Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.

Systems, apparatuses, and methods are described for clamping a heat generating device such as a thyristor in place. The use of spring washers in various configurations is described. A spring washing washer may be used to apply force to a pad which in turn applies the force to a plate above a heat generating device. The plate above the heat generating device may apply downward pressure, which may force the heat generating device against a lower surface. Related systems, apparatuses, and methods are also described.

A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

A chip apparatus and an electronic device, where the chip apparatus includes a housing and a chip assembly fastened to one side of inside of the housing. The chip apparatus further includes a heat sink disposed on an opposite side of the inside of the housing, and the heat sink is thermally connected to the chip assembly.

A mount for connecting a heat sink to a PCB may include a threaded post extending along an axis, a first barrel adjacent to the post along an axis and having a larger axial cross-section than the post, and a threaded second barrel defining an opposite end of the mount from the post and having a larger axial cross-section than the first barrel.

Systems, apparatuses, and methods are described for clamping a heat generating device such as a thyristor in place. The use of spring washers in various configurations is described. A spring washing washer may be used to apply force to a pad which in turn applies the force to a plate above a heat generating device. The plate above the heat generating device may apply downward pressure, which may force the heat generating device against a lower surface. Related systems, apparatuses, and methods are also described.

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.

In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.