A composition includes two or more near infrared absorbing compounds having an absorption maximum in a wavelength range of 650 to 1000 nm and having a solubility of 0.1 mass % or lower in water at 23° C., in which the two or more near infrared absorbing compounds include a first near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm, and a second near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm which is shorter than the absorption maximum of the first near infrared absorbing compound, and a difference between the absorption maximum of the first near infrared absorbing compound and the absorption maximum of the second near infrared absorbing compound is 1 to 150 nm.

A solid-state imaging device includes a plurality of pixel cells, each of the pixel cells including a light receiving element, a floating diffusion, a first source follower circuit, and a second source follower circuit. The plurality of pixel cells are connected to an output signal line. The light receiving element photoelectrically converts incident light, and stores a signal charge. The floating diffusion converts the signal charge read out of the light receiving element into a signal voltage. The first source follower circuit is connected to the floating diffusion, and outputs an output voltage corresponding to the signal voltage. The second source follower circuit is connected in series with the first source follower circuit, and outputs a pixel signal corresponding to the output voltage.

A solid-state imaging device includes a pixel region in which shared pixels which share pixel transistors in a plurality of photoelectric conversion portions are two-dimensionally arranged. The shared pixel transistors are divisionally arranged in a column direction of the shared pixels, the pixel transistors shared between neighboring shared pixels are arranged so as to be horizontally reversed or/and vertically crossed, and connection wirings connected to a floating diffusion portion, a source of a reset transistor and a gate of an amplification transistor in the shared pixels are arranged along the column direction.

A solid-state imaging device includes a pixel region in which shared pixels which share pixel transistors in a plurality of photoelectric conversion portions are two-dimensionally arranged. The shared pixel transistors are divisionally arranged in a column direction of the shared pixels, the pixel transistors shared between neighboring shared pixels are arranged so as to be horizontally reversed or/and vertically crossed, and connection wirings connected to a floating diffusion portion, a source of a reset transistor and a gate of an amplification transistor in the shared pixels are arranged along the column direction.

There is provided a pixel circuit including a first circuit and a second circuit. The first circuit is used to output a first voltage associated with exposure intensity. The second circuit is used to output a second voltage associated with exposure time interval. The processor multiples the first voltage to a ratio between a reference voltage and the second voltage to obtain an actual light intensity, wherein the reference voltage is a voltage value outputted by the second circuit of a dummy pixel.

A solid-state imaging device includes an N-type semiconductor layer, an element layer including a photoelectric conversion element and an active element, an interconnect layer providing an interconnect for the active element, and an element isolation trench penetrating the semiconductor layer. The element layer includes a P-type region and an N-type region. A first hole storage layer is formed on a surface of the semiconductor layer on a side opposite to the element layer. A second hole storage layer is formed in contact portions of the semiconductor layer and the element layer with the element isolation trench. The P-type region of the element layer and the first hole storage layer are connected to each other by the second hole storage layer.

An image sensor is provided. The image sensor includes a pixel array including first and second pixels, the first and second pixels receiving the same transfer gate signal and outputting first and second signal voltages, respectively, a transfer gate driver receiving first and second voltages and generating the transfer gate signal, the transfer gate signal having the first voltage as its maximum voltage and having the second voltage as its minimum voltage and a compensation module detecting a variation in the second voltage, generating a compensation voltage based on the variation in the second voltage, and performing a compensation operation.

Provided is a solid-state image pickup element that amplifies the difference between respective signals of a pair of pixels and enables a reduction in the number of wiring lines. The solid-state image pickup element includes an electric-charge accumulation unit, a reference reset transistor, and a readout reset transistor. The electric-charge accumulation unit accumulates electric charge transferred from a photoelectric conversion unit and generates signal voltage corresponding to the amount of the electric charge. The reference reset transistor supplies predetermined reset voltage to the electric-charge accumulation unit in a case of generating predetermined reference voltage. The readout reset transistor supplies voltage different from the reset voltage to the electric-charge accumulation unit in a case of reading out the signal voltage.

A time of flight sensor includes at least one demodulation pixel. Each demodulation pixel includes a semiconductor substrate; a charge generation region in the semiconductor substrate, the charge generation region having a lateral extent, the charge generation region being configured to convert light into charge carriers; a light directing element in the charge generation region of the semiconductor substrate, the light directing element being configured to direct light through at least a portion of the lateral extent of the charge generation region; a collection region in the semiconductor substrate, the collection region being configured to collect the charge carriers generated in at least a portion of the lateral extent of the charge generation region, and a readout component in electrical communication with the collection region, the readout component being operable to control an electrical coupling between the charge generation region and the collection region.

An imaging device according to the present disclosure includes a pixel array part, in which pixels are disposed, the pixel including a photoelectric conversion element, and an analog-digital converter that converts an analog signal outputted from each of the pixels of the pixel array part into a digital signal, the analog-digital converter including a comparator that compares, with a reference signal, the analog signal outputted from each of the pixels of the pixel array part. A transistor constituting the comparator is a transistor that has a three-dimensional structure including a channel parallel to or perpendicular to a direction of a current flow.