server configured to analyze an internal pollution state of the carrier based on the carrier management information provided by the carrier controller.

A substrate processing apparatus configured to process a substrate includes a substrate receptacle placing unit configured to place thereon a substrate receptacle accommodating therein the substrate to be processed; and a storage zone provided adjacent to the substrate receptacle placing unit to store therein the substrate receptacle. The storage zone includes multiple storages which are vertically arranged in multiple levels and configured to place and store thereon the multiple substrate receptacles horizontally. The substrate receptacle is transferred between a first storage of the multiple storages at an uppermost position and a ceiling travelling vehicle configured to be moved above the substrate processing apparatus. A second storage of the multiple storages under the first storage is configured to place and store the substrate receptacle thereon such that a direction of the substrate receptacle on the second storage is different from a direction of the substrate receptacle on the first storage.

An overhead transport vehicle includes: an article holding unit configured to hold an article; a linear drive unit configured to drive the article holding unit to move linearly; a pivoting drive unit configured to drive the article holding unit to pivot horizontally; and a control unit configured to control the pivoting drive unit in accordance with orientation of the article held by the article holding unit and orientation of a load port on which the article is placed.

Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

This application provides a conveyor device and semiconductor production equipment, and relates to the technical field of semiconductor production equipment. The conveyor device is installed on a machine platform of semiconductor production equipment, the machine platform is provided with a guide structure, and the guide structure is provided with multiple oil injection ports arranged along an extension direction of the guide structure. The conveyor device includes a conveyor platform and a driving mechanism, where the conveyor platform is slidably installed on the guide structure to carry and convey wafers, the conveyor platform covers at least one of the multiple oil injection ports, and the driving mechanism is connected to the conveyor platform.