Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

A heat sink assembly for use with at least one heat-emitting component where the heat sink assembly includes a first phase change material conductively coupled to the at least one heat-emitting component and changing phase at a first temperature and a second phase change material conductively coupled to the first phase change material and changing phase at a second temperature, which is greater than the first temperature.

A method for forming a case for an electronic device and a manufactured case structure for an electronic device are provided. The method for forming a case for an electronic device comprises the following steps. Provide a plastic material. Provide a plurality of PCM microcapsules. Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material. Form a case from the housing material by injection molding. The manufactured case structure for an electronic device comprises a plastic layer and a plurality of PCM microcapsules. The plurality of PCM microcapsules are dispersed in the plastic layer.

A structure includes a thermal interface material, and a Perforated Foil Sheet (PFS) including through-openings therein, with a first portion of the PFS embedded in the thermal interface material. An upper layer of the thermal interface material is overlying the PFS, and a lower layer of thermal interface material is underlying the PFS. The thermal interface material fills through-openings in the PFS.

Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a heat generating component and a heat spreader physically connected to the heat generating component. The heat spreader includes a first surface and a second surface. The second surface is closer to the heat generating component than the first surface is to the heat generating component. The computing device also includes a layer of phase change material on at least a portion of the first surface, the second surface, or the first surface and the second surface of the heat spreader.

A power semiconductor device includes a wiring structure adjoining at least one side of a semiconductor body and comprising at least one electrically conductive compound. The power semiconductor device further includes a cooling material in the wiring structure. The cooling material is characterized by a change in structure by means of absorption of energy at a temperature T.sub.C ranging between 150° C. and 400° C.

A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.

An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.

A power semiconductor module arrangement comprises a substrate comprising a dielectric insulation layer, and a first metallization layer attached to the dielectric insulation layer, at least one semiconductor body mounted on the first metallization layer, and a first layer comprising an encapsulant, the first layer being arranged on the substrate and covering the first metallization layer the at least one semiconductor body, wherein the first layer is configured to release liquid or oil at temperatures exceeding a defined threshold temperature.

A heat storage composition (20) of the present invention includes a matrix resin (21) and heat storage inorganic particles (22). The heat storage inorganic particles (22) are composed of a material that undergoes an electronic phase transition and has a latent heat of 1 J/cc or more for the electronic phase transition. The amount of the heat storage inorganic particles is 10 to 2000 parts by weight with respect to 100 parts by weight of the matrix resin. The heat conductivity of the heat storage composition is 0.3 W/m.Math.K or more. The heat storage composition may further include heat conductive particles (23, 24). The heat storage inorganic particles are preferably metal oxide particles containing vanadium as the main metal component. The heat storage composition has high heat storage properties and high heat conduction properties, and is used as a heat storage silicone material provided between a heat generating component and a case. Since heat from the heat generating component is temporarily stored in the heat storage composition so that the heat conduction is delayed, the heat is diffused during the delay to eliminate partial heating, thereby resulting in uniform heat dissipation.