Embodiments of equipment front end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes: two or more loadports for receiving two or more types of substrates; an overhead storage unit having a plurality of storage shelves disposed above the two or more loadports and configured to hold two or more types of front opening unified pods (FOUPs) of different sizes that store the two or more types of substrates, respectively, wherein a horizontal alley is disposed between the plurality of storage shelves and the two or more loadports to provide a horizontal passageway for the FOUPs during transport to the two or more loadports; and an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to the two or more loadports.

Provided are a flow supply apparatus and supply method. The flow supply apparatus, comprising: a rail; a transport unit disposed on the rail, where an object is loaded; and a gas treatment unit provided on the transport unit and configured to purge the object. The object includes a FOUP with a substrate accommodated therein, and fume is removed from the substrate through the purging.

A method of operating an article transport system includes deriving a predicted transport request time-point of a target apparatus from pre-collected operation data of the article transport system, calling a transport vehicle of the article transport system at a time-point prior to the derived predicted transport request time-point, and moving the called transport vehicle to the target apparatus.

An integrated circuit (IC) structure includes a substrate, a transistor, an interconnect structure, a plurality of metal lines, an oxide liner, a passivation layer, and a nitride layer. The transistor is on the substrate. The interconnect structure is over the transistor. The metal lines is on the interconnect structure. The oxide liner is over the plurality of metal lines. The passivation layer is over the oxide liner and is more porous than the passivation layer. The nitride layer is over the passivation layer.

A method and apparatus for loading substrates in an inspection station is disclosed herein. In one embodiment a loading module is disclosed that includes a loading station for two or more substrate cassettes, a first lane comprising a first conveyor that is substantially aligned with one of the two or more substrate cassettes and a conveyor system, a second lane comprising a second conveyor that is substantially aligned with another of the two or more substrate cassettes and positioned in a spaced-apart relation relative to the first lane, and a lateral transfer module positioned between the first lane and the second lane that is adapted to move substrates from the second lane to the first lane.

A system includes a plurality of semiconductor processing tools; a carrier purge station; a carrier repair station; and an overhead transport (OHT) loop for transporting one or more substrate carriers among the plurality of semiconductor processing tools, the carrier purge station, and the carrier repair station. The carrier purge station is configured to receive a substrate carrier from one of the plurality of semiconductor processing tools, purge the substrate carrier with an inert gas, and determine if the substrate carrier needs repair. The carrier repair station is configured to receive a substrate carrier to be repaired and replace one or more parts in the substrate carrier.

In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

An article transport apparatus includes a traveling portion configured to travel along a rail portion and a mounting portion configured to have a structure suspended under a traveling portion to mount articles thereon, in particular, the rail portion includes a plurality of first straight rails extending in a first direction while being arranged parallel to each other at first intervals, a plurality of second straight rails extending in a second direction perpendicular to the first direction while being arranged parallel to each other at second intervals, and a connecting rail configured to connect between the first straight rails and the second straight rails, which perpendicularly face each other, so that the traveling portion travels between the first straight rails and the second straight rails perpendicularly facing each other.

A storage system and methods for operating a storage system are disclosed. The storage system includes a plurality of storage shelves, and each of storage shelves has a shelf plate for supporting a container. Each of the storage shelves is coupled to a chain to enable horizontal movement and each is further coupled to a rail to enable guiding to one or more positions. A motor is coupled to a drive sprocket for moving the chain. The rail has some sections that are linear and some sections that are nonlinear. The sections are arranged in a loop. Example configurations of the storage system include one or more of stationary shelves, extended horizontal tracks for a hoist, a conveyor at a level of the storage system, and a manual loading station. The hoist, with an extended horizontal track interfaces with the manual loading station.

Proposed are article storage equipment in a semiconductor fabrication facility, the article storage equipment being capable of power supply with a more simplified configuration, and a logistics system of a semiconductor fabrication facility including the same. Article storage equipment in a semiconductor fabrication facility according to one aspect includes a storage unit installed around a rail that provides a travel route of a transport vehicle and configured to store a transport container in which a wafer is accommodated, a purge unit configured to supply an inert gas into the transport container, a control unit configured to identify the transport container stored in the storage unit and control the purge unit to supply the inert gas into the transport container, and a power supply unit configured to supply a current induced from a power supply cable installed along the rail to the control unit.