A switching module may include a plurality of cooling plates stacked along a vertical direction, a switch disposed between the cooling plates, a first supporting member disposed below the lowermost cooling plate, a second supporting member disposed above the uppermost cooling plate, first and second pressing support portions disposed between the lowermost cooling plate and the first supporting member, and a pressing member disposed between the uppermost cooling plate and the second supporting member.

A cooler may include: a housing including a coolant space in which coolant flows; partition walls partitioning the coolant space into a plurality of flow channels; and a plurality of cooling fins located in each of the flow channels. The partition walls may be curved tortuously such that each of the flow channels comprises wide portions and narrow portions. The wide portions and the narrow portions may be arranged alternately in each of the flow channels in a direction along which the coolant flows. A number of the cooling fins located in each of the wide portions may be greater than a number of the cooling fins located in each of the narrow portions.

A semiconductor package includes a redistribution structure, a memory wafer, semiconductor dies and conductive vias. The memory wafer, disposed over the redistribution structure, includes at least one memory die. The semiconductor dies are disposed side by side with respect to each other, between the memory wafer and the redistribution structure, and are electrically connected to the redistribution structure. The conductive vias electrically connect the at least one memory die with the redistribution structure. A semiconductor package includes a redistribution structure, a reconstructed wafer, and a heat sink. The reconstructed wafer is disposed on the redistribution structure. The reconstructed wafer includes logic dies and memory dies. The logic dies are electrically connected to the redistribution structure. The memory dies are electrically connected to the redistribution structure and vertically stacked with the logic dies. The heat sink is disposed on the reconstructed wafer. The heat sink is fastened to the reconstructed wafer.

This disclosure provides a nonaqueous coolant composition that is excellent in insulation property and heat resistance and has improved heat transfer characteristics. The embodiment is a coolant composition that includes at least one ether compound having 6 or more carbon atoms as a nonaqueous base and is substantially free of water.

A current sensor device includes a bus bar that is to be connected to a plate-shaped terminal of a semiconductor device, a magnetoelectric conversion element that is configured to detect a current flowing through the bus bar, and a resin portion that integrally holds the magnetoelectric conversion element and the bus bar. The bus bar has one end protruding from the resin portion, and the one end of the bus bar includes a penetration portion defined by wall surfaces. The wall surfaces includes a pair of opposing wall surfaces opposing to each other. At least one of the opposing wall surfaces is configured to be connected to the terminal.

A stacked-plate heat exchanger for cooling a plurality of heat-generating electronic components arranged in a plurality of layers comprises a stack of flat tubes defining a plurality of parallel fluid flow passages, the tubes being separated by spaces for receiving the electronic components. One or more flow-restricting ribs is arranged within at least some of the fluid flow passages to partially block fluid flow between at least one the manifolds and the heat transfer area by reducing the height of the fluid flow passage outside the heat transfer area, along at least a portion of the width of the fluid flow passage, in order to improve the flow distribution of a heat transfer fluid between and within the fluid flow passages of the heat exchanger, and to minimize bypass flow at the outer edges of the fluid flow passage.

A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package includes an Independent Passive Device (IPD) die, and a second encapsulant encapsulating the IPD die therein. The package further includes a power module over and bonded to the second package.

A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.

An integrated power module includes a base case defining an internal manifold, and an interface surface comprising a plurality of inlet apertures and outlet apertures each in fluid communication with the internal manifold. The integrated power module also includes a plurality of power cards fastened to the base case and in direct contact with the interface surface. Each of the power cards has a bottom cover defining an inner surface and an outer surface, a base plate sealed with the bottom cover, a substrate secured on the base plate such that the base plate is between the substrate and bottom cover, and an integrated circuit disposed on the substrate. The inner surface and the base plate define a cooling channel configured to direct coolant from one of the inlet apertures, through the power card, and to one of the outlet apertures.

A molded semiconductor package includes a mold compound, a plurality of leads each having a first end embedded in the mold compound and a second end protruding from a side face of the mold compound, and a semiconductor die embedded in the mold compound and electrically connected, within the mold compound, to the plurality of leads. The second end of each lead of the plurality of leads has a bottom surface facing in a same direction as a bottom main surface of the mold compound. Each lead of the plurality of leads has a negative standoff relative to the bottom main surface of the mold compound.