A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.

Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

A semiconductor device having enhanced thermal transfer includes at least one die, including a device layer in which one or more functional circuit elements are formed and a substrate supporting the device layer, and a support structure. The die is disposed on the support structure using at least one connection structure coupled between the device layer and the support structure. A back surface of the substrate is textured so as to increase a surface area of the back surface to thereby enhance thermal transfer between the substrate and an external environment.

A heat sink assembly for use with at least one heat-emitting component where the heat sink assembly includes a first phase change material conductively coupled to the at least one heat-emitting component and changing phase at a first temperature and a second phase change material conductively coupled to the first phase change material and changing phase at a second temperature, which is greater than the first temperature.

There is provided an electronic apparatus including: a heating section; a heat storage section; a detection section configured to detect a heat storage amount of the heat storage section; and a control section configured to control operation of the heating section, based on the heat storage amount detected by the detection section.

An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

An electric power-steering control device has a substrate, a heat-generating component, and a heat-storing body. The heat-generating component is disposed on one surface of the substrate and generates heat when activated. The heat-storing body is capable of storing the heat from the heat-generating components. The heat-storing body has a main body having a rectangular plate shape and disposed on the one surface of the substrate. The heat-storing body has a notch section or a recess section.

A device can dissipate heat from an electrical component by using a phase change material. A horizontal circuitry layer can have opposing first and second sides. A vertical hole can extend through the horizontal circuitry layer. A vertical channel can include a phase change material positioned in the vertical hole and in thermal contact with the first and second sides of the horizontal circuitry layer. The phase change material can dissipate a first amount of heat from the first side by absorbing the first amount of heat and changing phase from a solid form to a liquid form. The phase change material, when in the liquid form, can dissipate a second amount of heat from the first side by transporting the second amount of heat via convection from the first side of the horizontal circuitry layer to the second side of the horizontal circuitry layer.

A heat dissipation device for an electronic device is provided. The heat dissipation device comprises a heat conducting cover configured to be disposed on an electronic device, the heat conducting cover forming a closed cavity; and a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover. With a temperature increase of the electronic device, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the electronic device.