Patent classifications
H01L27/14678
Display device including bending protection and anti-reflection layers
Provided is a display device including a display module, an anti-reflection layer, and a bending protection layer. The display module includes a first area, a second area, and a bending area disposed between the first area and the second area and having a predetermined curvature radius. The bending protection layer includes a first portion overlapping at least the first area and a second portion overlapping at least the bending area. The first portion has a maximum thickness in a range from about 40 μm to about 85 μm, a maximum inclined angle in a range from about 10° to 30°, and an elastic modulus in a range from about 50 MPa to about 300 MPa.
Display device including valley and circuit portions
A display device includes: a substrate including a display area and a non-display area; a circuit portion including a first circuit portion and a second circuit portion on the non-display area; a valley portion separating the first circuit portion and the second circuit portion from each other; and a thin film encapsulation layer sealing the display area, the thin film encapsulation layer extending from the display area to the valley portion, and the first circuit portion is between the valley portion and the display area, the second circuit portion is at an outside of the valley portion, an internal layer on the first circuit portion includes a plurality of island portions that are apart from one another in a first direction and a second direction crossing the first direction, and an external layer on the second circuit portion includes at least one groove extending in the first direction.
DISPLAY MODULE AND DISPLAY DEVICE
A display module and a display device are provided. The display module includes a fingerprint recognition layer including photosensitive sensors, a display panel including a function layer containing fingerprint recognition light sources and imaging apertures, and a cover plate. A vertical distance between a surface of the cover plate at a side away from the functional layer and a corresponding imaging aperture is a first distance h1; a vertical distance between a photosensitive sensor and a corresponding imaging aperture is a second distance h2; along a direction parallel to a plane where the display panel is located, a distance between any two adjacent fingerprint recognition light sources is P1, and a distance between any two adjacent photosensitive sensors is P3;
0.8N<K<1.2N; and N is a positive integer.
DISPLAY DEVICE
A display device includes: a base substrate including an active area, and a nonactive area including a crack dam arrangement area; a plurality of inorganic layers on the base substrate; and an encapsulation layer on the plurality of inorganic layers, and including an encapsulation inorganic layer, and an encapsulation organic layer on the encapsulation inorganic layer. The base substrate includes first substrate portions having a first thickness at the crack dam arrangement area, and a second substrate portion between adjacent ones of the first substrate portions and connected to the first substrate portions, the second substrate portion having a second thickness smaller than the first thickness. The plurality of inorganic layers are laminated to form an inorganic laminated film at the crack dam arrangement area; and the encapsulation inorganic layer is located over the first substrate portions and the second substrate portion, and includes at least one short circuit portion.
Display device including adhesive layer having multiple adhesive layers
A display device includes a display part including a first non-folding area, a second non-folding area, and a folding area between the first non-folding area and the second non-folding area, the folding area being foldable with respect to a folding axis, a window disposed on the display part, and an adhesive layer disposed between the display part and the window, the adhesive layer including a first adhesive material and a second adhesive material having an elongation rate greater than an elongation rate of the first adhesive material. The first adhesive material has a planar area greater than a planar area of the second adhesive material in each of the first non-folding area and the second non-folding area, and the second adhesive material has a planar area greater than a planar area of the first adhesive material in the folding area.
DISPLAY PANEL
A display panel includes a substrate including a first area and a second area that are spaced apart from each other in a first direction; a plurality of display elements located in a display area, the display area being adjacent to the first area and the second area; and a plurality of lines extending in a second direction that intersects the first direction, the plurality of lines being electrically respectively connected to the plurality of display elements, wherein the plurality of lines include: a first line and a second line adjacent to each other and bypassing along an edge of the first area; and a third line and a fourth line adjacent to each other and bypassing along an edge of the second area, wherein the first area and the second area are different from each other in at least one of size or shape.
DISPLAY PANEL AND ELECTRIC APPARATUS INCLUDING THE SAME
A display panel includes the following elements: a substrate including a first base layer, wherein the first base layer includes a transparent polyimide resin; a first pixel circuit and a second pixel circuit over the substrate, spaced from each other with the transmission area between the first pixel circuit and the second pixel circuit, and each including transistors and a storage capacitor; a first display element electrically connected to the first pixel circuit; and a second display element electrically connected to the second pixel circuit.
Electronic device including display and camera
Various embodiments of the disclosure relate to an electronic device including a display and a camera. The electronic device may include a camera overlapping the display and configured to photograph external light passing through the display, wherein the display may include: a colorless and transparent substrate, a pixel layer disposed in a first direction from the substrate and comprising organic light-emitting diode (OLED) type pixels, an organic encapsulation layer (e.g., thin film encapsulation (TFE)) disposed in the first direction from the pixel layer, and a color filter layer disposed in the first direction from the organic encapsulation layer, wherein the display may include: a first area overlapping at least a portion of the camera and a second area not overlapping the camera, wherein an arrangement density of a first group of pixels in the first area may be lower than an arrangement density of a second group of pixels in the second area, and wherein the color filter layer may include first color filters overlapping the pixels of the first group, second color filters overlapping the pixels of the second group, a black matrix disposed between the second color filters in the second area, and a transmission area disposed between the first color filters in the first area.
Biometric verification device
A biometric verification device includes a backlight module, a photodetector, a switching element, and at least one collimation structure. The photodetector is disposed on the backlight module. The switching element is disposed on the backlight module and electrically connected with the photodetector. The at least one collimation structure is disposed on the backlight module and has a first pinhole and a second pinhole. The horizontal projections of the first pinhole and the second pinhole on the backlight module do not overlap with the horizontal projection of the photodetector on the backlight module.
Chip package structure, electronic device and method for preparing a chip package structure
The present application provides a chip package structure and an electronic device, which could reduce a chip package thickness and implement ultra-thinning of chip package. The chip package structure includes a chip, a substrate, a lead and a lead protection adhesive; the lead is configured to electrically connect the chip and the substrate; the lead protection adhesive is configured to support the lead, where a highest point of the lead protection adhesive is not higher than a highest point of an upper edge of the lead.