H01L23/4985

DRIVE CIRCUIT CARRIER AND DISPLAY DEVICE

A drive circuit carrier and a display device. The drive circuit carrier includes a flexible substrate; and first test leads and second test leads, alternately staggered on a first surface of the flexible substrate in sequence. A first end of each first test lead is flush with a first edge of the first surface, and a second end of each second test lead is away from the first edge relative to the first end.

Methods and apparatuses for configuring artificial retina devices

Methods and apparatuses to detect configuration commands from waveforms received at a retina prosthesis device for calibrating the device are described. The device can comprise an array of pixel units to receive light to stimulate neuron cells to cause an effect of visual sensation from the light. The pixel units may have configurable parameters for the stimulation to the neuron cells. The configurable parameters may be updated according to the configuration commands detected without requiring micro processor and non-volatile memory in the device. The stimulation may be generated according to the updated configurable parameters to improve the effect of visual sensation from the light including compensation for the physiological and environmental variations and drifts.

Flexible substrate and semiconductor apparatus
11605585 · 2023-03-14 · ·

A flexible substrate includes a first area including a first circuit, the first circuit configured to be connectable to a first component, a second area including a second circuit, the second circuit configured to be connectable to a second component, a connecting area provided between the first area and the second area and including a third circuit, the third circuit connecting the first circuit and the second circuit, one or more first via conductors provided between the first area and the connecting area and electrically isolated from the first circuit, the second circuit, and the third circuit, and one or more second via conductors provided between the second area and the connecting area and electrically isolated from the first circuit, the second circuit, and the third circuit.

SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH DIE STACK STRUCTURES
20220336419 · 2022-10-20 ·

A semiconductor device includes a rigid flex circuit that has a first rigid region and a second rigid region that are electrically connected by a flexible portion. A first die is mounted to a first side of the first rigid region. A second die is mounted to a second side of the second rigid region. The first and second sides are on opposite sides of the rigid flex circuit. The flexible portion is bent to hold the first and second rigid regions in generally vertical alignment with each other.

DISPLAY PANEL AND DISPLAY DEVICE

A display panel and a display device are provided. In the display panel, a material of the first flexible layer and a material of the second flexible layer are different, and a direction of an internal stress of the first flexible layer and a direction of an internal stress of the second flexible layer are opposite. Therefore, the internal stress of the first flexible layer and the internal stress of the second flexible layer may eliminate each other. As a result, the first flexible layer and the second flexible layer will not be curled, and warpage will not occur on the display panel.

METHOD FOR PACKAGING COF
20220319997 · 2022-10-06 ·

The present invention discloses a method for packaging a chip-on-film (COF). The method includes: S1, forming a plurality of first pins on a circuit surface of a flexible circuit substrate, and forming a plurality of second pins on a chip to be packaged; S2, arranging to keep the circuit surface always facing downwards, arranging to keep a surface of the chip to be packaged, where the second pins matching the first pins are arranged, always facing upwards, and arranging the first pins and the second pins, to be opposite to each other; and S3, applying a top-down pressure to the flexible circuit substrate, and/or applying a bottom-up pressure to the chip to be packaged, and simultaneously heating at high temperature to solder the first pins and the second pins in a fused eutectic manner. The method of the present invention improves the product yield and stability.

DISPLAY APPARATUS INCLUDING A DISPLAY PANEL WITH MULTIPLE PADS
20230104777 · 2023-04-06 ·

A display apparatus includes a printed circuit board including first to fourth output pad regions and a flexible circuit board having a first end connected to a display panel and a second end connected to the printed circuit board. The first output pad region includes a 1.sup.st-1.sup.st output pad group and a 1.sup.st-2.sup.nd output pad group, the second output pad region includes a 2.sup.nd-1.sup.st output pad group and a 2.sup.nd-2.sup.nd output pad group, the fourth output pad region includes a 4.sup.th- 1.sup.st output pad group and a 4.sup.th-2.sup.nd output pad group, and the printed circuit board includes a first input terminal electrically connected to the 1.sup.st-1.sup.st output pad group, a second input terminal electrically connected to the 2.sup.nd-2.sup.nd output pad group, a third input terminal electrically connected to the first input terminal, and a fourth input terminal electrically connected to the 4.sup.th-2.sup.nd output pad group.

Flexible circuit board, COF module and electronic device including the same

A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

DISPLAY DEVICE, METHOD OF MANUFACTURING WINDOW, AND METHOD OF MANUFACTURING DISPLAY DEVICE
20220317731 · 2022-10-06 · ·

A display device includes a display panel configured to display an image, the display panel including a first non-folding area; a second non-folding area; and a folding area disposed between the first non-folding area and the second non-folding area; and a window disposed on the display panel and including a folding portion overlapping the folding area of the display panel. The folding portion of the window includes a first substantially curved surface, a substantially flat surface extending from the first substantially curved surface; and a second substantially curved surface extending from the substantially flat surface.

Image display device

An image display device includes a display panel which displays an image, a back cover disposed along the back surface of the display panel, a circuit substrate which is disposed on the back surface of the back cover and which is for driving the display of the image on the display panel, and a FPC which connects the circuit substrate and the display panel. The back cover has a recess recessed inward from the edge of the back cover in a plan view. The FPC is disposed so as to pass through the recess.