A backside initiated uniform heat sink loading system includes a system board assembly, a heat sink assembly, a loading plate, and a fastener. The system board assembly includes at least one processing unit. The heat sink assembly is mounted upon the processing unit from a topside of the system board assembly and includes a plurality of tension members that extend through the system board assembly. The loading plate is mounted to the plurality of tension members from a backside of the system board assembly. The fastener engages with the loading plate from the backside and forces the loading plate away from the system board assembly. As a result, the tension members uniformly force the heat sink assembly upon the processing unit to seat the processing unit with the system board assembly and to thermally contact the heat sink assembly with the processing unit.

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

The present invention concerns a circuit arrangement for thermal protection of a power semiconductor, wherein there is provided a two-stage thermal protection in the control circuit and in the load circuit of the power semiconductor. A first stage (10) with temperature-dependent resistance device serves for reducing or switching off the control voltage of the power semiconductor (30) when a first threshold temperature is reached at the temperature-dependent resistance device. In addition, provided in the load circuit of the power semiconductor (30) is a second stage (20) with a cutout element thermally coupled to the power semiconductor (30) for interrupting a load current of the power semiconductor when a second threshold temperature is reached at the cutout element. In that case the first stage forms an active temperature protection for the power semiconductor (30) to avoid damage and the second stage forms a temperature protection in the case of a malfunction of the power semiconductor (30).

A heat transferring device comprises two massive thermally conductive bodies arranged vertically on top of one another and spaced apart by a variable distance. One or more spreading elements are positioned between the thermally conductive bodies and respectively comprise two horizontally movable wedges with wedge tips pointing in opposite directions and a spring pressing apart the wedges. The thermally conductive bodies have corresponding sliding surfaces extending parallel to the wedge surfaces. Motion of the wedges in the horizontal direction is converted into vertical motion of the thermally conductive bodies to thereby automatically adapt the height of the entire device to a respective installation situation.

A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

A system includes a heat sink, a semiconductor device, a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device, and a fastener system that couples the semiconductor device, the layer of TIM, and the heat sink together. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink during operation of the semiconductor device. The fastener system includes a first Belleville-type washer configured to cooperate with the TIM, which flows when heated beyond a threshold temperature, to maintain a substantially constant coupling force between the semiconductor device and the heat sink during operation of the semiconductor device.

A system includes a heat sink, a semiconductor device, and a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink. The system also includes a fastener system that couples the semiconductor device to the heat sink about the layer of TIM. The system also includes one or more washers of the fastener system that maintain a coupling force between the semiconductor device and the heat sink after the TIM flows.

A structure and method of mounting a heat sink having a body and mounting points configured so as to connect to a mounting medium, at least one of the mounting points being configured to allow movement in a thermally-induced expansion direction.

Disclosed herein are thermal management devices and electronic devices that utilized a plurality of plunger assemblies to route heat efficiently from chip packages. In some examples, the thermal management devices may also be used in electronic devices to route heat efficiently from power delivery layer residing below chip packages. In one example, a thermal management device is provided that includes a plurality of plunger assemblies retained to a metal plate. Each plunger assembly includes a metal body extending normally through an aperture formed between first and second sides of the plate and a spring biasing a distal end of the metal body away from the second side of the plate.