Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

A purge nozzle assembly comprising a purge nozzle body including an inlet opening and an outlet opening. The outlet opening opens into a purge nozzle contact surface. Additionally, the purge nozzle assembly includes a mounting body for connecting the purge nozzle assembly to an external frame member. A mechanical coupling mechanism moveably couples the purge nozzle body with the mounting body and is configured to allow tilting of the purge nozzle body relative to the mounting body as well as to allow a substantial lateral movement of the purge nozzle body relative to the mounting body, wherein the lateral movement has a movement component which is substantially parallel to the purge nozzle contact surface.

A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

An article transport vehicle includes a travel body; a holding device that holds an article; and a lift device that is on the travel body, and that raises and lowers the holding device with respect to the travel body. The holding device includes: a connection portion connected to the lift device and an article support portion that supports the article; an elastic support mechanism that is between the article support portion and the connection portion, and that supports the article support portion against the connection portion while being elastic in a vertical direction, and a guide mechanism that guides the article support portion in the vertical direction with respect to the connection portion. The guide mechanism allows the article support portion to move parallel with the vertical direction with respect to the connection portion and restricts swinging of the article support portion with respect to the connection portion.

Optimizing purge flow parameters in a substrate container, includes streaming a purge working fluid into an interior of the substrate container, discharging the purge working fluid from the interior of the substrate container, and varying purge flow parameters of the purge working fluid for a predetermined period of time, detecting at least one environmental condition in the interior of the substrate container during the predetermined period of time, determining optimized purge flow parameters based on the varied purge flow parameters and the at least one detected environmental condition during the predetermined period of time, and adjusting the streaming and the discharging in accordance with the optimized purge flow parameters. The substrate container may include, for example, a front opening unified pod or a reticle pod.

A substrate processing apparatus includes: a carrier storage rack configured to place and store a carrier that accommodates a substrate; a gas supply configured to supply an inert gas into the carrier placed on the carrier storage rack; and a controller configured to control whether to supply the inert gas into the carrier based on at least one of carrier information and substrate information.

A load port adapted for wafer cassettes of different sizes detects storage states of wafers stored in the wafer cassettes. The load port includes a body, a positioning mechanism, a sensing mechanism, and a detecting mechanism. The body has a carrier base. The positioning mechanism is disposed on the body and has a positioning unit disposed on the carrier base, a hooking unit, and a limiting unit. The hooking unit is disposed in the body and has a driving assembly and a hooking element. The driving assembly is disposed in the body. The hooking element is mounted to the driving assembly. The sensing mechanism is disposed on the carrier base. The detecting mechanism is disposed on the body, detects the storage states of wafers stored in the wafer cassette, and has a first detecting assembly and a second detecting assembly spaced apart from each other.

The present disclose relates to a substrate delivery method that uses a substrate delivery device including an elevating body for moving upward and downward a plurality of mounting parts, on which a transport container for a substrate is placed. The substrate delivery method of the present disclosure comprises loading and unloading the substrate in the transport container; temporarily suspending the loading and unloading for the transport container when the external transport mechanism tries to deliver a transport container to and from another mounting part; and positioning said other mounting part at the delivery height position and delivering the transport container to and from the external transport mechanism.

In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.

There is provided a transfer abnormality detection system capable of receiving information from a container transfer device configured to transfer a transfer container and a mounting device configured to load the transfer container that is transferred by the container transfer device, the system including: a determination part configured to: record which container transfer device is transferring the transfer container based on a container identification ID assigned to each transfer container and a transfer device identification ID assigned to each transfer device; and determine an abnormality in either or both of the container transfer device and the transfer container by combining vibration detection information of the container transfer device obtained by a vibration detection part provided in the container transfer device and state detection information of the transfer container obtained by a container state detection part provided in the mounting device.