Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. Electrodes may be disposed adjacent the process volume and process fluid is provided to the process volume via a plurality of fluid conduits to facilitate immersion field guided post exposure bake processes. A post process chamber for rinsing, developing, and drying a substrate is also provided.

Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. Electrodes may be disposed adjacent the process volume and process fluid is provided to the process volume via a plurality of fluid conduits to facilitate immersion field guided post exposure bake processes. A post process chamber for rinsing, developing, and drying a substrate is also provided.

A substrate processing module of a substrate processing device includes a first tank and a second tank that are arranged in a first direction and in which a substrate can be disposed, first transport units and that move the substrate into the second tank and the first tank, and a second transport unit that transports the substrates in a second direction intersecting the first direction and transfers the substrates to and from the first transport units. The second transport unit includes a chuck that holds the substrate and passes above the first tank, and an actuator that moves the chuck in the second direction. The actuator of the second transport unit is disposed on a side of the first tank in the first direction in the substrate processing module.

A substrate processing system includes a cluster module having substrate processing devices, a load port through which a substrate is loaded, and a substrate cleaning device between the cluster module and the load port, the substrate cleaning device being configured to clean the substrate processed in the substrate processing devices, and the substrate cleaning device including a substrate cleaner having a cleaning chuck to support the substrate, and a cleaning nozzle configured to spray a fluid toward the cleaning chuck.

A semiconductor process chamber includes: a reaction chamber; a transfer chamber below the reaction chamber connected to the transfer chamber through a bottom opening; a base with a lifting shaft connected to a bottom of the base, where the base is able to rise and descend between the reaction chamber and the transfer chamber through the bottom opening; and an elastic annular sealing structure. The annular sealing structure is below the base and surrounding the lifting shaft of the base. When the base descends into the transfer chamber, the base presses down and compress the annular sealing structure; and when the base rises into the reaction chamber and pressure on the annular sealing structure is released, the annular sealing structure stretches until it abuts a bottom wall of the reaction chamber. to seal the bottom opening.

An electrostatic chuck for clamping workpieces having differing diameters is provided. A central electrostatic chuck member associated with a first workpiece and a first peripheral electrostatic chuck member associated with a second workpiece are provided. An elevator translates the first peripheral electrostatic chuck member with respect to central electrostatic chuck member between a retracted position and an extended position. In the retracted position, the first workpiece contacts only the first surface. In the extended position, the second workpiece contacts the first surface and the second surface. A first peripheral shield generally shields the second surface when the first peripheral electrostatic chuck member is in the retracted position. Additional peripheral electrostatic chuck members and peripheral shields can be added to accommodate additional workpiece diameters.

Apparatus transfers a plate-shaped workpiece to/from a holding surface of a chuck table. The apparatus includes a holding unit and a moving mechanism. The holding unit includes at least two holding members for holding the outer edge of the workpiece, a support plate for supporting the holding members so as to allow movement of the holding members toward or away from the outer edge of the workpiece, and a moving unit for moving the holding members. Each holding member includes a rod portion vertically movably extending downward through the support plate, an engaging portion formed on the outer circumference of the rod portion at the lower end thereof for engaging the outer edge of the workpiece, and a nozzle portion for discharging a fluid from the lower surface of the rod portion toward the holding surface to thereby float the workpiece from the holding surface.

Disclosed is a manufacturing apparatus of a light-emitting element including: a main transporting route extending in a first direction, the main transporting route comprising first and second transfer devices connected through a first transporting chamber; a sub-transporting route extending in a second direction intersecting the first direction, the sub-transporting route comprising a second transporting chamber connected to the first or second transfer device and a delivery chamber connected to the second transfer chamber; and a plurality of first treatment chambers connected to the delivery chamber. The main transporting route is configured to transfer a substrate to be treated in a horizontal state, and one of the plurality of treatment chambers is configured to hold the substrate in a vertical state during treatment.

Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. Electrodes may be disposed adjacent the process volume and process fluid is provided to the process volume via a plurality of fluid conduits to facilitate immersion field guided post exposure bake processes. A post process chamber for rinsing, developing, and drying a substrate is also provided.

The present disclosure provides a processing chamber applied to semiconductor processing equipment, including a transfer chamber and a plurality of reaction chambers above the transfer chamber. The plurality of reaction chambers are all communicatively connected to the transfer chamber through bottom openings. A plurality of bases can ascend and descend between the reaction chambers and the transfer chamber. The processing chamber further includes a transfer mechanism and a carrier mechanism arranged in the transfer chamber. The transfer mechanism is configured to transfer wafers from outside the processing chamber to the carrier mechanism or onto the plurality of bases, and to transfer the wafers on the plurality of bases out of the processing chamber. The carrier mechanism is configured to carry the plurality of wafers and can transfer the plurality of wafers carried by the carrier mechanism onto the plurality of bases.