A substrate transport apparatus auto-teach system for auto-teaching a substrate station location, the system including a frame, a substrate transport connected to the frame, the substrate transport having an end effector configured to support a substrate, and a controller configured to move the substrate transport so that the substrate transport biases the substrate supported on the end effector against a substrate station feature causing a change in eccentricity between the substrate and the end effector, determine the change in eccentricity, and determine the substrate station location based on at least the change in eccentricity between the substrate and the end effector.

A substrate processing apparatus includes: a vacuum transfer chamber including a substrate transfer mechanism provided in a vacuum transfer space thereof to collectively hold and transfer substrates with a substrate holder; and a processing chamber having processing spaces and connected to the vacuum transfer chamber. The processing chamber includes a loading/unloading port provided on a side of the vacuum transfer chamber to allow the vacuum transfer space and the processing spaces to communicate with each other. The processing spaces include a first processing space in which a first process is performed on the substrate and a second processing space in which a second process is performed on the substrate subjected to the first process. The first and second processing spaces are arranged in a direction in which the substrate is loaded and unloaded, and the substrate holder has a length that extends over the first and second processing spaces.

Embodiments disclosed herein generally relate to a system and, more specifically, a substrate processing system. The substrate processing system includes one or more cooling systems. The cooling systems are configured to lower and/or control the temperature of a body of the substrate processing system. The cooling systems include features to cool the body disposed in the substrate processing system using gas and/or liquid cooling systems. The cooling systems disclosed herein can be used when the body is disposed at any height.

A semiconductor manufacturing apparatus, including a chip supply module used for providing a plurality of chips; a load plate supply module including a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module including a chip transfer-loading platform used for suctioning chips. The chip transfer-loading platform is used at a first position for transferring chips from the chip supply module. The chip transfer-loading platform carries the chips to a second position to bond the chips onto a load plate to form a bonding sheet. A packaging module is used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.

An operating method of a vacuum processing apparatus for processing multiple wafers sequentially in a vacuum processing apparatus comprising multiple vacuum transfer containers, adjacent two of which are interlinked, a lock chamber inside which a wafer is housed. The multiple processing units are each subjected to of cleaning the interior thereof upon elapse of a predetermined period. In advance of processing multiple wafers, the operating method configures multiple sets of processing units to process each of the wafers from among the multiple processing units and starts processing of the wafers, delayed by a predetermined time in descending order of the number of processing units included in each of the multiple sets of processing units and in descending order of distance of the processing units included from the lock chamber.

A substrate processing system includes a vacuum transfer module; a plasma process module; a transfer robot in the vacuum transfer module; a stage in the plasma process module; a first ring disposed on the stage and a second ring disposed on the first ring to surround a substrate that is placed on the stage, the second ring having an inner diameter smaller than an inner diameter of the first ring; actuators to move support pins vertically to raise the first and the second rings and a transfer jig; and a controller configured to selectively execute a simultaneous transfer mode in which the transfer robot is caused to simultaneously transfer the first ring and the second ring and a sole transfer mode in which the transfer robot is caused to transfer only the second ring.

There is provided a method of processing an oxygen-containing workpiece. The method of processing an oxygen-containing workpiece includes controlling a fluorine concentration in the oxygen-containing workpiece based on at least one of a kind of a fluorine-containing processing gas, a processing temperature and a processing pressure used for processing the oxygen-containing workpiece.

An apparatus having a drive unit having a first drive axis rotatable about a first axis of rotation and a second drive axis rotatable about a second axis of rotation, the second drive axis being coaxial with and partially within the first drive axis and axially rotatable within the first drive axis. A robot arm has an upper arm connected to the drive unit at the first drive axis, a forearm coupled to the upper arm, the forearm being coupled to the upper arm at a first rotary joint and rotatable about the first rotary joint, the first rotary joint being actuatable by a first band arrangement coupled to the second drive axis, and an end effector coupled to the forearm, the end effector being coupled to the forearm at a second rotary joint and rotatable about the second rotary joint, the second rotary joint being actuatable by a second band arrangement coupled to the first rotary joint. The second band arrangement is configured to provide a variable transmission ratio.

A substrate processing apparatus including a frame, a SCARA arm mounted to the frame at a shoulder joint having two links with at least one end effector dependent therefrom, the links defining an upper arm and a forearm, each end effector pivotally joined to the forearm at a wrist to rotate about a wrist axis, and a drive section with at least one degree of freedom operably coupled to the arm to rotate the arm about a shoulder axis articulating extension and retraction, wherein the end effector is coupled to a wrist joint pulley so that extension and retraction effects rotation of the pulley and end effector as a unit about the wrist axis, and wherein a height of the end effector is within a stack height profile of the wrist joint so that a total stack height is sized to conform with and pass through a pass-through of a slot valve.

A processing system is provided, including a vacuum enclosure having a plurality of process windows and a continuous track positioned therein; a plurality of processing chambers attached sidewalls of the vacuum enclosures, each processing chamber about one of the process windows; a loadlock attached at one end of the vacuum enclosure and having a loading track positioned therein; at least one gate valve separating the loadlock from the vacuum enclosure; a plurality of substrate carriers configured to travel on the continuous track and the loading track; at least one track exchanger positioned within the vacuum enclosure, the track exchangers movable between a first position, wherein substrate carriers are made to continuously move on the continuous track, and a second position wherein the substrate carriers are made to transfer between the continuous track and the loading track.