An anti-fuse device includes: a substrate; an anti-fuse gate, partially embedded in the substrate, a portion of the anti-fuse gate embedded in the substrate having one or more sharp corners; and an anti-fuse gate oxide layer, located between the anti-fuse gate and the substrate.

Methods, systems, and devices for power distribution for stacked memory are described. A memory die may be configured with one or more conductive paths for providing power to another memory die, where each conductive path may pass through the memory die but may be electrically isolated from circuitry for operating the memory die. Each conductive path may provide an electronic coupling between at least one of a first set of contacts of the memory die (e.g., couplable with a power source) and at least one of a second set of contacts of the memory die (e.g., couplable with another memory die). To support operations of the memory die, a contact of the first set may be coupled with circuitry for operating a memory array of the memory die, and to support operations of another memory die, another contact of the first set may be electrically isolated from the circuitry.

A memory device includes a first transistor. The first transistor includes one or more first semiconductor nanostructures spaced apart from one another along a first direction. Each of the one or more first semiconductor nanostructures has a first width along a second direction perpendicular to the first direction. The memory device also includes a second transistor coupled to the first transistor in series. The second transistor includes one or more second semiconductor nanostructures spaced apart from one another along the first direction. Each of the one or more second semiconductor nanostructures has a second, different width along the second direction.

A semiconductor device is disclosed. The semiconductor device includes a fin-based structure formed on a substrate. The semiconductor device includes a plurality of first nanosheets, vertically spaced apart from one another, that are formed on the substrate. The semiconductor device includes a first source/drain (S/D) region electrically coupled to a first end of the fin-based structure. The semiconductor device includes a second S/D region electrically coupled to both of a second end of the fin-based structure and a first end of the plurality of first nanosheets. The semiconductor device includes a third S/D region electrically coupled to a second end of the plurality of first nanosheets. The fin-based structure has a first crystal lattice direction and the plurality of first nano sheets have a second crystal lattice direction, which is different from the first crystal lattice direction.

A one time programmable memory device includes a field effect transistor and an antifuse structure. A first node of the antifuse structure includes, or is electrically connected to, the drain region of the field effect transistor. The antifuse structure includes an antifuse dielectric layer and a second node on, or over, the antifuse dielectric layer. One of the first node and the second node includes the drain region or a metal via structure formed within a via cavity extending through an interlayer dielectric material layer that overlies the field effect transistor.

Integrated circuit structures having anti-fuse structures, and methods of fabricating integrated circuit structures having anti-fuse structures, are described. For example, an integrated circuit structure includes a first vertical stack of horizontal nanowires. A first gate structure is over the first vertical stack of horizontal nanowires, the first gate structure including a first gate dielectric and a first gate electrode completely surrounding a channel region of each nanowire of the first vertical stack of horizontal nanowires. The integrated circuit structure also includes a second vertical stack of horizontal nanowires. A second gate structure is over the second vertical stack of horizontal nanowires, the second gate structure including a second gate dielectric and a second gate electrode only partially surrounding a channel region of each nanowire of the second vertical stack of horizontal nanowires.

An anti-fuse device includes a gate insulating film formed on a semiconductor substrate, a gate electrode formed on the gate insulating film, and a salicide layer formed on a first portion of the gate electrode such that a second portion of the gate electrode omits the salicide layer, wherein a hard breakdown of at least a portion of the gate insulating film at a time of programming the anti-fuse device.

Embodiments provide an anti-fuse storage layout and a circuit thereof, and an anti-fuse memory and a design method thereof. The anti-fuse storage layout includes: active regions extending along a first direction and being discretely arranged along a second direction, each of the active regions including at least two memory cell regions arranged along the first direction, each of the at least two memory cell regions including an anti-fuse region and a control region arranged along the first direction, and the control regions of the adjacent memory cell regions being adjacent to each other along the first direction; a word line region extending along the second direction and intersecting with the control region; an electrical connection region extending along the second direction and intersecting with the anti-fuse region; and a programming control region extending along a third direction and being positioned at one side of the corresponding active region.

Embodiments of the present disclosure relate to the field of semiconductor technology, and provide an anti-fuse memory and a control method thereof. The anti-fuse memory is configured to generate a programming pulse signal based on a row strobe signal, a word line of the anti-fuse memory array is configured to receive the row strobe signal, and the anti-fuse memory array is programmed in response to the programming pulse signal. The embodiments of the present disclosure are at least advantageous to improving accuracy of reading data from the anti-fuse memory array and improving yield of the anti-fuse memory.

Device structures for an anti-fuse and methods for manufacturing device structures for an anti-fuse. The anti-fuse includes a first terminal comprised of a fin. The fin includes a section with an edge and inclined surfaces that intersect at the edge. The anti-fuse further includes a second terminal covering the edge and the inclined surfaces of the fin, and an isolation dielectric layer on the inclined surfaces and the edge of the fin. The second terminal is separated from the edge and inclined surfaces of the fin by the isolation dielectric layer. The edge and inclined surfaces on the firm may be formed by oxidizing an upper section of the fin in a trench to form an oxide layer, and then removing the oxide layer to expose the edge and inclined surfaces.