An integrated circuit with a fault reporting structure. The integrated circuit has at least one power MOSFET having a plurality of MOSFET cells with each MOSFET cell having a drain metal and a source metal, and the integrated circuit has a power MOSFET area for routing the drain metals and the source metals of the plurality of MOSFET cells. The fault reporting structure has a metal net routed in the power MOSFET area or in an area above or below the power MOSFET area.

A transistor includes: a gate structure disposed on a substrate, and including a gate insulation layer and a gate electrode; a first impurity region disposed at an upper portion of a substrate and adjacent to a first sidewall of the gate structure; a second impurity region disposed at an upper portion of the substrate and adjacent to a second sidewall opposite to the first sidewall of the gate structure; and a first threshold voltage controlling line spaced apart from the substrate, wherein the first threshold voltage controlling line faces at least a portion of the first impurity region, wherein the first threshold voltage controlling line includes a conductive material, and wherein the first threshold voltage controlling line extends in a direction that crosses a direction in which the first impurity region extends.

An integrated circuit includes a TSV extending from a first surface of a semiconductor substrate to a second surface of the semiconductor substrate and having a first end and a second end, and a non-volatile repair circuit. The non-volatile repair circuit includes a one-time programmable (OTP) element having a programming terminal, wherein in response to an application of a fuse voltage to the programming terminal, the OTP element electrically couples the first end of the TSV to the second end of the TSV.

Disclosed are a semiconductor structure, a memory and a method for operating the memory. The semiconductor structure includes: a substrate; a first gate structure and a second gate structure that are located on a surface of the substrate and have a same thickness smaller than a preset thickness; and a first doped area and a second doped area that are located in the substrate and are respectively located on two sides of the first gate structure. The first gate structure forms a selection transistor with the first and second doped areas; an orthographic projection of the second gate structure on the substrate is at least partially overlapped with the second doped area. The second gate structure and the second doped area form an antifuse bit structure. A breakdown state and a non-breakdown state of the antifuse bit structure are configured to represent different stored data.

A 3D semiconductor device including: a first single crystal layer with first transistors; overlaid by a first metal layer; a second metal layer overlaying the first metal layer and being overlaid by a third metal layer; a logic gates including at least the first metal layer interconnecting the first transistors; second transistors disposed atop the third metal layer; third transistors disposed atop the second transistors; a top metal layer disposed atop the third transistors; and a memory array including word-lines, and at least four memory mini arrays, where each of the memory mini arrays includes at least four rows by four columns of memory cells, where each of the memory cells includes at least one of the second transistors or third transistors, sense amplifier circuit(s) for each of the memory mini arrays, the second metal layer provides a greater current carrying capacity than the third metal layer.

Methods, systems, and devices for power distribution for stacked memory are described. A memory die may be configured with one or more conductive paths for providing power to another memory die, where each conductive path may pass through the memory die but may be electrically isolated from circuitry for operating the memory die. Each conductive path may provide an electronic coupling between at least one of a first set of contacts of the memory die (e.g., couplable with a power source) and at least one of a second set of contacts of the memory die (e.g., couplable with another memory die). To support operations of the memory die, a contact of the first set may be coupled with circuitry for operating a memory array of the memory die, and to support operations of another memory die, another contact of the first set may be electrically isolated from the circuitry.

A One Time Programmable (OTP) memory can have a memory cell, which includes two series diodes as a fuse structure.

The present disclosure provides a semiconductor device with air gaps between adjacent conductive lines and a method for forming the semiconductor device. The semiconductor device with air gaps between adjacent conductive lines and a method for forming the semiconductor device. The semiconductor device includes a first dielectric layer disposed over a semiconductor substrate, and a first electrode disposed over the first dielectric layer. The semiconductor device also includes a fuse link disposed over the first electrode, and a second electrode disposed over the fuse link. The semiconductor device further includes a third electrode disposed adjacent to the first electrode, and a second dielectric layer separating the first electrode from the first dielectric layer and the third electrode. The first electrode, the fuse link, and the second electrode form a fuse structure, and the first electrode, the third electrode, and a portion of the second dielectric layer between the first electrode and the third electrode form an anti-fuse structure.

A method for producing a 3D semiconductor device including: providing a first level including a first single crystal layer; forming peripheral circuitry in and/or on the first level, and includes first single crystal transistors; forming a first metal layer on top of the first level; forming a second metal layer on top of the first metal layer; forming second level disposed on top of the second metal layer; performing a first lithography step; forming a third level on top of the second level; performing a second lithography step; processing steps to form first memory cells within the second level and second memory cells within the third level, where the plurality of first memory cells include at least one second transistor, and the plurality of second memory cells include at least one third transistor; and deposit a gate electrode for second and third transistors simultaneously.

The present disclosure provides an antifuse array structure and a memory. The antifuse array structure includes a plurality of antifuse integrated structures arranged in a bit line extension direction and a word line extension direction to form an antifuse matrix. The antifuse integrated structure is arranged in a same active region, and an extension direction of the active region is the same as the bit line extension direction. Each antifuse integrated structure includes a first antifuse memory MOS transistor, a first switch transistor, a second switch transistor, and a second antifuse memory MOS transistor. The first switch transistor and the second switch transistor are respectively controlled through two adjacent word lines, the first antifuse memory MOS transistor and the second antifuse memory MOS transistor are respectively controlled through two adjacent programming wires, and the programming wire is further configured to control adjacent antifuse integrated structures.