An apparatus for cooling semiconductor elements uses heat exchangers to transfer heat from the semiconductor elements to a coolant flowing through the heat exchangers. A central body, made from a flexible material, is positioned between the heat exchangers and a manifold from which the coolant is provided. The central body includes a plurality of flexible runners fluidly coupled to each heat exchanger and the manifold to provide the coolant to the heat exchanger. Heat is transferred away from the semiconductor elements by the coolant and heated coolant is returned from the heat exchanger to the manifold. Each flexible runner is configured to flex to conform to a height of a respective semiconductor element and thereby apply a force to the heat exchanger to maintain contact with the semiconductor element.

An exemplary apparatus includes a substrate; a plurality of chips mounted onto the substrate; a plurality of cold plates corresponding to the plurality of chips; means for pressing each of the cold plates toward a corresponding one of the chips; means for delivering coolant flow to the cold plates; and means for adjusting the cooling power of the plurality of cold plates, responsive to at least one sensed parameter of the plurality of chips.

A bellows assembly and related methods are described. The bellows assembly can be used in a two-phase immersion cooling system to regulate pressure in a tank's airspace above a coolant liquid. The bellows assembly can include a flexible container and pressure-release valves located to reduce emissions of coolant liquid vapor into an ambient environment.

A bellows assembly and related methods are described. The bellows assembly can be used in a two-phase immersion cooling system to regulate pressure in a tank's airspace above a coolant liquid. The bellows assembly can include a flexible container and pressure-release valves located to reduce emissions of coolant liquid vapor into an ambient environment.