For vacuum treatment of workpieces by a multitude of distinct processing stations (P.sub.11-P.sub.1n, P.sub.21-P.sub.2m) the processing stations are grouped in two groups (I and II). The workpieces are handled towards and from the processing stations of the first group (I) simultaneously, whereat the workpieces are treated by the processing stations of the second group (II) in a selectable individual sequence.

Provided is a rising and lowering method and apparatus and a computer readable storage medium. The rising and lowering method is used to adjust the distance between a panel and an electrode that are spaced apart from and parallel with each other. The method includes steps of: detecting a position of a geometric center of a panel and manipulating geometric center to move along a first direction by a first predetermined distance, wherein the first direction is perpendicular to a direction of panel; and setting up a first area and a second area which are symmetrical with respect to geometric center on panel, and manipulating first area and second area to move along a first direction by a second predetermined distance. The first predetermined distance is not equal to second predetermined distance. The invention can suppress the occurrence of warp on panel and ensure the panel to endure uniform force.

In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.

A transport system includes an overhead transport vehicle that travels on a first track and is capable of delivering and receiving an article to and from a load port of a processing tool; a storage rack having a plurality of shelves that store the articles arranged in a vertical direction; a crane that travels on a second track parallel with the first track and is capable of delivering and receiving the article to and from the load port and the storage rack, respectively; and a first buffer arranged at a position where the crane that has stopped traveling at a position to deliver or receive the article to or from the load port is able to deliver or receive the article.

A substrate lifting apparatus LM according to this invention is built into a stage ST having, on an upper surface, an electrostatic chuck EC for attracting a to-be-processed substrate W hands over the to-be-processed substrate to and from the stage has: lifting pins which are moveable upward and downward between a hidden position in which the lifting pins lie hidden into the stage, and a protruded position protruding upward from the upper surface of the stage; and a driving means for moving the lifting pins upward and downward. The driving means is arranged to be able to stop the upward movement of the lifting pins in an intermediate position in the course of moving the lifting pins upward from the hidden position to the protruded position.

A method and apparatus for soldering a chip (1a) to a substrate (3). A chip carrier (8) is provided between a flash lamp (5) and the substrate (3). The chip (1a) is attached to the chip carrier (8) on a side of the chip carrier (8) facing the substrate (3). A solder material (2) is disposed between the chip (1a) and the substrate (3). The flash lamp (5) generates a light pulse (6) for heating the chip (1a). The heating of the chip (1a) causes the chip (1a) to be released from the chip carrier (8) towards the substrate (3). The solder material (2) is at least partially melted by contact with the heated chip (1a) for attaching the chip (1a) to the substrate (3).

Provided is a substrate cleaning method capable of maintaining a substrate and a cleaning tank in a clean condition after cleaning. In this method, a substrate holder holding the substrate is immersed in a rinsing liquid in the cleaning tank. While a flow of a cleaning liquid is formed on the substrate, the substrate holder and an inner surface of the cleaning tank, the rinsing liquid is discharged from the cleaning tank. While the flow of the cleaning liquid is formed on the substrate, the substrate holder and the inner surface of the cleaning tank, the rinsing liquid is supplied into the cleaning tank, and the substrate holder is immersed in the rinsing liquid. The substrate holder is pulled up from the rinsing liquid.

To reduce pumping time of a vacuum treatment chamber served by a transport arrangement in a transport chamber. The vacuum treatment chamber is split in a workpiece treatment compartment and in a pumping compartment in mutual free flow communication and arranged opposite each other with respect to a movement path of the transport arrangement serving the vacuum treatment chamber. The pumping compartment allows providing a pumping port of a flow cross-section area freely selectable independently from the geometry of the treatment compartment.

In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.

The disclosure relates to substrate processing apparatus, with a first and second reactor, each reactor configured with an elevator to transfer a boat with substrates to the reactor. The apparatus having a boat transfer device to transfer the boat with substrates between a substrate loading station, the first and/or second elevator and a cool down station. The substrate loading station and the cool down station may be arranged on opposite sides of the first and second elevator.