A substrate processing system includes a hinge assembly configured to allow a substrate support and an RF bias assembly to slide, from a docked position to an undocked position, relative to other components of a processing chamber. A make-break connector is configured to supply fluid to at least one of the substrate support and the RF bias assembly. The make-break connector includes a first portion including a first fluid passage connected to a first conduit. A second portion includes a second fluid passage connected to a second conduit. The first fluid passage in the first portion fluidly communicates with the second fluid passage in the second portion. The first portion is configured to slide with the substrate support and the RF bias assembly relative to the second portion and the other portions of the processing chamber. The first portion is located inwardly relative to the second portion.

A factory interface for an electronic device manufacturing system can include a load lock disposed within the interior volume of a factory interface and a factory interface robot disposed within the interior volume of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can comprise a vertical tower, a plurality of links, and an end effector.

A semiconductor fabrication facility (FAB) is provided. The FAB includes a number of processing tools. The FAB also includes a sampling station connected to the processing tools. In addition, the FAB includes a detection vehicle detachably connected to the sampling station and comprising a metrology module. When the detection vehicle is connected to the sampling station, a gas sample is delivered from one of the processing tools to the metrology module of the detection vehicle via the sampling station for performing a measurement of a parameter in related to the gas sample by the metrology module. In addition, the FAB includes a control system configured to issue a warning when the parameter in related to the gas sample from the one of the processing tools is out of a range of acceptable values associated with the one of the processing tools.

An equipment front end module (EFEM) includes sidewalls forming an EFEM chamber configured to receive inert gas from an inert gas supply. The sidewalls include a first sidewall configured to attach to a panel first side of a panel. The panel forms a panel opening extending between the panel first side and a panel second side. The panel second side is configured to attach to a side storage pod. The EFEM further includes a robot disposed in the EFEM chamber. The robot is configured to transfer substrates from the EFEM chamber into the side storage pod via the panel opening. An exhaust conduit is coupled to the side storage pod to exhaust gas from the side storage pod to an exterior of the side storage pod.

Electronic device processing systems including an equipment front end module (EFEM) with a side storage pod are described. The EFEM includes an EFEM chamber and a recirculation duct. The side storage pod is fluidly coupled to the recirculation duct. The side storage pod includes an interior chamber and a side storage container disposed within the interior chamber. The side storage container is configured to receive one or more substrates from the EFEM chamber. The electronic device processing system further includes an environmental control system. The environmental control system is configured to circulate a purge gas between the EFEM chamber and the side storage pod via the recirculation duct.

The present disclosure relates to systems and methods for reducing the humidity within a FOUP (Front Opening Unified Pod) when loaded on an EFEM (Equipment Front End Module) for transfer of a semiconductor wafer substrate during fabrication processes. A deflector of specified structure is placed inside the EFEM above the load port of the FOUP. The deflector directs airflow in the EFEM away from the load port. The deflector includes a body with a plurality of apertures in the deflector body, and with a sloped front surface. Thus, the degree of penetration of high-humidity air from the EFEM into the FOUP is reduced.

A substrate storage rack for a semiconductor processing system includes a bottom plate, a top plate, and a column assembly. The top plate is spaced apart from the bottom plate, the column assembly connects the top plate to the bottom plate, and a ball member is compressively seated within the column assembly. The ball member protrudes from the column assembly in a direction toward the top plate to support a substrate within the substrate storage rack and on the ball member. Semiconductor processing systems and methods of making substrate storage racks are also described.

A load port apparatus connects a main opening of a wafer transportation container to a frame opening. The apparatus includes an installation unit, a frame unit, a flange clamp unit, and a detection unit. The installation unit includes an installation table configured to install the container and relatively move to the frame opening. The frame unit is upright upward from the installation unit and includes the frame opening. The flange clamp unit includes an engagement section and a drive section. The engagement section is engageable with a flange surrounding an outer circumference of the main opening. The drive section drives the engagement section to carry out an engagement operation and a separation operation. The detection unit detects the engagement operation by the flange clamp unit with classification into a normal engagement operation and an abnormal engagement operation.

A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.

A platform is of a side storage pod. The platform includes an upper surface and kinematic pins extending from the upper surface within a chamber of the side storage pod to engage a lower surface of a side storage container in the chamber to level the side storage container in the chamber.