Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.

An article placement apparatus, a stocker provided including the article placement apparatus, and a transport vehicle system, prevent an article from being damaged at time of placement of the article, even when an erector vertically erecting from the support is provided. The article placement apparatus includes a support on which the storage container is placed, and a side erector that vertically erects from the support and extends in a transfer direction of the storage container, the side erector restricting the storage container placed on the support from moving in a width direction that is horizontally orthogonal to the transfer direction. The side erector is provided with a guide that guides the storage container obliquely upward from the front side toward the rear side when the storage container transferred by the stacker crane comes into contact.

The invention relates to a cassette supply system to store and handle cassettes for substrates and a processing apparatus for processing substrates equipped with said system. The system having a cassette storage provided with base plate constructed and arranged to support cassettes. Also a cassette handler with an end effector with at least one protrusion to support and position the cassette on the end effector is provided to transfer cassettes to and from the base plate. The base plate may be provided with a substantially flat surface to support the cassettes.

The inspection system 100 is constructed by assembling inspection modules 10 configured to inspect inspection target objects and a transfer module 20 configured to transfer the inspection target object to the corresponding inspection module. The inspection system 100 is configured to transfer the inspection target objects into the inspection modules by the transfer module and inspect the inspection target objects in sequence. The adjustment method of the inspection system includes preparing an auxiliary element having a preset function of the inspection module 10 or a preset function of the transfer module 20; and adjusting, with respect to an adjustment which needs to be performed after the inspection system is constructed, the transfer module 20, or each of the inspection modules 10 or the inspection modules 10 as a single system by connecting the auxiliary element 60 (70, 80, 90) to the transfer module 20 or the inspection module 10.

An apparatus configured to load or unload a mask pod includes a first load port supporter and a second load port supporter spaced apart from the first load port supporter. Each of the first load port supporter and the second load port supporter includes at least portions of an L-shaped rectangular prism. The first load port supporter and the second load port supporter are disposed diagonally around a rectangular area, where first inner sidewalls of the first load port supporter and second inner sidewalls of the second load port supporter delimit boundaries of the rectangular area, and where a first width of the rectangular area is equal to a second width of the mask pod, and a first length of the rectangular area is equal to a second length of the mask pod.

A leveling sensor, a load port including a leveling sensor, and a method of leveling a load port using a load port are disclosed. In an embodiment, a sensor includes an accelerometer configured to detect leveling and vibration of a load port and produce a plurality of data; a plurality of indicator lights configured to display a level measurement and a level direction based on the leveling of the load port; a processor configured to process the data produced by the accelerometer; and a wired connection configured to connect the processor to an external device.

Substrate loading device including a frame adapted to connect the substrate loading device to a substrate processing apparatus, the frame having a transport opening through which substrates are transported between the loading device and processing apparatus, a cassette support for holding at least one substrate cassette container, and cassette support purge ports with purge port nozzle locations disposed on the cassette support, each nozzle location being configured so that a nozzle at the nozzle location couples to at least one purge port of the substrate cassette container, wherein each nozzle location defines an interchangeable purge port nozzle interface so that different interchangeable purge port nozzles are removably mounted to respective nozzle interfaces of the nozzle locations that correspond to the different nozzle configurations of the interchangeable purge port nozzle modules, in conformance with and effecting coupling to different ports of different substrate cassette containers having different purge port characteristics.

A processing apparatus includes a chuck table that holds a workpiece, a cutting unit that processes the workpiece held by the chuck table, a cassette placing region where a cassette is placed, a carrying unit that carries the workpiece between the cassette placed in the cassette placing region and the chuck table, and a surrounding wall that partitions a route for lifting the cassette upward and downward from an external space, in a space directly above the cassette placing region. A height of the surrounding wall is equal to or more than a height of a ceiling wall of the processing apparatus and is so as not to interfere with the cassette held by a carrier that travels.

Electronic device processing systems including environmental control of the factory interface, a carrier purge chamber, and one or more substrate carriers are described. One electronic device processing system has a factory interface having a factory interface chamber, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface, the carrier purge chamber, and the one or more substrate carriers and operational to control an environment at least within the factory interface chamber, carrier purge chamber, and the one or more substrate carriers. Methods for processing substrates are described, as are numerous other aspects.

A method for wafer pod handling includes at least the following steps. A wafer pod is moved into a load chamber by conveying the wafer pod to the load chamber via one side of a track and removing a cover of the load chamber via an opposing side of the track. The wafer pod that is inside the load chamber is coupled to a port of a platform that is linked to the load chamber. A wafer to be processed is moved from the wafer pod and out of the load chamber to the platform for performing a semiconductor process. Other methods for wafer pod handling are also provided.