Encapsulated stress mitigation layers and assemblies having the same are disclosed. An assembly that includes a first substrate, a second substrate, an encapsulating layer disposed between the first and second substrates, and a stress mitigation layer disposed in the encapsulating layer such that the stress mitigation layer is encapsulated within the encapsulating layer. The stress mitigation layer has a lower melting temperature relative to a higher melting temperature of the encapsulating layer. The assembly includes an intermetallic compound layer disposed between the first substrate and the encapsulating layer such that the encapsulating layer is separated from the first substrate by the intermetallic compound layer. The stress mitigation layer melts into a liquid when the assembly operates at a temperature above the low melting temperature of the stress mitigation layer and the encapsulating layer maintains the liquid of the stress mitigation layer within the assembly.

A thermally conductive insulator includes a first part having first fins arranged on a surface of the first part, and a second part having second fins arranged on a surface of the second part. The first fins and the second fins are arranged in such a way that they mesh with one another. Arranged between the first and second parts in a region of the first and second fins is an insulating layer.

The heat sinks with vibration enhanced heat transfer for non-liquid heat sources are heat sinks formed from a first body of high thermal conductivity material received within a thermally conductive housing such that at least one contact face of the first body of high thermal conductivity material is exposed, forming a direct contact interface with a heat source requiring cooling. The heat source requiring cooling may be any non-liquid heat source, including a processor chip, an integrated circuit chip, a modular circuit package, or the like. The thermally conductive housing may be disposed such that at least one contact face of the thermally conductive housing is in direct contact with the vibrating base. Alternatively, the vibrating base may be attached to a support attached to the heat source. The vibrating base applies oscillating waves to the heat sink, thereby increasing heat transfer between the heat source and the heat sink.

A heat dissipation structure includes a heat dissipation portion and a heat storage portion. The heat dissipation portion has the heat receiving surface including the contact surface in contact with the semiconductor generating the heat, and dissipates the heat of the semiconductor in contact with the contact surface. The heat storage portion is arranged to sandwich the semiconductor. The heat storage portion has, for example, the heat storage opening portion in which the semiconductor is positioned, and surrounds the semiconductor. The heat storage portion is provided to he in contact with the heat receiving surface, and stores the heat of the semiconductor conducted through the heat dissipation portion.

The invention relates to a manufacturing process for a heat dissipation heat sink composite having heat dissipation function and a manufacturing method for a finished product thereof. It comprises the steps of rolling a first heat conductive material and a substrate to adhere the first heat conductive material to the substrate for fixation; adhering a second heat conductive material to the substrate for combination; and rolling the second heat conductive material and the substrate for firmly combination and fixation to complete the manufacturing of a composite material.

An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.

Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

A method and apparatus for heat-dissipation a structure having a first and second surface. The first surface defines a heat absorbing surface having a plurality of cavities and a heat absorbing coating applied to the first surface and within the cavities. Additionally, a set of etchings can be provided on the first surface to increase absorption. The cavities can be pyramidal, hexagonal, or conical shapes, for example.

The heat sink with condensing fins and phase change material is formed from a thermally conductive housing, an internal chamber, and a body of liquid phase change material. The thermally conductive housing has a first wall and an opposed second wall and forms an internal chamber. The first wall of the thermally conductive housing is adapted to be in direct contact with one or more heat sources. The body of liquid phase change material is disposed within the internal chamber. The second wall of the thermally conductive housing is adapted to form a plurality of condensing fins. The plurality of condensing fins may contain at least one high thermal conductivity rod. In some embodiments, a high thermal conductivity medium, such as gallium, is disposed within the internal chamber in direct contact with the first wall of the thermally conductive housing.

A heat sink includes a plurality of encapsulated spheres dispersed throughout the heat sink. Each encapsulated sphere includes a solid-to-liquid phase-change material surrounded by a metal shell.