A workpiece processing system and method provides an end effector coupled to a workpiece transfer apparatus. The end effector has support members for selectively contacting and supporting a workpiece. One or more temperature sensors are coupled to the support members and are configured to contact a backside of the workpiece to measure and define one or more measured temperatures of the workpiece. A heated chuck has a support surface at a predetermined temperature, and is configured to radiate heat from the support surface. A controller control the workpiece transfer apparatus to selectively support the workpiece at a predetermined distance from the support surface of the heated chuck to radiatively heat the workpiece, and to selectively transfer the workpiece from the end effector to the support surface of the heated chuck based, at least in part, on the one or more measured temperatures.

Provided are a cleaning device and a method for driving the cleaning device which cleans a wafer after chemical mechanical polishing. The cleaning device includes a cleaning modules and a running beam, the running beam including a first blade and a second blade to insert or remove the wafer with respect to one of the cleaning modules in a second direction, the first blade and the second blade being fixed to the running beam and movable in the second direction, and the cleaning modules including an input module, a megasonic module, a first brush module, a second brush module and a drying module. The driving method includes performing an operation of inserting or removing the wafer in the second direction using the first blade in a first area; and performing an operation of inserting or removing the wafer in the second direction using the second blade in a second area.

A substrate lift bar includes: an outer lift bar which is in shape of a box structure and includes one surface having an opening; an inner lift bar which is able to be accommodated in the outer lift bar and includes a supporting surface used for supporting a substrate; an elevator structure for controlling the inner lift bar to move up and down to change from a first state to a second state and back again; and an anti-static liquid smearing structure for smearing an anti-static liquid onto the inner lift bar if the inner lift bar is in the first state. In the first state, the inner lift bar is completely located inside the outer lift bar, and in the second state, the supporting surface of the inner lift bar is substantially flush with the surface having the opening of the outer lift bar.

In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.

An object of the present invention is to provide a holding jig that is used for applying a liquid bath treatment to a planar workpiece, has good cleaning capabilities, and avoids intimate contact of the planar workpiece with a rear member of the holding jig so that the planar workpiece can be easily detached from the holding jig after cleaning.

A holding jig is used for applying a liquid bath treatment to a planar workpiece. The holding jig comprises a rear member, and a front member that faces the rear member and has an opening portion. The planar workpiece is disposed between the rear member and the front member, and the rear member has a plurality of projections formed on the surface of the rear member facing the front member.

The disclosure relates to substrate processing apparatus, with a first and second reactor, each reactor configured with an elevator to transfer a boat with substrates to the reactor. The apparatus having a boat transfer device to transfer the boat with substrates between a substrate loading station, the first and/or second elevator and a cool down station. The substrate loading station and the cool down station may be arranged on opposite sides of the first and second elevator.

A substrate processing system includes a substrate processing set and a substrate holding unit. The substrate processing set includes a substrate supporting part for supporting a vertical substrate. The substrate holding unit includes two cantilevers and two substrate holding parts. Each of the substrate holding parts is respectively located on each of the cantilevers. The two substrate holding parts are used for holding the substrate vertically. When the substrate holding unit moves next to the substrate processing set and the two substrate holding parts touch the substrate, the two substrate holding parts hold the substrate.

To reduce pumping time of a vacuum treatment chamber served by a transport arrangement in a transport chamber. The vacuum treatment chamber is split in a workpiece treatment compartment and in a pumping compartment in mutual free flow communication and arranged opposite each other with respect to a movement path of the transport arrangement serving the vacuum treatment chamber. The pumping compartment allows providing a pumping port of a flow cross-section area freely selectable independently from the geometry of the treatment compartment.

A two piece shell is employed for intermediate and long term storage of substrates. The shell is formed of two halves that can be juxtaposed in vacuum and externally vented, with the internal vacuum retaining the halves in vacuum-sealed engagement. One of the halves also provides a vacuum-sealing perimeter for selectively sealing to a process chamber during loading and/or unloading of the shell with a substrate. A vacuum monitor or the like may be employed to monitor pressure during storage and provide alerts if the vacuum within the sealed shell is compromised.

In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.