A semiconductor manufacturing apparatus including at least one load module including a load port on which a substrate container is located, a plurality of substrates being mountable on the substrate container; at least one loadlock module including a loadlock chamber directly connected to the substrate container, the loadlock chamber interchangeably having atmospheric pressure and vacuum pressure, a first transfer robot within the loadlock chamber, and a substrate stage within the loadlock chamber, the plurality of substrates being mountable on the substrate stage; a transfer module including a transfer chamber connected to the loadlock chamber, a second transfer robot within the transfer chamber, and a substrate aligner within the transfer chamber; and at least one process module including at least one process chamber connected to the transfer module.

A load port includes a dock plate on which a container storing a substrate is placed, a port plate, a moving mechanism configured to move the dock plate between a dock position and an undock position, a gas supply nozzle unit provided in the dock plate and configured to contact a bottom surface of the container placed on the dock plate and supply a gas into the container, and a pressing unit provided above the dock plate and configured to press the container placed on the dock plate downward. The pressing unit includes a contact member brought into contact with the container placed on the dock plate, and a driving mechanism configured to move the contact member between a first position apart from the container and a second position in contact with the container.

A method includes initiating a gas flow of a first gas parallel to a wall of an interface module to create an air curtain across an opening defined in the wall. The method includes moving an interface door to reveal the opening, wherein the air curtain restrains a second gas within the interface module from passing through the opening. The method includes transferring a semiconductor wafer through the opening and moving the interface door to cover the opening. The method includes halting the gas flow of the first gas after moving the interface door to cover the opening.

A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. The stocker includes a moving mechanism for moving the stocker into and out of the stocker setting section.

A connecting mechanism includes a mounting unit, a substrate transfer port, a door closing or opening the substrate transfer port, a coupling mechanism coupling a cover of the substrate container mounted on the mounting unit with the door, and a gas exhaust/purge unit. First, second and third seal members respectively seal a first space between a peripheral portion of the substrate transfer port and the door, a second space between the door and the cover of the substrate container, and a space between the peripheral portion of the substrate transfer port and the main body. The gas exhaust unit exhausts the first space and a second space. The purge gas, which has been supplied into the substrate container by the gas exhaust/purge unit, is supplied into the first and the second space by allowing the gas exhaust unit to exhaust the first and the second space.

A substrate processing apparatus includes: a load port into and out of which the transport container is carried; and an apparatus controller that controls operations in the load port. The apparatus controller includes a storage unit that stores transition data of parameter values sent from outside based on a transport container identification code. The transition data of the parameter values each comprises a usage count of the transport container and a corresponding parameter value that quantifies a result of at least one of an operation performed to remove the lid after the transport container is carried into the load port and an operation performed to carry the container out of the load port. The apparatus controller further includes a determination unit that determines, after a transport container is carried into the load port, presence or absence of an abnormality in that transport container based on a parameter value associated with at least one of carrying-in or carrying-out of that transport container, and past transition data of parameter values associated with that transport container.

A substrate treating apparatus, a carrier transporting method, and a carrier buffer device. A carrier transport mechanism transports a carrier between platforms of two openers and carrier storage shelves. The carrier storage shelves and the carrier transport mechanism are each mounted on a first treating block. Accordingly, the carrier storage shelves and the carrier transport mechanism are not extended horizontally from the indexer block, achieving a compact footprint of a substrate treating apparatus.

The present invention provides a container opening/closing device for opening and closing a lid of a container. The container comprises a container body including an opening and the lid detachably attached to the opening. The device comprises an opening/closing mechanism including a holding portion for holding the lid and a pressing mechanism. The opening/closing mechanism opens and closes the opening by moving the holding portion between a closing position and an open position. The pressing mechanism presses a peripheral edge of the holding portion toward the container body when the opening/closing mechanism moves the lid from the open position to the closing position.

In a vacuum processing apparatus, a load lock module includes a housing and substrate holding sections, the housing having first substrate transfer ports formed on one of right and left sides thereof and a second substrate transfer port formed on a rear side thereof, and each substrate holding section being configured to hold a substrate on a right or left side in the housing. Further, a normal pressure transfer chamber extends over or under the housing from one of the right and left sides of the housing to the other one thereof so that each first substrate transfer port is opened. The normal pressure transfer chamber includes a stacked transfer region that is a region overlapping the housing. Further, a normal pressure transfer mechanism transfers the substrate between each substrate holding section and a transfer container carried into each of loading/unloading ports via the stacked transfer region.

A substrate transport system includes a carrier having a housing forming an interior environment having an opening for holding at least one substrate and a door for sealing the opening from an outside atmosphere where when sealed the interior environment is configured to maintain an interior atmosphere therein, the housing including a fluid reservoir exterior to the interior environment and configured to contain a fluid, forming a different atmosphere in the fluid reservoir than the interior atmosphere, to form a fluidic barrier seal that seals the interior environment from an environment exterior to the carrier.