Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

A substrate transport apparatus includes: a support configured to support a substrate; a moving mechanism configured to move the support in a lateral direction in order to transport the substrate from a first placement portion to a second placement portion, each of the first placement portion and the second placement portion being configured to place thereon the substrate; and an ultrasonic sensor provided on the support and configured to detect the substrate placed on the first placement portion.

A vertical batch furnace assembly for processing wafers having a cassette handling space, a wafer handling space, and a first wall and separating the cassette handling space from the wafer handling space. The first wall has at least one wafer transfer opening in front of which, at a side of the first wall which is directed to the cassette handling space, a wafer transfer position for a wafer cassette is provided. The cassette handling space comprises a cassette storage having a plurality of cassette storage positions and a cassette handler configured to transfer wafer cassettes between the cassette storage positions and the wafer transfer position. The cassette handler has a first cassette handler arm and a second cassette handler arm.

A substrate transfer apparatus includes a base, an arm, an end effector provided at a tip of the arm and having first and second tip portions that are bifurcated, a light emitting unit, a light receiving unit, and a control device controlling an operation of the arm. The control device controls an operation of the arm so that light straightly traveling through a tip of the end effector scans edges of a plurality of substrates accommodated in a front opening unified pod (FOUP), and compares shape patterns of a measured waveform of an output value continuously changed in the light receiving unit with shape patterns of a reference waveform for comparison according to a relative positional relationship between the light and substrate during the operation of the arm and diagnoses at least one of a state of the substrate, the FOUP, and the end effector based on a comparison result.

There is provided an EFEM, including: at least one load port; a housing closed by connecting the at least one load port to an opening provided on a side wall of the housing and configured to define, in the housing, a transfer chamber for transferring a substrate; a substrate transfer device disposed in the transfer chamber and configured to transfer the substrate; an inert gas supply unit configured to supply an inert gas to the transfer chamber; and a gas discharge unit configured to discharge a gas in the transfer chamber, wherein the at least one load port includes: an opening/closing mechanism capable of opening and closing a lid of a mounted FOUP; and an accommodation chamber kept in communication with the transfer chamber and configured to accommodate a part of the opening/closing mechanism.

This extendable device includes: a base member; a first ball screw that is provided to the base member and that rotates according to a driving force supplied from a drive source; a first movable member that is coupled to the base member via the first ball screw and that moves relative to the base member as the first ball screw rotates; a second ball screw that is provided to the first movable member and that rotates as the first movable member moves; a third ball screw that is provided to the first movable member; a transmission mechanism that transmits the rotation of the second ball screw to the third ball screw; and a second movable member that is coupled to the first movable member via the third ball screw and that moves relative to the first movable member as the third ball screw rotates.

A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.

An apparatus including a drive having motors and at least two coaxial drive shafts; an arm connected to the drive, where the arm is configured to support at least one substrate thereon; and a transmission connected between the drive and the arm, where the transmission includes an eccentric bearing and a linkage, where the linkage is connected between a first one of the coaxial drive shafts and the arm, where the eccentric bearing is connected to a second one of the coaxial drive shafts, where the arm comprises an aperture, where the eccentric bearing is located in the aperture, and where the eccentric bearing is configured to contact the arm in the aperture.

The substrate treating apparatus includes a liquid supply unit for supplying a treating liquid to a substrate supported by a support unit, the liquid supply unit includes a nozzle member for discharging the treating liquid; and a driving member for moving the nozzle member to a standby position and a process position, the nozzle member includes a body having a buffer space and a discharge port configured to discharge the treating liquid; and a rotation member for changing the body between a first state and a second state by a rotation, the first state is a state at which a treating liquid filled in the buffer space is maintained so the treating liquid does not flow to the discharge port, and the second state is a state at which the treating liquid filled in the buffer space is discharged to an outside of the body through the discharge port.

The disclosure describes devices and systems for a two-sided seal for a load port, and methods for using said seal. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening. The load port can also include a seal coupled to the frame. The seal can include a first contact point configured to engage with a load port door when the load port door is in a first position, and configured to disengage with the load port door when the load port door is in a second position and a second contact point configured to engage with a front of a substrate carrier when the substrate carrier is docked on the load port.