The present disclosure is directed to a micro module with a support structure. The micro module includes a carrier substrate having contacts and a bonding pad, a semiconductor die, and a support structure. The semiconductor die is positioned on the bonding pad and is electrically coupled to the contacts. The support structure is positioned on the bonding pad and adjacent to the semiconductor die. The support structure reinforces the bonding pad such that the bonding pad is more rigid than flexible. As a result, an external force applied to the micro module is less likely to cause the micro module to bend and damage the semiconductor die.

A wireless communication device that includes a first electrode connected to a first terminal electrode of an RFIC element and a second electrode connected to a second terminal electrode of the RFIC element. Moreover, the first electrode has a longitudinal direction and a lateral direction and has a first portion connected to the first terminal electrode and a second portion that faces the first portion and the second electrode. The first portion has an extended portion that extends in the longitudinal direction beyond a connection point between the second electrode and the second terminal electrode.

Example embodiments of systems and methods for milling patterns for a card are provided. A chip fraud prevention system include a device including a chip. The chip may be at least partially encompassed in a chip pocket. The chip pocket may include one or more shapes. The one or more shapes may include one or more peaks and one or more valleys. One or more connections may be communicatively coupled to at least one surface of the chip. The one or more connections may be placed between at least one of the one or more peaks or one or more valleys.

A lead frame used to assemble a semiconductor device, such as a smart card, has a first major surface including exposed leads and a second major surface including a die receiving area and one or more connection pads surrounding the die receiving area. The connection pads enable electrical connection of an Integrated Circuit (IC) die to the exposed leads. A molding tape sized and shaped like the lead frame is adhered to and covers the second major surface of the lead frame. The molding tape has a die receiving area cut-out that exposes the die receiving area and the connection pads on the second major surface of the lead frame and forms a cavity for receiving an encapsulant. The cut-out has an elevated sidewall for retaining the encapsulant within the cavity.

Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.

A multi-layer card comprising a polymeric inlay layer having a first surface and a second surface, further comprising a first multi-layer film which is disposed on the first surface of the polymeric inlay layer, and further comprising a first polymeric overlay layer which is disposed on said first multi-layer film, such that the layer order is polymeric inlay layer, first multi-layer film and first polymeric overlay layer, wherein said first multi-layer film comprises: (i) a polyester base layer (B) comprising a crystallisable polyester (P.sub.B), and further comprising titanium dioxide in an amount of from about 1 to about 30 wt % by total weight of the base layer; (ii) a first heat-sealable copolyester layer (A1) disposed on a first surface of said polyester base layer; and (iii) optionally a second heat-sealable copolyester layer (A2) disposed on a second surface of said polyester base layer, wherein the copolyester (CP.sub.A) of each of the first and optional second heat-sealable copolyester layers is independently selected from amorphous copolyesters (ACP.sub.A) derived from an aliphatic diol and a cycloaliphatic diol and at least one aromatic dicarboxylic acid, and/or the polyester base layer (B) further comprises a copolyester (CP.sub.B) in an amount of at least about 10% by weight based on the total weight of the base layer (B).

Example embodiments of systems and methods for milling patterns for a card are provided. A chip fraud prevention system include a device including a chip. The chip may be at least partially encompassed in a chip pocket. The chip pocket may include one or more shapes. The one or more shapes may include one or more peaks and one or more valleys. One or more connections may be communicatively coupled to at least one surface of the chip. The one or more connections may be placed between at least one of the one or more peaks or one or more valleys.

There is provided a fingerprint sensor module comprising a fingerprint sensor device comprising a sensing array and at least one connection pad for electrically connecting the fingerprint sensor device to external circuitry, the sensing array and connection pad being located on a first side of the fingerprint sensing device; at least one electrically conductive via connection arranged adjacent to the fingerprint sensor device and in electrical contact with the connection pad via at least one conductive trace located in the same plane as the connection pad; a mold layer arranged to cover a backside of the fingerprint sensor device and to fill a volume between the fingerprint sensor device and the via connection, wherein an end portion of the via connection is exposed for connecting the fingerprint sensor module to external circuitry. There is also provided a method for manufacturing such a fingerprint sensor module.

Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. A substrate of the RFID IC, or a portion of the IC substrate, electrically couples the first circuit block to at least one of the first and second antenna contacts. The IC includes one or more interfaces or barrier regions that at least partially electrically isolate the first circuit block from the rest of the IC substrate.

Provided among other things is a method of affixing a small, single chip to a plastic item, the chip having a top surface having length and width dimensions, and having a height, the method comprising: (1) vacuum adhering a top-oriented surface of the chip to a probe of outer dimensions comparable to or smaller than those of the length and width; (2) conveying heat to the chip via the probe such that a bottom-oriented surface of the chip is sufficiently hot to melt the plastic; (3) applying via the probe the chip to the plastic such that the chip embeds in the plastic; and (4) releasing the chip from the probe, wherein the largest of the length and width is about 500 microns or less, and height is no more than about the smallest of length and width.