In a substrate transfer mechanism, a moving body moves horizontally, and a support body is provided at the moving body to rotate about a vertical shaft. A first rotary shaft and a second rotary shaft are disposed vertically. A first arm forms a first substrate support region for supporting a first substrate, the first arm having a base portion connected to the first rotary shaft and a tip portion rotating at an outer side of the support body. A second arm forms a second substrate support region for supporting a second substrate, the second arm having a base portion connected to the second rotary shaft and a tip portion rotating the outer side of the support body. Further, an elevating mechanism is configured to raise and lower the second rotary shaft depending on a direction of the second arm with respect to the support body.

Described herein is a technique capable of suppressing generation of particles and improving a throughput. According to one aspect of the technique, there is provided a substrate processing apparatus including: a loading chamber accommodating a boat; an elevator configured to elevate and lower the boat; a boat exchanging device configured move the boat on the elevator to a first stand-by region and a second stand-by region; a first clean air supplier facing an unloading region in the loading chamber where the boat placed on the elevator is accommodated; a second clean air supplier facing the first stand-by region; and a third clean air supplier facing the second stand-by region, wherein a flow volume ejected from the clean air suppliers are individually controlled so as to form a predetermined air flow in a range of height in which the boat exchanging device in the loading chamber is provided.

A substrate transfer device includes: a planar motor provided in a transfer chamber and including an array of coils; a transfer unit configured to move above the planar motor; and a controller configured to control supply of a current to the array of the coils, wherein the transfer unit includes: a first base including an array of first magnets and configured to move above the planar motor; a second base including an array of second magnets and configured to move above the planar motor, the second base being arranged coaxially with the first base; and at least one arm configured to be extended/contracted by rotating the second base relative to the first base.

An opening/closing apparatus for opening/closing an opening which allows a first chamber and a second chamber adjacent to the first chamber to communicate with each other, includes a planar motor including coils arranged in the first chamber, a moving body including a valve body configured to move on the planar motor and close the opening, and a controller configured to control energization of the coils.

Disclosed is a substrate treating apparatus in which a first treating unit is located rightward of a transportation space. The first treating unit includes a first holder. A second treating unit is located leftward of the transportation space. The second treating unit includes a second holder. The first holder has a center point positioned more rearward than a middle point of the first treating unit in plan view. The second holder has a center point positioned more forward than a middle point of the second treating unit in plan view. The second treating unit has a front end located more rearward than a front end of the first treating unit and more forward than a rear end of the first treating unit. The first liquid reservoir is located leftward of the transportation space and adjacent to and in front of the second treating unit.

An apparatus for transporting a substrate includes a transport chamber including a wall having an opening through which carry-in/out of the substrate to/from the substrate processing chamber is performed and a movement surface having a first magnet, a transport module accommodated in the transport chamber to hold the substrate, including a second magnet to which a magnetic force is applied, and configured to be movable along the movement surface in a floating state from the movement surface, an angle adjusting mechanism provided in the transport chamber to switch an angle of the movement surface between a first angle and a second angle which is closer to a vertical state than the first angle, and a transport passage forming a portion of the transport chamber, and including the movement surface at the second angle to which the movement surface switched to the second angle can be connected.

A substrate processing apparatus includes multiple first substrate processing devices, one or more second substrate processing devices and a transfer unit. Each of the multiple first substrate processing devices is configured to process a substrate one by one. The one or more second substrate processing devices are configured to simultaneously process multiple substrates, which are processed in the multiple first substrate processing devices. The transfer unit is configured to simultaneously carry the multiple substrates, which are processed in the multiple first substrate processing devices, into a same second substrate processing device.

Methods, system, and devices including a robot apparatus with at least one lower arm configured to rotate about a first rotational axis and at least one upper arm rotatably coupled to the at least one lower arm at a second rotational axis that is spaced away from the first rotational axis. The robot apparatus further include a first end effector coupled to the upper arm. The robot apparatus further includes a second end effector coupled to the at least one upper arm. The robot apparatus is suitable for accommodating varying pitches between two adjacent processing chambers or between two adjacent load lock chambers. The robot apparatus may operate in dual substrate handling mode, single substrate handling mode, or a combination thereof. The robot apparatus may also be an off-axis robot.

Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate from a storage container storing one or more substrates including the substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, and setting the process chamber to a maintenance enable state after the substrate processing is completed by stopping the one or more substrates from being transferred into the process chamber.

Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate from a storage container storing one or more substrates including the substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, and setting the process chamber to a maintenance enable state after the substrate processing is completed by stopping the one or more substrates from being transferred into the process chamber.