A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the apparatus. The nozzle plate includes a plurality of flow paths through which the cooling fluid passes from the inlet volume to the outlet volume. The flow paths cause the fluid to exit the nozzle plate as transversely expanding fluid jets.

An airflow generating package includes a base, a covering structure and a film structure. The film structure is disposed between the base and the covering structure, and includes a flap pair including a first flap and a second flap. The flap pair operates at an ultrasonic rate so that the airflow generating package produces an airflow. A first air opening is formed on the covering structure.

An electronic device includes an operational component, a heat conductive component and an airflow generating package. The operational component produces a heat while operating. The heat conductive component is configured to conduct the heat generated by the operational component, wherein the operational component is disposed on the heat conductive component. The airflow generating package is disposed by an edge of the electronic device. The airflow generating package includes a film structure, the film structure includes a flap pair, and the flap pair includes a first flap and a second flap. The flap pair operates at an ultrasonic rate to produce an airflow. The heat conductive component extends toward the airflow generating package, such that the airflow generated by the airflow generating package flows through the heat conductive component, so as to dissipate the heat generated from the operational component through the heat conductive component.

An electronic device includes an operational component, a heat conductive component and an airflow generating package. The operational component produces a heat while operating. The heat conductive component is configured to conduct the heat generated by the operational component, wherein the operational component is disposed on the heat conductive component. The airflow generating package is disposed by an edge of the electronic device. The airflow generating package includes a film structure, the film structure includes a flap pair, and the flap pair includes a first flap and a second flap. The flap pair operates at an ultrasonic rate to produce an airflow. The heat conductive component extends toward the airflow generating package, such that the airflow generated by the airflow generating package flows through the heat conductive component, so as to dissipate the heat generated from the operational component through the heat conductive component.

A cooling device. The cooling device includes a primary heat path configured to draw heat away from a heat source. The cooling device further includes a secondary heat path, that functions selectively. The secondary heat path is parallel to the primary heat path. The secondary heat path includes an active cooling device configured to remove heat from a surface. The secondary heat path further includes one or more passive elements coupled to the active cooling device that are configured to draw heat from the active cooling device. The primary heat path and secondary heat path are configurable to draw heat from the same heat source.

A liquid jet impingement cooler includes a wick structure formed of a porous material and a manifold. The manifold includes a plurality of inlet nozzles fluidly connecting a liquid inlet to the wick structure, a plurality of outlet nozzles fluidly connecting the wick structure to a liquid outlet, and a vapor outlet fluidly connected to the porous material of the wick structure.

A semiconductor package is provided. The semiconductor package includes a segmented inset lid that is divided into a primary component and one or more secondary components, with each secondary component being coupled to the primary component by a compliant liquid-tight adhesive; wherein the primary component is a continuous region including i) a first surface, ii) a second surface, and iii) a boundary surface, the first surface including one or more integrated heat sink surfaces or one or more routing features to promote coolant distribution, the second surface contacting one or more semiconductor dies, and the boundary surface forming a sealing surface with a semiconductor substrate; wherein each secondary component contacts at least one other semiconductor die and forms a water-tight seal with the primary component; and a removable flow cover coupled with the segmented inset lid to form a seal along the boundary surface.