The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method may be performed by forming a memory device over a substrate and forming an inter-level dielectric (ILD) layer over the memory device. The ILD layer is selectively etched to define a first cavity that exposes a top of the memory device and to define a second cavity that is laterally separated from the first cavity by the ILD layer. The second cavity is defined by a smooth sidewall of the ILD layer that extends between upper and lower surfaces of the ILD layer. A conductive material is formed within the first cavity and the second cavity.

A semiconductor memory cell and arrays of memory cells are provided In at least one embodiment, a memory cell includes a substrate having a top surface, the substrate having a first conductivity type selected from a p-type conductivity type and an n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type, the first region being formed in the substrate and exposed at the top surface; a second region having the second conductivity type, the second region being formed in the substrate, spaced apart from the first region and exposed at the top surface; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; a gate positioned between the first and second regions and above the top surface; and a nonvolatile memory configured to store data upon transfer from the body region.

A method for fabricating a vertical memory device includes: forming a memory cell array that includes a vertical thyristor and a word line over a first substrate; forming a peripheral circuit unit in a second substrate; bonding the memory cell array with the peripheral circuit unit; removing the first substrate to expose one side of the vertical thyristor; and forming a bit line that is coupled to the one side of the vertical thyristor and the peripheral circuit unit.

A power amplifier circuit includes a first transistor disposed on a semiconductor substrate; a second transistor that supplies a bias current based on a first current which is a part of a control current to the first transistor; a current output element in which a current flowing therethrough increases in accordance with a rise in temperature; and a wiring portion including a plurality of metal layers that are electrically connected to an emitter of the first transistor and that are stacked one on top of another so as to oppose the semiconductor substrate. At least one metal layer among the plurality of metal layers extends so as to overlap an area extending from at least a part of a first disposition area in which the first transistor is disposed to a second disposition area in which the current output element is disposed in plan view of the semiconductor substrate.

A semiconductor memory device may include a first electrode and a second electrode, which are spaced apart from each other in a first direction, and a first semiconductor pattern, which is in contact with both of the first and second electrodes. The first semiconductor pattern may include first to fourth sub-semiconductor patterns, which are sequentially disposed in the first direction. The first and fourth sub-semiconductor patterns may be in contact with the first and second electrodes, respectively. The first and third sub-semiconductor patterns may be of a first conductivity type, and the second and fourth sub-semiconductor patterns may be of a second conductivity type different from the first conductivity type. Each of the first to fourth sub-semiconductor patterns may include a transition metal and a chalcogen element.

A semiconductor device and a method for manufacturing the semiconductor device are provided. The semiconductor device includes: a substrate: a drain region vertically disposed on the substrate; a body region vertically disposed on the drain region; a source region vertically disposed on the body region; a bit-line connected to the drain region and extending in a first direction; and a word-line connected to the source region and extending in a second direction that is different from the first direction. The drain region, the body region, and the source region together define a pillar extending in a third direction that is perpendicular to the first and second direction.

A semiconductor device includes a substrate, at least one heterojunction bipolar transistor including a semiconductor unit and an electrode unit, an insulation unit, and a heat dissipation unit. The insulation unit covers the substrate and the heterojunction bipolar transistor such that a collector electrode, a base electrode and an emitter electrode of the electrode unit are electrically isolated from one another. The insulation unit is formed with an opening to expose an electrode wire of the emitter electrode. The heat dissipation unit covers the electrode wire and is made of an electrically conductive and heat dissipating material, and has a thickness that is not less than 3 μm.

Structures including electrical isolation and methods of forming a structure including electrical isolation. A semiconductor layer is formed over a semiconductor substrate and shallow trench isolation regions are formed in the semiconductor layer. The semiconductor layer includes single-crystal semiconductor material having an electrical resistivity that is greater than or equal to 1000 ohm-cm. The shallow trench isolation regions are arranged to surround a portion of the semiconductor layer to define an active device region. A polycrystalline layer is positioned in the semiconductor layer and extends laterally beneath the active device region and the shallow trench isolation regions that surround the active device region.

Methods of maintaining a state of a memory cell without interrupting access to the memory cell are provided, including applying a back bias to the cell to offset charge leakage out of a floating body of the cell, wherein a charge level of the floating body indicates a state of the memory cell; and accessing the cell.

Semiconductor memory is provided wherein a memory cell includes a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell. The cell further includes a nonvolatile memory comprising a resistance change element configured to store data stored in the floating body under any one of a plurality of predetermined conditions. A method of operating semiconductor memory to function as volatile memory, while having the ability to retain stored data when power is discontinued to the semiconductor memory is described.