A method of manufacturing a light emitting element mounting base member includes: providing a first insulating member in a plate shaped having at least one recess portion or at least one through-hole; disposing in the recess portion or in the through-hole a light blocking resin and a plurality of core members each equipped with a second insulating member having light reflectivity on each surface of a plurality of electrical conductor cores; and exposing at least one of the surface of the electrical conductor cores from the second insulating members by removing each part of at least one of the second insulating members.

A semiconductor device comprises a generally planar semiconductor chip. The semiconductor chip comprises a first side and second side opposite the first side. The first side is associated with a source conductive pad. The second side is associated with a drain conductive pad. A gate pad overlies a portion of the first side. A source terminal comprises a metallic strip assembly with a series of pocket chambers spaced apart from each other and partially filled with a phase-change material filling. A drain terminal is spaced apart from the source terminal by a dielectric layer. The source terminal is bonded to the source conductive pad via a bonding interface material.

Described are microelectronic devices including a substrate formed with multiple build-up layers, and having at least one build-up layer formed of a fiber-containing material. A substrate can include a buildup layers surrounding an embedded die, or outward of the build-up layer surrounding the embedded die that includes a fiber-containing dielectric. Multiple build-up layers located inward from a layer formed of a fiber-containing dielectric will be formed of a fiber-free dielectric.

Provided is a terminal plate according to an embodiment including: a first plate portion for being connected to a first semiconductor element; a second plate portion for being connected to a second semiconductor element; a third plate portion provided above the first plate portion and the second plate portion; a first connecting portion provided between the first plate portion and the third plate portion and connecting the first plate portion and the third plate portion; a second connecting portion provided between the second plate portion and the third plate portion and connecting the second plate portion and the third plate portion; a fourth plate portion provided above the first plate portion and the second plate portion and provided on the opposite side of the third plate portion with interposing the first and second plate portions; a third connecting portion provided between the first plate portion and the fourth plate portion and connecting the first plate portion and the fourth plate portion; a fourth connecting portion provided between the second plate portion and the fourth plate portion and connecting the second plate portion and the fourth plate portion; and a fifth plate portion provided above the fourth plate portion, the fifth plate portion connected to the fourth plate portion, and the fifth plate portion having a hole.

Provided is a power semiconductor device which is able to have improved connection reliability between a wiring line and an electrode of a power semiconductor element in comparison to conventional power semiconductor devices. This power semiconductor device is provided with: a semiconductor element; an insulating substrate having an electrode layer to which the semiconductor element is bonded; an external wiring line which is solder bonded to an upper surface electrode of the semiconductor element and has an end portion for external connection, said end portion being bent toward the upper surface; and a frame member which is affixed to the electrode layer of the insulating substrate. The frame member has a fitting portion that is fitted with the end portion for external connection; and the external wiring line has at least two projected portions that protrude toward the semiconductor element.

A lighting apparatus using an organic light-emitting diode and a method of fabricating the same are characterized in that an organic emissive material and a conductive film used as a cathode are deposited on the entire surface of a substrate, and then an organic emissive layer in a lighting area and contact areas becomes separated (disconnected or cut) by laser ablation, simultaneously with the formation of a contact hole for contact with an anode. Next, cathode contact and encapsulation processes are performed using an adhesive containing conductive particles and a metal film. This simplifies the fabrication process of the lighting apparatus without using an open mask (metal mask), which is a complicated tool, thus making it useful especially in roll-to-roll manufacturing.

A package substrate may include a build-up layer. The build-up layer may include a dielectric material and one or more microspheres. The one or more microspheres may include a magnetic core that includes a first material that is a first oxidation-resistant material. Further, the one or more microspheres may include a shell to encapsulate the core, and the shell may include a second material that is a second oxidation-resistant material. The package substrate may further include a metal layer coupled with the build-up layer.

A method of manufacturing a module is disclosed. In one example, the method comprises providing at least one solder body with a base portion and an elevated edge extending along at least part of a circumference of the base portion. At least one carrier, on which at least one electronic component is mounted, is placed in the at least one solder body so that the at least one carrier is positioned on the base portion and is spatially confined by the elevated edge.

An element module includes a cooler, a plurality of elements, and a conductive member. The cooler includes a first element disposition portion and a second element disposition portion which are provided on both sides in a predetermined direction. The plurality of elements are disposed in each of the first element disposition portion and the second element disposition portion. The conductive member is disposed in a space portion of the cooler. The space portion penetrates the cooler between the plurality of elements in each of the first element disposition portion and the second element disposition portion. The space portion allows the first element disposition portion and the second element disposition portion to communicate with each other. The conductive member is connected to the element of the first element disposition portion and the element of the second element disposition portion.

A power semiconductor arrangement includes a plurality of half-bridges arranged in parallel alongside one another by way of a longer longitudinal side of the half-bridges. An input load current terminal, an output load current terminal and a phase terminal are arranged on a top side of each of the half-bridges, the input load current terminals and the output load current terminals being arranged on an imaginary line that runs orthogonal to the longer longitudinal side of the half-bridges. First connection plates are connected to respective ones of the output load current terminals, and second connection plates are connected to respective ones of the input load current terminals. The first connection plates are arranged above the second connection plates. The first and the second connection plates are arranged in parallel with one another and electrically insulated from one another.