A semiconductor device includes a wiring substrate provided with a plurality of pads electrically connected to a semiconductor chip in a flip-chip interconnection. The wiring substrate includes a pad forming layer in which a signal pad configured to receive transmission of a first signal and a second pad configured to receive transmission of a second signal different from the first signal are formed and a first wiring layer located at a position closest to the pad forming layer. In the wiring layer, a via land overlapping with the signal pad, a wiring connected to the via land, and a wiring connected to the second pad and extending in an X direction are formed. In a Y direction intersecting the X direction, a width of the via land is larger than a width of the wiring. A wiring is adjacent to the via land and overlaps with the signal pad.

A semiconductor apparatus includes: a system substrate; a semiconductor package mounted on the system substrate and having a first length in a first horizontal direction; a conductive label flexible and arranged on the semiconductor package, the conductive label including: a first adhesive layer contacting the semiconductor package; a thermally-conductive layer attached to the semiconductor package by the first adhesive layer and having a second length in the first horizontal direction greater than the first length; and a second adhesive layer contacting a portion of a surface of the conductive layer, the portion not vertically overlapping the semiconductor package; a thermal interface material (TIM) arranged on the conductive layer to vertically overlap the semiconductor package; and a cover including: a first cover portion vertically overlapping the semiconductor package and contacting the TIM; and a second cover portion to which the thermally-conductive layer is attached by the second adhesive layer.

An electronic device has a sealing part 90, an electronic element 95 provided in the sealing part 90 and a connection body 50 having a head part 40 connected to a front surface of the electronic element 95 via a conductive adhesive 75. The head part 40 has a second projection protruding 42 toward the electronic element 95 and a first projection 41 protruding from the second projection 42 toward the electronic element 95.

A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and a first semiconductor component (60) adhered to the adhesive resin layer (30) and having a first terminal (65); (B) a step of performing solder reflow processing on the first structure (100) in a state where the first semiconductor component (60) is adhered to the adhesive resin layer (30); and (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50).

Provided is an adhesive for semiconductor sensor chip mounting that can reduce detection of noise and can increase heat resistance and thermal cycle resistance characteristics. An adhesive for semiconductor sensor chip mounting according to the present invention is an adhesive used for mounting a semiconductor sensor chip and contains a silicone resin and a spacer, the 10% compressive elasticity modulus of the spacer being 10 N/mm.sup.2 or more and 2000 N/mm.sup.2 or less, the compression recovery rate of the spacer being 20% or less, and the average particle diameter of the spacer being 10 m or more and 200 m or less.

A method of fabricating a semiconductor package structure is provided. The method includes applying a plurality of first adhesive portions onto a carrier; applying a second adhesive portion onto the carrier; disposing a plurality of micro pins respectively in the first adhesive portions, such that each of the micro pins has a first portion embedded in a corresponding one of the first adhesive portions and a second portion protruding from said corresponding one of the first adhesive portions; bonding a die to the second adhesive portion; forming a molding compound surrounding the micro pins and the die; and removing the carrier from the molding compound after forming the molding compound.

A semiconductor package structure includes a molding compound, a micro pin extending through the molding compound, and a die surrounded by the molding compound. The micro pin has a top surface, a bottom surface, and a sidewall extending from the bottom surface to the top surface of the micro pin. The sidewall of the micro pin has a first portion and a second portion. The first portion of the sidewall is adjacent to the bottom surface of the micro pin and free of the molding compound. The second portion of the sidewall is adjacent to the top surface of the micro pin and in contact with the molding compound.

A joined body includes a first substrate, a second substrate which faces the first substrate, and a joining film which joins the first substrate to the second substrate, wherein the joining film has a first region and a second region, and in a plan view of the first substrate, the first region has a higher metal nanoparticle density than the second region.

An electronic device has a sealing part 90, a first terminal 11 projecting outward from a first side surface of the sealing part 90, a second terminal 13 projecting outward from a second side surface different from the first side surface of the sealing part 90, an electronic element 95 provided inside the sealing part 90, and a head part 40 coupled to the first terminal 11 and the second terminal and connected to a front surface of the semiconductor element 95 via a conductive adhesive 75.

A semiconductor package includes a carrier, at least and adhesive portion, a plurality of micro pins and a die. The carrier has a first surface and second surface opposite to the first surface. The adhesive portion is disposed on the first surface, and the plurality of the micro pins is disposed in the adhesive portions. The die is disposed on the remaining adhesive portion free of the micro pins.