Coated electronic components of a circuit assembly are provided, comprising: one or more lead frames, one or more chips, connection wires, a moisture barrier coating layer, and an encapsulating plastic coating layer. The moisture barrier coating layer may be applied to the electronic component with the encapsulating plastic coating layer applied on top of the moisture barrier coating layer, or vice versa; such that only lead frames are exposed. Also provided are electronic components of a circuit assembly, comprising: one or more lead frames, one or more chips, connection wires, one or more leads extending from the coated electronic component, a moisture barrier coating layer, and an encapsulating plastic coating layer. The encapsulating plastic coating layer is applied to the electronic component and the moisture barrier coating layer is applied on top of the entire encapsulating plastic coating layer on all sides, such that only the leads are exposed.

A method of packaging a radio frequency (RF) transistor device includes attaching one or more electronic devices to a carrier substrate, applying an encapsulant over at least one of the one or more electronic devices, and providing a protective structure on the carrier substrate over the one or more electronic devices. A packaged RF transistor device includes a carrier substrate, one or more electronic devices attached to the carrier substrate, an encapsulant material over at least one of the one or more electronic devices and extending onto the carrier substrate, and a protective structure on the carrier substrate over the one or more electronic devices and the encapsulant material.

A condensation curable gel composition is the disclosed. The composition comprises: (i) at least one condensation curable silyl terminated polymer having at least one hydrolysable and/or hydroxyl functional group(s) per molecule; (ii) a cross-linker selected from the group of a silicone, an organic polymer, a monosilane or a disilane molecule which contains at least two hydrolysable groups per molecule; and (iii) a condensation catalyst selected from the group of titanates, zirconates or tin (II). The molar ratio of hydroxyl and/or hydrolysable group(s) in polymer (i) to hydrolysable groups from component (ii) is between 0.5:1 and 1:1 using a monosilane cross-linker or 0.75:1 to 3:1 using disilanes. The titanates and zirconates comprise M-OR functions where M is titanium or zirconium and R is an aliphatic hydrocarbon group. The molar ratio of M-OR or tin (II) functions to the hydroxyl and/or hydrolysable groups in polymer (i) is comprised between 0.01:1 and 0.5:1.

A method of forming a layer structure is provided. The method may include plasma-treating a metal surface with a hydrogen-containing plasma, thereby forming nucleophilic groups over the metal surface, and forming an organic layer over the metal surface, wherein the organic layer comprises silane and is covalently bonded to the nucleophilic groups.

Provided is a silicone gel composition that provides a silicone gel cured product having excellent storage stability as well as heat resistance and transparency at high temperatures, being capable of maintaining low elastic modulus, low stress, and high transparency even when used for long periods of time, particularly under conditions where only one direction of a member is exposed to high temperatures, and having resistance to cracking, peeling, and the like. The silicone gel composition comprises (A) a branched organopolysiloxane having an alkenyl group bonded to a silicon atom, (B-1) a branched organohydrogenpolysiloxane having three or more silicon atom-bonded hydrogen atoms in a molecule, and containing at least 20 mol % or more of T units and Q units of all siloxane units, (B-2) a chain organohydrogenpolysiloxane having two silicon atom-bonded hydrogen atoms in one molecule, (C) a platinum-based addition reaction catalyst, and (D) a reaction product of ceric salt.

A method of packaging an RF transistor device includes attaching one or more electronic devices to a carrier substrate, applying an encapsulant over at least one of the one or more electronic devices, and providing a protective structure on the carrier substrate over the one or more electronic devices. A packaged RF transistor device includes a carrier substrate, one or more electronic devices attached to the carrier substrate, an encapsulant material over at least one of the one or more electronic devices and extending onto the carrier substrate, and a protective structure on the carrier substrate over the one or more electronic devices and the encapsulant material.

The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.

The present invention relates to a semiconductor device including: a semiconductor substrate having: an active region through which a main current flows; and a termination region around the active region; a polyimide film disposed in the active region and the termination region; and a passivation film disposed as a film underlying the polyimide film, wherein the termination region includes, in order from a side of the active region, a breakdown voltage holding region and an outermost peripheral region, the polyimide film is disposed except for a dicing remaining portion of the outermost peripheral region, and the passivation film is disposed, as the underlying film, at least in a region where the polyimide film is disposed.

The present invention provides a thermally conductive silicone potting composition. In one embodiment the thermally conductive silicone potting composition comprises: a first part comprising: (a) a vinyl organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 μm and less than 3 μm, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 μm and less than 15 μm, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 μm and less than or equal to 100 μm, (f) a catalyst, and a second part comprising: (b) a hydride organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 μm and less than 3 μm, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 μm and less than 15 μm, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 μm and less than or equal to 100 μm. The present invention also provides a thermal potting adhesive containing the thermally conductive silicone potting composition, a use of the thermally conductive silicone potting composition in an electronic component, and an electronic component, which is potted using the thermally conductive silicone potting composition.

An ultraviolet curable organopolysiloxane composition which contains: (A) a linear or branched organopolysiloxane which contains, as monovalent substituents bonded to a silicon atom at an end of the molecular chain, at least three groups represented by formula (1) and/or formula (2) in each molecule, while having the main chain composed of repeated diorganosiloxane units ##STR00001##
(in the formulae, a represents a number of 1-3; and the broken line represents a bonding hand); (B) a linear or branched organopolysiloxane which contains at least two groups represented by formula (3) in each molecule, while having the main chain composed of repeated diorganosiloxane units
R.sup.1.sub.bR.sup.2.sub.3-bSi  (3)
(in the formula, R.sup.1 represents an alkenyl group; R.sup.2 represents a monovalent hydrocarbon group; and b represents a number of 1-3); and (C) a photoinitiator. With use of this ultraviolet curable organopolysiloxane composition, the hardness of a cured product obtained therefrom is easily controlled, and good surface curability and good curability in deep portions are achieved even in the presence of oxygen. Consequently, this ultraviolet curable organopolysiloxane composition enables the achievement of a silicone gel (a gel-like cured product) which has been cured at a substantially uniform crosslinking density (with a substantially uniform penetration) without depending on the irradiance of ultraviolet light (the amount of irradiation energy).