An apparatus includes a busbar and a heat-generating electronic device mounted on a first side of the busbar, the heat-generating electronic device being electrically and thermally coupled to the first side of the busbar. The busbar includes an array of non-planar physical structures on a second side of the busbar opposite the first side of the busbar. The apparatus includes a dielectric coating on the array of non-planar physical structures, the dielectric coating defining a non-planar dielectric surface on the second side of the busbar.

A terminal member connected to a connection target portion includes: a bent portion bent toward the connection target portion; and a tip connection portion provided at a tip part of the bent portion, in which the tip connection portion is connected to the connection target portion via a conductive bonding material.

A circuit module includes a substrate with a patterned metal surface. The patterned metal surface includes a conductive terminal pad, a first conductive pad, and a second conductive pad that is non-adjacent to the conductive terminal pad. A first circuit portion is assembled on the first conductive pad and a second circuit portion is assembled on the second conductive pad. A conductive bridge electrically couples the conductive terminal pad and the second conductive pad. The conductive bridge includes an elevated span extending above and across the first conductive pad.

Joining is made at a low temperature and warpage is suppressed in the formation of a multilayer assembly, such as joining of a heat sink to an insulating circuit board. A multilayer assembly including: a ceramic substrate; a first aluminum plate which is joined to one surface of the ceramic substrate and contains aluminum or an aluminum alloy; a first intermediate metal layer which is joined to a surface of the first aluminum plate opposite to the ceramic substrate and contains any of copper, nickel, silver, or gold; a first sintered copper layer which is joined to a surface of the first intermediate metal layer opposite to the first aluminum plate; and a first metal member which is joined to a surface of the first sintered copper layer opposite to the first intermediate metal layer and contains any of aluminum, an aluminum alloy, copper, or a copper alloy.