A process tool and a method are provided for handling a semiconductor substrate as part of a semiconductor fabrication process. The process tool includes a cooling station and a transport system, such as a front-end robot, for positioning the semiconductor substrate in the cooling station during a cooling operation.

A method for conveying a substrate from a first to a second apparatus is provided. Material is applied to the substrate when on the first apparatus. A substrate conveyance apparatus including first and second holding portions is used. As a first step, the substrate is transferred from a first apparatus placement surface to the substrate conveyance apparatus. The substrate is then conveyed from the first apparatus to the second apparatus. The substrate is then transferred from the first holding portion to the second apparatus. In the first step, raising the first holding portion in a state where the first holding portion is inserted in a space under the substrate causes the first holding portion to hold the substrate, and the second holding portion to hold a protection member by holding a holding and receiving portion provided on a protection member surface opposite to a protection member surface facing the substrate.

A hand for holding the substrate includes a hand main body and a plurality of seating members mounted on the hand main body and on which the substrate is to be seated. Each of the plurality of seating member includes a shaft member supported to the hand main body and a lever member that is supported to the shaft member and includes a first end portion including a seating portion on which the substrate is to be seated and a second end portion disposed on a side opposite to the first end portion across the shaft member. At least a part of the plurality of seating members further includes a biasing member for giving a force of rotating the lever member to the lever member such that the second end portion moves downward and a seating sensor configured to detect an upward movement of the second end portion.

The present disclosure provides a substrate treating apparatus capable of stably moving a substrate and discharging an ink at an accurate position. The substrate treating apparatus of the present disclosure comprises: a stage extending in a first direction and moving a substrate along the first direction; moving units disposed on both sides of the stage extending in the first direction, respectively, and configured to move the substrate in the first direction; and a control unit configured to align the substrate, wherein the moving unit includes a first gripper and a second gripper configured to adsorb one side and the other side of the substrate, respectively, after the first gripper adsorbs one side of the substrate, the control unit aligns the substrate, and after the substrate is aligned, the second gripper adsorbs the other side of the substrate and the substrate is moved in the first direction.

Embodiments of the present disclosure relate to a substrate transfer device having a contactless latch and contactless coupling providing the ability to lock and unlock the substrate transfer device at atmospheric and vacuum pressure with without particle generation at a base of the substrate transfer device, the contactless latch, and the contactless coupling. The substrate transfer device includes a lid having one or more lid grooves, a base having one or more base grooves, and a rotation member rotatably coupled to the lid. Each flange of one or more flanges of the substrate transfer device is rotatable in aligned lid grooves and base grooves, and each flange of the one or more flanges has an arm with a ferromagnetic material coupled thereto. The base is coupled to the lid when the ferromagnetic material of the arm is aligned and spaced from a magnetic material of a slot of the one or more base grooves.

A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.

The present invention relates to a damper control system and a damper control method for controlling an opening degree of an exhaust damper connected to an exhaust duct. The damper control system (300) includes an exhaust damper (310), a first pressure sensor (311), and a controller (315) configured to control an opening degree of the exhaust damper (310). The controller (315) is configured to switch the opening degree of the exhaust damper (310) to an opening degree smaller than a full opening on condition that a shutter (217) is opened.

Provided is a maintenance method of a heat treatment apparatus including a chamber having a box shape and provided with a heater and a receiving member that supports a cassette having a box shape including a space in which a workpiece is supported. The maintenance method includes: attaching a loading/unloading jig including a roller on an upper portion and capable of moving the roller upward and downward, to the receiving member; transmitting the cassette supported by the receiving member onto the roller by raising the loading/unloading jig; unloading the cassette to an outside of the chamber by moving the cassette on the roller; loading the cassette into the chamber by moving the cassette on the roller; transmitting the cassette to the receiving member by lowering the loading/unloading jig; and detaching the loading/unloading jig from the receiving member.

A jig includes a disc body, a fixation pin, and a verification pin. The disc body has a first surface, an opposite a second surface, and a thickness separating the first surface from the second surface. A fixation aperture and a verification aperture extend through the thickness of the disc body and couple the first surface to the second surface of the disc body, the fixation aperture located radially outward of the verification aperture. The fixation pin is arranged to be slidably received within the fixation aperture to fix the disc body to an end effector within the semiconductor processing system. The verification pin is arranged to be slidably received within the verification aperture and supported by the disc body to indicate misregistration between the disc body and a load lock in the semiconductor processing system. Semiconductor processing systems and methods of teaching substrate handling are also described.

When pressure in a chamber is brought to atmospheric pressure and the chamber is filled with an inert gas atmosphere, the atmosphere in the chamber is sucked into an oxygen concentration analyzer through a sampling line such that oxygen concentration in the chamber is measured by the oxygen concentration analyzer. When the pressure in the chamber is reduced to less than atmospheric pressure, nitrogen gas is supplied to the oxygen concentration analyzer through an inert gas supply line simultaneously with suspending the measurement of oxygen concentration in the chamber. Even when the measurement of oxygen concentration in the chamber is suspended, reverse flow to the oxygen concentration analyzer from a gas exhaust pipe can be prevented, and the oxygen concentration analyzer can be prevented from being exposed to exhaust from the chamber. The configuration results in maintaining measurement accuracy of the oxygen concentration analyzer in a low oxygen concentration range.