In one implementation, a semiconductor package includes an integrated circuit (IC) attached to a die paddle segment of a first patterned conduct carrier and coupled to a switch node segment of the first patterned conductive carrier by an electrical connector. In addition, the semiconductor package includes a second patterned conductive carrier situated over the IC, a magnetic material situated over the second patterned conductive carrier, and a third patterned conductive carrier situated over the magnetic material. The second patterned conductive carrier and the third patterned conductive carrier are electrically coupled so as to form windings of an integrated inductor in the semiconductor package.

An electronic component built-in substrate includes an insulating substrate having a through hole and an inner wall surrounding the through hole, an electronic component accommodated in the through hole of the substrate, a sealing member filling the through hole such that the sealing member is covering the electronic component in the through hole of the substrate and exposing a terminal of the electronic component on a first side of the substrate, and a shield layer structure including a first metal film and a second metal film formed such that the first metal film is formed on the inner wall of the substrate and surrounding the through hole of the substrate and that the second metal film is formed on a second side of the substrate on the opposite side with respect to the first side and covering an opening of the through hole on the second side of the substrate.

According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.

A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.

Provided herein is a light diffusing material having excellent light transmittance, light diffusion properties, and mechanical properties. The light diffusing material comprises a curable organopolysiloxane composition, comprising: A) an organopolysiloxane having reactive groups; B) one or more inorganic fillers; and C) an organosilicon compound different from component A), and comprising component(s) C1) and/or C2). Component C1) is an organosilicon compound having a reactive functional group that can bond with component A), a hydrolyzable silyl group and/or a silicon atom-bonded hydroxyl group, and two or more silicon atoms, in the molecule. Component C2) is an organosilicon compound having a reactive functional group with three or more carbon atoms, which can bond with component A), a hydrolyzable silyl group and/or a silicon atom-bonded hydroxyl group, and one or more silicon atoms, in the molecule. The mass of component B) is 30 to 95% relative to the mass of the overall composition.

A condensation curable gel composition is disclosed. The composition comprises: (i) at least one condensation curable silyl terminated polymer having at least one hydrolysable and/or hydroxyl functional group(s) per molecule; (ii) a cross-linker selected from the group of a silicone, an organic polymer, a monosilane or a disilane molecule which contains at least two hydrolysable groups per molecule; and (iii) a condensation catalyst selected from the group of titanates, zirconates or tin (II). The molar ratio of hydroxyl and/or hydrolysable groups in polymer (i) to hydrolysable groups from component (ii) is between 0.5:1 and 1:1 using a monosilane cross-linker or 0.75:1 to 3:1 using disilanes. The titanates and zirconates comprise M-OR functions where M is titanium or zirconium and R is an aliphatic hydrocarbon group. The molar ratio of M-OR or tin (II) functions to the hydroxyl and/or hydrolysable groups in polymer (i) is comprised between 0.01:1 and 0.5:1.

A semiconductor module includes first to fourth semiconductor elements, each having an upper-surface electrode and a lower-surface electrode, first to fourth conductive layers, each extending in a first direction and being independently disposed side by side in a second direction orthogonal to the first direction, and an output terminal connected to the second and third conductive layers. The lower-surface electrodes of each of the first to fourth semiconductor elements are respectively conductively connected to the first to fourth conductive layers. The third conductive layer and the fourth conductive layer are disposed between the first conductive layer and the second conductive layer and are connected to the output terminal to have an equal potential.

A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

A semiconductor device includes a semiconductor layer that has a main surface, an electrode pad that is formed on the main surface, a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened, the rewiring being formed on the main surface such as to be drawn out to a region outside the electrode pad, and a resin that covers the second wiring surface on the main surface and that seals the rewiring.

A composition containing a fluorine-containing polymer and a silicon oxide represented by formula: SiO.sub.x, where 0<x<2. In a preferred embodiment, the composition contains a cross-linking agent. Also disclosed is a crosslinked product which may be a sealing material obtained by crosslinking the composition.