A component coupled to a heat dissipation unit, allowing a screwing element to be pivotally coupled to a heat dissipation unit, includes a body, a stop portion, a first inner engagement portion, a second inner engagement portion and a first outer engagement portion. The body has a first part and a second part and forms therein a through hole which extends axially. The stop portion is circumferentially disposed at the rim of the first or second part. The first inner engagement portion has checking plates and corresponds in position to the stop portion. The second inner engagement portion has stop blocks disposed at the first or second part. The first outer engagement portion is disposed at the rim of the body and opposite the stop portion. The screwing element is fixed to the heat dissipation unit temporarily but firmly, thereby preventing disintegration and disconnection during transport.

Various embodiments of the disclosure are directed to vapor chambers with a structure that permits configurable mounting holes. Such vapor chambers may have a top plate with apertures and a bottom plate with apertures. Spacers are inserted into the apertures and disposed between the top plate and the bottom plate. Each spacer may have their own aperture that extends throughout the spacer which acts as the mounting hole in the assembled vapor chamber. The various dimensions of the spacers can be configured and selected in order to accommodate varying dimensions of the apertures in the top plate and the bottom plate. These spacers can be used to provide mounting holes of a desired size and provide additional structure support to the vapor chamber. The spacers also lie flush with the top and bottom plates which increases the surface area of the vapor chamber and improves the mounting of the vapor chamber to other structures.

Various embodiments of the disclosure are directed to vapor chambers with a structure that permits configurable mounting holes. Such vapor chambers may have a top plate with apertures and a bottom plate with apertures. Spacers are inserted into the apertures and disposed between the top plate and the bottom plate. Each spacer may have their own aperture that extends throughout the spacer which acts as the mounting hole in the assembled vapor chamber. The various dimensions of the spacers can be configured and selected in order to accommodate varying dimensions of the apertures in the top plate and the bottom plate. These spacers can be used to provide mounting holes of a desired size and provide additional structure support to the vapor chamber. The spacers also lie flush with the top and bottom plates which increases the surface area of the vapor chamber and improves the mounting of the vapor chamber to other structures.

Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.

The disclosure provides a compressing structure for compressing a component, a power module and a method for compressing a component inside a chamber, the compressing structure is provided for compressing a component onto a fixed plate and comprises a plate-shaped structure, the component is secured to a first side of the plate-shaped structure, the outside of the plate-shaped structure is provided with a base; at least a steering compressing member is provided between a second side of the plate-shaped structure and the base, and mounted on the second side of the plate-shaped structure or the base, the steering compressing member is provided for transforming an rotational motion into a translational motion; and at least a positioning device mounted on the side of the plate-shaped structure and the base. The compressing structure provided by the disclosure compresses the component onto the fixed plate.

An error-unlocking protection structure for heat dissipation base seat includes a heat dissipation base seat, an operation member and a cover body. The operation member has a cam section pivotally connected with the connection section disposed on the heat dissipation base seat. A linking member is disposed between the cover body and the operation member and respectively connected with the cover body and the cam section. When operating the operation member, the cam section is forced to press the heat dissipation base seat and make the heat dissipation base seat tightly attached to the heat generation component and located thereon. At the same time, the linking member is driven to horizontally move the cover body relative to the heat dissipation base seat, whereby the cover body shields locking members to prevent the heat dissipation base seat from being uninstalled from the heat generation component by error.

A heat dissipation unit includes a heat sink having a heat receiving zone and a screw fixing structure extended through each of four holes on the heat sink outside the heat receiving zone. The screw fixing structure includes a locating screw having a shank and a spring fitted around the shank; a hollow sleeve located outside the shank and the spring; and a spring stopper including two parallel elastic arms connected at one end and elastically disposed in the hollow sleeve to hold the spring in a compressed state. The spring stopper may be pushed downward to laterally push the two elastic arms open to move away from the spring, allowing the spring to release its elastic force upwardly. The four locating screws can synchronously and evenly apply their elastic force to the through holes outside the heat receiving zone, preventing the heat sink from damaging a contacted heat source.

A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.