A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package includes an Independent Passive Device (IPD) die, and a second encapsulant encapsulating the IPD die therein. The package further includes a power module over and bonded to the second package.

A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package includes an Independent Passive Device (IPD) die, and a second encapsulant encapsulating the IPD die therein. The package further includes a power module over and bonded to the second package.

A semiconductor device includes: multiple semiconductor elements each having a one surface and a rear surface in a plate thickness direction; a first member that sandwiches the multiple semiconductor elements and is electrically connected to an electrode on the one surface; a second member electrically connected to an electrode on the rear surface; and multiple terminals that are continuous from the first or second member. An area of the second member is smaller than that of the first member. Semiconductor elements are arranged in a longitudinal direction of the second member. The semiconductor device further includes a first joint portion that electrically connects each semiconductor element and the second member and a second joint portion that electrically connects a terminal and the second member. The multiple solder joint portions are symmetrically placed.

An example relates to an integrated circuit including a semiconductor substrate, and a wiring layer stack located on the semiconductor substrate. The integrated circuit further includes a transistor embedded in the wiring layer stack. The transistor includes an embedded layer. The embedded layer has a thickness of less than 10 nm. The embedded layer includes at least one two-dimensional crystalline layer including more than 10% metal atoms. Further examples relate to methods for forming integrated circuits.

A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench.

This disclosure provides a nonaqueous coolant composition that is excellent in insulation property and heat resistance and has improved heat transfer characteristics. The embodiment is a coolant composition that includes at least one ether compound having 6 or more carbon atoms as a nonaqueous base and is substantially free of water.

A power conversion device includes a connector and a sealing member. The connector is connected to a lead-in pipe of a cooling device on the outside of a case. The sealing member makes a watertight seal between a refrigerant flow pipe, which is the lead-in pipe, and the connector. The sealing member includes a connector-side tubular portion, a first watertight seal projection, and a second watertight seal projection. The connector-side tubular portion is located between an inner peripheral surface of the connector and an outer peripheral surface of the lead-in pipe. The first watertight seal projection projects radially outward in an annular shape from the connector-side tubular portion toward the inner peripheral surface of the connector. The second watertight seal projection projects radially inward in an annular shape from the connector-side tubular portion toward the outer peripheral surface of the lead-in pipe.

A power conversion device includes a semiconductor module, a cooling device, a case, which accommodates the semiconductor module and the cooling device, a connector, which is connected to an inlet pipe, which is a refrigerant flow pipe of the cooling device, and a sealing member, which seals between the inlet pipe and the connector. The connector includes a pipe portion, which communicates with the inlet pipe, and a flange portion, which is secured to the case. The pipe portion and the flange portion are joined to each other with the pipe portion located in an insertion hole of the flange portion.

The present disclosure provides a data processing device. The data processing device includes a carrier board, a data processor, a power module, a first heat sink, and a heat transfer plate. The data processor is provided above the carrier board. The power module is provided below the carrier board and supplies power to the data processor through the carrier board. The first heat sink is provided above the carrier board. The heat transfer plate includes a main body portion and a first extension. The main body portion is provided below the power module. The first extension portion extends upward from the main body portion and is connected to the first heat sink.

The present invention is a cooling apparatus, and a cooling apparatus according to one embodiment of the present invention comprises: cooling jackets, each comprising a main body and a plurality of cooling fins, the main body comprising an upper plate and a lower plate that is joined to the upper plate, and providing a coolant flow channel via the internal space between the upper and lower plates, and the plurality of cooling fins being are arranged inside the main bodies, along the coolant flow channels, so as to be spaced apart from one-another by a set distance, and being connected between the upper and lower plates; and a plurality of double-sided chip modules which are disposed between at least two cooling jackets, with the upper and lower surfaces of the double-sided chip modules contacting the cooling jackets, wherein the plurality of double-sided chip modules are disposed spaced apart from one-another in correspondence with the locations of the cooling fins and positioned so as to be able to face one-another, and thus the upper and lower surfaces can be simultaneously cooled.