A semiconductor memory cell and arrays of memory cells are provided In at least one embodiment, a memory cell includes a substrate having a top surface, the substrate having a first conductivity type selected from a p-type conductivity type and an n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type, the first region being formed in the substrate and exposed at the top surface; a second region having the second conductivity type, the second region being formed in the substrate, spaced apart from the first region and exposed at the top surface; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; a gate positioned between the first and second regions and above the top surface; and a nonvolatile memory configured to store data upon transfer from the body region.

The present disclosure relates to a semiconductor memory device and a fabricating method thereof, which includes a substrate and a plurality of word lines. The substrate includes a shallow trench isolation and an active structure defined by the shallow trench isolation and the active structure includes a first active area and a second active area. The first active area includes a plurality of active area units being parallel extended along a first direction, and the second active area is disposed outside a periphery of the first active area, to surround all of the active area units. The word lines are disposed in the substrate to intersect the active area units and the shallow trench isolation. The word lines includes first word lines arranged by a first pitch and second word lines arranged by a second pitch, and the second pitch is greater than the first pitch.

Integrated circuit (IC) devices with stacked two-level backend memory, and associated systems and methods, are disclosed. An example IC device includes a front end of line (FEOL) layer, including frontend transistors, and a back end of line (BEOL) layer above the FEOL layer. The BEOL layer includes a first memory layer with memory cells of a first type, and a second memory layer with memory cells of a second type. The first memory layer may be between the FEOL layer and the second memory layer, thus forming stacked backend memory. Stacked backend memory architecture may allow significantly increasing density of memory cells in a memory array having a given footprint area, or, conversely, reducing the footprint area of the memory array with a given memory cell density. Implementing two different types of backend memory may advantageously increase functionality and performance of backend memory.

This spin element includes: a current-carrying part that extends in a first direction; and an element part that is laminated on one surface of the current-carrying part, wherein the current-carrying part includes a first wiring and a second wiring in order from a side of the element part, and wherein both of the first wiring and the second wiring are metals and temperature dependence of resistivity of the first wiring is larger than temperature dependence of resistivity of the second wiring in at least a temperature range of −40° C. to 100° C.

A magnetic recording array includes a plurality of spin elements arranged in a matrix, each spin element including a wiring and a stacked body that includes a first ferromagnetic layer stacked on the wiring, a plurality of write wirings connected to first ends of the respective wirings in the plurality of spin elements, a plurality of read wirings connected to the respective stacked bodies in the plurality of spin elements, and a plurality of common wirings connected to second ends of the wirings in the respective spin elements belonging to the same row, wherein the common wiring has an electrical resistance lower than the electrical resistance of the write wiring or the read wiring.

An information processing device, including a resistive analog neuromorphic device element having a pair of electrodes and an oxide layer provided between the pair of electrodes, and a parallel circuit having a low resistance component and a capacitance component. The parallel circuit and the resistive analog neuromorphic device element are connected in series.

A novel storage device is provided. The storage device includes a first wiring, a second wiring, and a first memory cell. The first memory cell includes a first transistor and a first magnetic tunnel junction device. One of a source or a drain of the first transistor is electrically connected to a first wiring. The other of the source or the drain of the first transistor is electrically connected to one terminal of the first magnetic tunnel junction device. Another terminal of the first magnetic tunnel junction device is electrically connected to the second wiring. The first transistor includes an oxide semiconductor in its channel formation region.

A method includes forming a semiconductor structure. The structure includes a first material, a blocking material, a second material in an amorphous form, and a third material in an amorphous form. The blocking material is disposed between the first material and the second material. At least the second material and the third material each comprise silicon and/or germanium. The structure is exposed to a temperature above a crystallization temperature of the third material and below a crystallization temperature of the second material. Semiconductor structures, memory devices, and systems are also disclosed.

According to one embodiment, a magnetic device includes first and second conductive portions, first and second stacked bodies, and a controller. The first conductive portion includes first to third region. The third region is between the first and second regions. The first stacked body includes first and second magnetic layers. The second magnetic layer is between the third region and the first magnetic layer. The second conductive portion includes fourth to sixth regions. The sixth region is between the fourth and fifth regions. The second stacked body includes third and fourth magnetic layers. The fourth magnetic layer is between the sixth region and the third magnetic layer. The first stacked body is configured to be in a first low or high electrical resistance state. The second stacked body is configured to be in a second low high electrical resistance state.

A switch device includes an output transistor, an overcurrent protection circuit configured to be capable of performing an overcurrent protection operation in which magnitude of target current flowing in the output transistor is limited to a predetermined upper limit current value or less, and a control circuit configured to be capable of controlling a state of the output transistor and capable of changing the upper limit current value among a plurality of current values including a predetermined first current value and a predetermined second current value less than the first current value. The control circuit can limit the magnitude of the target current to the first current value or less in response to the magnitude of the target current reaching the first current value, and then change the upper limit current value to the second current value.